JPS6111469B2 - - Google Patents
Info
- Publication number
- JPS6111469B2 JPS6111469B2 JP12224778A JP12224778A JPS6111469B2 JP S6111469 B2 JPS6111469 B2 JP S6111469B2 JP 12224778 A JP12224778 A JP 12224778A JP 12224778 A JP12224778 A JP 12224778A JP S6111469 B2 JPS6111469 B2 JP S6111469B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- heat
- cavity
- present
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 238000009423 ventilation Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12224778A JPS5548951A (en) | 1978-10-03 | 1978-10-03 | Ic package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12224778A JPS5548951A (en) | 1978-10-03 | 1978-10-03 | Ic package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5548951A JPS5548951A (en) | 1980-04-08 |
| JPS6111469B2 true JPS6111469B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1986-04-03 |
Family
ID=14831228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12224778A Granted JPS5548951A (en) | 1978-10-03 | 1978-10-03 | Ic package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5548951A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60207770A (ja) * | 1984-03-30 | 1985-10-19 | Sumitomo Metal Ind Ltd | 圧延機スタンド内ロ−ル研削方法 |
| US4684975A (en) * | 1985-12-16 | 1987-08-04 | National Semiconductor Corporation | Molded semiconductor package having improved heat dissipation |
| JPS62168253U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1986-04-15 | 1987-10-26 | ||
| JP2838207B2 (ja) * | 1988-01-08 | 1998-12-16 | 株式会社ニッテク | 採血管の移送装置 |
| US5168671A (en) * | 1989-05-30 | 1992-12-08 | Fuji Seiki Machine Works, Ltd. | Dressing method and apparatus for super abrasive grinding wheel |
-
1978
- 1978-10-03 JP JP12224778A patent/JPS5548951A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5548951A (en) | 1980-04-08 |