JPS6095944A - プラグインパツケ−ジとその製造方法 - Google Patents
プラグインパツケ−ジとその製造方法Info
- Publication number
- JPS6095944A JPS6095944A JP20426283A JP20426283A JPS6095944A JP S6095944 A JPS6095944 A JP S6095944A JP 20426283 A JP20426283 A JP 20426283A JP 20426283 A JP20426283 A JP 20426283A JP S6095944 A JPS6095944 A JP S6095944A
- Authority
- JP
- Japan
- Prior art keywords
- plug
- substrate
- package
- board
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 229910000679 solder Inorganic materials 0.000 claims abstract description 38
- 239000011347 resin Substances 0.000 claims abstract description 33
- 229920005989 resin Polymers 0.000 claims abstract description 33
- 239000004065 semiconductor Substances 0.000 claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000011889 copper foil Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 14
- 238000007747 plating Methods 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 9
- 229910052718 tin Inorganic materials 0.000 claims abstract description 3
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 238000007789 sealing Methods 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 238000005304 joining Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 238000005553 drilling Methods 0.000 claims description 2
- 238000007664 blowing Methods 0.000 claims 1
- 238000004140 cleaning Methods 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 claims 1
- 230000004720 fertilization Effects 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 abstract description 8
- 239000011521 glass Substances 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 230000035939 shock Effects 0.000 abstract description 2
- 229910002555 FeNi Inorganic materials 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910052745 lead Inorganic materials 0.000 abstract 1
- 125000000962 organic group Chemical group 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 13
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 239000004033 plastic Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20426283A JPS6095944A (ja) | 1983-10-31 | 1983-10-31 | プラグインパツケ−ジとその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20426283A JPS6095944A (ja) | 1983-10-31 | 1983-10-31 | プラグインパツケ−ジとその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6095944A true JPS6095944A (ja) | 1985-05-29 |
| JPH0582060B2 JPH0582060B2 (tr) | 1993-11-17 |
Family
ID=16487546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20426283A Granted JPS6095944A (ja) | 1983-10-31 | 1983-10-31 | プラグインパツケ−ジとその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6095944A (tr) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62257755A (ja) * | 1986-04-30 | 1987-11-10 | Ibiden Co Ltd | 半導体搭載用基板 |
| JPS62257754A (ja) * | 1986-04-30 | 1987-11-10 | Ibiden Co Ltd | 半導体搭載用基板 |
| JPS62283651A (ja) * | 1986-05-31 | 1987-12-09 | Ibiden Co Ltd | 半導体搭載基板用の導体ピン及びその製造方法 |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4875566U (tr) * | 1971-12-20 | 1973-09-19 | ||
| JPS4923624A (tr) * | 1972-06-22 | 1974-03-02 | ||
| JPS5088556A (tr) * | 1973-12-11 | 1975-07-16 | ||
| JPS5489273U (tr) * | 1977-12-08 | 1979-06-23 | ||
| JPS5517472U (tr) * | 1978-07-20 | 1980-02-04 | ||
| JPS55103751A (en) * | 1979-01-31 | 1980-08-08 | Nec Corp | Semiconductor device |
| JPS5612361A (en) * | 1979-07-12 | 1981-02-06 | Mitsui Toatsu Chem Inc | Isopropylamine derivative and its preparation |
| JPS5784750U (tr) * | 1980-11-14 | 1982-05-25 | ||
| JPS57162454A (en) * | 1981-03-31 | 1982-10-06 | Hitachi Ltd | Equipment of terminal of hybrid module |
| JPS5810840A (ja) * | 1981-07-10 | 1983-01-21 | Fujitsu Ltd | 半導体装置 |
| JPS5810848A (ja) * | 1981-07-14 | 1983-01-21 | Toshiba Corp | 混成集積回路用リ−ドピン |
| JPS58159355A (ja) * | 1982-03-17 | 1983-09-21 | Nec Corp | 半導体装置の製造方法 |
-
1983
- 1983-10-31 JP JP20426283A patent/JPS6095944A/ja active Granted
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4875566U (tr) * | 1971-12-20 | 1973-09-19 | ||
| JPS4923624A (tr) * | 1972-06-22 | 1974-03-02 | ||
| JPS5088556A (tr) * | 1973-12-11 | 1975-07-16 | ||
| JPS5489273U (tr) * | 1977-12-08 | 1979-06-23 | ||
| JPS5517472U (tr) * | 1978-07-20 | 1980-02-04 | ||
| JPS55103751A (en) * | 1979-01-31 | 1980-08-08 | Nec Corp | Semiconductor device |
| JPS5612361A (en) * | 1979-07-12 | 1981-02-06 | Mitsui Toatsu Chem Inc | Isopropylamine derivative and its preparation |
| JPS5784750U (tr) * | 1980-11-14 | 1982-05-25 | ||
| JPS57162454A (en) * | 1981-03-31 | 1982-10-06 | Hitachi Ltd | Equipment of terminal of hybrid module |
| JPS5810840A (ja) * | 1981-07-10 | 1983-01-21 | Fujitsu Ltd | 半導体装置 |
| JPS5810848A (ja) * | 1981-07-14 | 1983-01-21 | Toshiba Corp | 混成集積回路用リ−ドピン |
| JPS58159355A (ja) * | 1982-03-17 | 1983-09-21 | Nec Corp | 半導体装置の製造方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62257755A (ja) * | 1986-04-30 | 1987-11-10 | Ibiden Co Ltd | 半導体搭載用基板 |
| JPS62257754A (ja) * | 1986-04-30 | 1987-11-10 | Ibiden Co Ltd | 半導体搭載用基板 |
| JPS62283651A (ja) * | 1986-05-31 | 1987-12-09 | Ibiden Co Ltd | 半導体搭載基板用の導体ピン及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0582060B2 (tr) | 1993-11-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3541491B2 (ja) | 電子部品 | |
| JP3619395B2 (ja) | 半導体素子内蔵配線基板およびその製造方法 | |
| US20100003788A1 (en) | Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routing | |
| KR20010066939A (ko) | 반도체 장치 및 그 제조 방법 | |
| US6329228B1 (en) | Semiconductor device and method of fabricating the same | |
| JPH09199635A (ja) | 回路基板形成用多層フィルム並びにこれを用いた多層回路基板および半導体装置用パッケージ | |
| JP3391282B2 (ja) | 電子部品の製造方法 | |
| JP3617072B2 (ja) | チップキャリア | |
| JPS6095944A (ja) | プラグインパツケ−ジとその製造方法 | |
| JP2005019937A (ja) | 高密度チップスケールパッケージ | |
| JP2004039988A (ja) | 素子搭載用回路基板及び電子装置 | |
| JP2936540B2 (ja) | 回路基板及びその製造方法とこれを用いた半導体パッケージの製造方法 | |
| JPH0846084A (ja) | 表面実装型半導体パッケージ及びその製造方法並びに半導体装置 | |
| JP3684517B2 (ja) | 半導体装置 | |
| JP3398580B2 (ja) | 半導体装置の製造方法及び基板フレーム | |
| JP2000216282A (ja) | エリアアレイ電極型デバイス、それを実装する配線基板構造、及び回路基板実装体、並びにその実装方法 | |
| JP2614495B2 (ja) | 電子部品搭載用基板 | |
| JPS6095943A (ja) | プラグインパツケ−ジとその製造方法 | |
| JPH0558262B2 (tr) | ||
| JP2003282771A (ja) | 放熱板付き配線基板 | |
| JP2000223613A (ja) | 半導体装置 | |
| JP4353267B2 (ja) | 電子部品の製造方法 | |
| JP2675077B2 (ja) | 半導体装置用リードフレーム | |
| JP4375427B2 (ja) | 電子部品およびその製造方法 | |
| JP2000138316A (ja) | 半導体装置及びその製造方法 |