JPS6072253A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS6072253A
JPS6072253A JP58178164A JP17816483A JPS6072253A JP S6072253 A JPS6072253 A JP S6072253A JP 58178164 A JP58178164 A JP 58178164A JP 17816483 A JP17816483 A JP 17816483A JP S6072253 A JPS6072253 A JP S6072253A
Authority
JP
Japan
Prior art keywords
layer
electrode
etching
junction
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58178164A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0330986B2 (enExample
Inventor
Yasushi Matsumi
松見　康司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP58178164A priority Critical patent/JPS6072253A/ja
Publication of JPS6072253A publication Critical patent/JPS6072253A/ja
Publication of JPH0330986B2 publication Critical patent/JPH0330986B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W72/9226—
    • H10W72/923—
    • H10W72/934—
    • H10W72/983—

Landscapes

  • Weting (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP58178164A 1983-09-28 1983-09-28 半導体装置の製造方法 Granted JPS6072253A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58178164A JPS6072253A (ja) 1983-09-28 1983-09-28 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58178164A JPS6072253A (ja) 1983-09-28 1983-09-28 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6072253A true JPS6072253A (ja) 1985-04-24
JPH0330986B2 JPH0330986B2 (enExample) 1991-05-01

Family

ID=16043736

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58178164A Granted JPS6072253A (ja) 1983-09-28 1983-09-28 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6072253A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6362337A (ja) * 1986-09-03 1988-03-18 Nec Corp 半導体装置
JP2000031279A (ja) * 1998-05-30 2000-01-28 Robert Bosch Gmbh 導体路の接触接続装置および接触接続方法
US6274404B1 (en) 1998-09-25 2001-08-14 Nec Corporation Multilayered wiring structure and method of manufacturing the same
JP2012253058A (ja) * 2011-05-31 2012-12-20 Mitsubishi Electric Corp 半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619639A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Semiconductor device
JPS57207354A (en) * 1981-06-15 1982-12-20 Toshiba Corp Manufacture of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619639A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Semiconductor device
JPS57207354A (en) * 1981-06-15 1982-12-20 Toshiba Corp Manufacture of semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6362337A (ja) * 1986-09-03 1988-03-18 Nec Corp 半導体装置
JP2000031279A (ja) * 1998-05-30 2000-01-28 Robert Bosch Gmbh 導体路の接触接続装置および接触接続方法
US6274404B1 (en) 1998-09-25 2001-08-14 Nec Corporation Multilayered wiring structure and method of manufacturing the same
JP2012253058A (ja) * 2011-05-31 2012-12-20 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
JPH0330986B2 (enExample) 1991-05-01

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