JPS61138614A - フエノ−ルノボラツクの製造方法 - Google Patents
フエノ−ルノボラツクの製造方法Info
- Publication number
- JPS61138614A JPS61138614A JP26032284A JP26032284A JPS61138614A JP S61138614 A JPS61138614 A JP S61138614A JP 26032284 A JP26032284 A JP 26032284A JP 26032284 A JP26032284 A JP 26032284A JP S61138614 A JPS61138614 A JP S61138614A
- Authority
- JP
- Japan
- Prior art keywords
- formalin
- bisphenol
- water
- product
- organic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 title claims description 14
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 229920003986 novolac Polymers 0.000 title claims description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 48
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229930185605 Bisphenol Natural products 0.000 claims abstract description 18
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 claims abstract description 10
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 claims abstract description 10
- 150000001875 compounds Chemical class 0.000 claims abstract description 7
- 239000003960 organic solvent Substances 0.000 claims abstract description 7
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 15
- 239000000047 product Substances 0.000 abstract description 21
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 16
- 239000003822 epoxy resin Substances 0.000 abstract description 14
- 229920000647 polyepoxide Polymers 0.000 abstract description 14
- 239000012535 impurity Substances 0.000 abstract description 13
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 abstract description 12
- 239000003795 chemical substances by application Substances 0.000 abstract description 11
- 150000002989 phenols Chemical class 0.000 abstract description 8
- 150000008044 alkali metal hydroxides Chemical class 0.000 abstract description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract description 6
- 239000003054 catalyst Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 235000006408 oxalic acid Nutrition 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 239000007795 chemical reaction product Substances 0.000 abstract 2
- -1 sodium hydroxide Chemical class 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 description 17
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 238000005292 vacuum distillation Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 150000002085 enols Chemical class 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Phenolic Resins Or Amino Resins (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26032284A JPS61138614A (ja) | 1984-12-10 | 1984-12-10 | フエノ−ルノボラツクの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26032284A JPS61138614A (ja) | 1984-12-10 | 1984-12-10 | フエノ−ルノボラツクの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61138614A true JPS61138614A (ja) | 1986-06-26 |
| JPS6350361B2 JPS6350361B2 (enExample) | 1988-10-07 |
Family
ID=17346402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26032284A Granted JPS61138614A (ja) | 1984-12-10 | 1984-12-10 | フエノ−ルノボラツクの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61138614A (enExample) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6215216A (ja) * | 1985-07-12 | 1987-01-23 | Hitachi Chem Co Ltd | ビスフエノ−ルａノボラツク樹脂 |
| JPH05156120A (ja) * | 1991-12-04 | 1993-06-22 | Sumitomo Bakelite Co Ltd | 熱硬化性成形材料 |
| US6746896B1 (en) * | 1999-08-28 | 2004-06-08 | Georgia Tech Research Corp. | Process and material for low-cost flip-chip solder interconnect structures |
| JP2008001882A (ja) * | 2006-06-21 | 2008-01-10 | Chang Chun Plastics Co Ltd | 新規なフェノール・アルデヒド樹脂およびその製造方法ならびにその用途 |
| JP2009185187A (ja) * | 2008-02-07 | 2009-08-20 | Taoka Chem Co Ltd | アルキルフェノール・ホルムアルデヒド共縮合樹脂の製造方法 |
| JP2012062358A (ja) * | 2010-09-14 | 2012-03-29 | Taiyo Holdings Co Ltd | 感光性樹脂、それを含有する硬化性樹脂組成物及びそのドライフィルム並びにそれらを用いたプリント配線板 |
| US11130724B2 (en) * | 2015-12-25 | 2021-09-28 | Mitsubishi Gas Chemical Company, Inc. | Compound, resin, composition, resist pattern formation method, and circuit pattern formation method |
| JP2023521068A (ja) * | 2020-04-24 | 2023-05-23 | エルジー・ケム・リミテッド | 硬化剤、これを含む半導体接着用組成物、半導体接着用フィルムおよびこれを用いた半導体パッケージ |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52112696A (en) * | 1976-03-18 | 1977-09-21 | Mitsubishi Chem Ind Ltd | Preparation of fibers of films of phenolic resins |
| JPS5730716A (en) * | 1980-07-31 | 1982-02-19 | Dainippon Ink & Chem Inc | Treating method of phenolic resin |
-
1984
- 1984-12-10 JP JP26032284A patent/JPS61138614A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52112696A (en) * | 1976-03-18 | 1977-09-21 | Mitsubishi Chem Ind Ltd | Preparation of fibers of films of phenolic resins |
| JPS5730716A (en) * | 1980-07-31 | 1982-02-19 | Dainippon Ink & Chem Inc | Treating method of phenolic resin |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6215216A (ja) * | 1985-07-12 | 1987-01-23 | Hitachi Chem Co Ltd | ビスフエノ−ルａノボラツク樹脂 |
| JPH05156120A (ja) * | 1991-12-04 | 1993-06-22 | Sumitomo Bakelite Co Ltd | 熱硬化性成形材料 |
| US6746896B1 (en) * | 1999-08-28 | 2004-06-08 | Georgia Tech Research Corp. | Process and material for low-cost flip-chip solder interconnect structures |
| JP2008001882A (ja) * | 2006-06-21 | 2008-01-10 | Chang Chun Plastics Co Ltd | 新規なフェノール・アルデヒド樹脂およびその製造方法ならびにその用途 |
| JP2009185187A (ja) * | 2008-02-07 | 2009-08-20 | Taoka Chem Co Ltd | アルキルフェノール・ホルムアルデヒド共縮合樹脂の製造方法 |
| JP2012062358A (ja) * | 2010-09-14 | 2012-03-29 | Taiyo Holdings Co Ltd | 感光性樹脂、それを含有する硬化性樹脂組成物及びそのドライフィルム並びにそれらを用いたプリント配線板 |
| US11130724B2 (en) * | 2015-12-25 | 2021-09-28 | Mitsubishi Gas Chemical Company, Inc. | Compound, resin, composition, resist pattern formation method, and circuit pattern formation method |
| JP2023521068A (ja) * | 2020-04-24 | 2023-05-23 | エルジー・ケム・リミテッド | 硬化剤、これを含む半導体接着用組成物、半導体接着用フィルムおよびこれを用いた半導体パッケージ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6350361B2 (enExample) | 1988-10-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1103575B1 (en) | Epoxy resin composition, prepreg and multilayer printed-wiring board | |
| EP0699670B1 (en) | Aryl ester compound, its production process, epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin composition | |
| JPS61138614A (ja) | フエノ−ルノボラツクの製造方法 | |
| JP3315436B2 (ja) | ビフェノール骨格含有エポキシ樹脂の製造方法 | |
| JPH01126320A (ja) | エポキシ樹脂の脂肪族ハロゲン化物含量を低下させる方法 | |
| JP2002249540A (ja) | リン含有エポキシ樹脂組成物 | |
| US4529790A (en) | Epoxy resin composition | |
| JP2882644B2 (ja) | エポキシ樹脂、二官能価フェノールおよび多官能価フェノールを含む硬化性組成物 | |
| JP2010077344A (ja) | エポキシ樹脂組成物、その硬化物、及びビルドアップフィルム絶縁材料 | |
| CN111116369B (zh) | 一种活性酯化合物及其制备方法 | |
| JPS61168617A (ja) | 高純度臭素化エポキシ樹脂の製造法 | |
| GB2212157A (en) | Glycidyl ethers of phenolic compounds and epoxy resins derived therefrom | |
| TWI709581B (zh) | 經取代之烯丙基醚樹脂、甲基烯丙基醚樹脂、環氧樹脂、環氧樹脂組成物及其硬化物 | |
| JP2732162B2 (ja) | 高純度エポキシ樹脂の製造法 | |
| JP5127160B2 (ja) | エポキシ樹脂、硬化性樹脂組成物、およびその硬化物 | |
| JP2865439B2 (ja) | エポキシ樹脂及びその硬化物 | |
| JP3231808B2 (ja) | 電気積層板用エポキシ樹脂組成物 | |
| JP3939000B2 (ja) | ノボラック型樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 | |
| JP4229509B2 (ja) | ガラス繊維用表面処理剤 | |
| JPH0221404B2 (enExample) | ||
| JP2823056B2 (ja) | エポキシ樹脂組成物及びその硬化物 | |
| JP2736560B2 (ja) | フェノール類ノボラックエポキシ樹脂及びその硬化物 | |
| JPH0238123B2 (ja) | Ehokishijushisoseibutsu | |
| JP3118494B2 (ja) | エポキシ樹脂用硬化剤及びエポキシ樹脂組成物 | |
| JPS588698B2 (ja) | 反応型難燃性可塑剤の製造方法 |