JPS5548951A - Ic package - Google Patents

Ic package

Info

Publication number
JPS5548951A
JPS5548951A JP12224778A JP12224778A JPS5548951A JP S5548951 A JPS5548951 A JP S5548951A JP 12224778 A JP12224778 A JP 12224778A JP 12224778 A JP12224778 A JP 12224778A JP S5548951 A JPS5548951 A JP S5548951A
Authority
JP
Japan
Prior art keywords
heat
discharge
package
chip
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12224778A
Other languages
Japanese (ja)
Other versions
JPS6111469B2 (en
Inventor
Kiyoshi Hayamizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12224778A priority Critical patent/JPS5548951A/en
Publication of JPS5548951A publication Critical patent/JPS5548951A/en
Publication of JPS6111469B2 publication Critical patent/JPS6111469B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To increase heat-discharge efficiency without lowering packaging efficiency, by providing hollows on a cover which covers a package enclosing a semiconductor chip, and establishing heat-discharge plates in situ.
CONSTITUTION: IC chip 4 is fixed in the center of base 1 of a package having many package pins 2 on the outside of both ends. Cover 7 is placed on this and covers the entire structure. In this structure, cover 7 is made of epoxy resin, hollows 3 are provided on both sides of chip 4. Heat-discharge plates 5 are provided inside. Metal plates 6 are placed between chip 4 and each heat-discharge plate 5. By this, it is possible to discharge heat produced in package 1 efficiently. Thus heat-discharge efficiency is increased without lowering packaging efficiency.
COPYRIGHT: (C)1980,JPO&Japio
JP12224778A 1978-10-03 1978-10-03 Ic package Granted JPS5548951A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12224778A JPS5548951A (en) 1978-10-03 1978-10-03 Ic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12224778A JPS5548951A (en) 1978-10-03 1978-10-03 Ic package

Publications (2)

Publication Number Publication Date
JPS5548951A true JPS5548951A (en) 1980-04-08
JPS6111469B2 JPS6111469B2 (en) 1986-04-03

Family

ID=14831228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12224778A Granted JPS5548951A (en) 1978-10-03 1978-10-03 Ic package

Country Status (1)

Country Link
JP (1) JPS5548951A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60207770A (en) * 1984-03-30 1985-10-19 Sumitomo Metal Ind Ltd Grinding of roll in rolling mill stand
US4684975A (en) * 1985-12-16 1987-08-04 National Semiconductor Corporation Molded semiconductor package having improved heat dissipation
JPS62168253U (en) * 1986-04-15 1987-10-26
JPH01177972A (en) * 1988-01-08 1989-07-14 Electric Power Dev Co Ltd Abrasive material supply device for liquid jet machining device
US5168671A (en) * 1989-05-30 1992-12-08 Fuji Seiki Machine Works, Ltd. Dressing method and apparatus for super abrasive grinding wheel

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60207770A (en) * 1984-03-30 1985-10-19 Sumitomo Metal Ind Ltd Grinding of roll in rolling mill stand
US4684975A (en) * 1985-12-16 1987-08-04 National Semiconductor Corporation Molded semiconductor package having improved heat dissipation
JPS62168253U (en) * 1986-04-15 1987-10-26
JPH01177972A (en) * 1988-01-08 1989-07-14 Electric Power Dev Co Ltd Abrasive material supply device for liquid jet machining device
US5168671A (en) * 1989-05-30 1992-12-08 Fuji Seiki Machine Works, Ltd. Dressing method and apparatus for super abrasive grinding wheel

Also Published As

Publication number Publication date
JPS6111469B2 (en) 1986-04-03

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