JPS6035249Y2 - 半導体装置用回路基板 - Google Patents
半導体装置用回路基板Info
- Publication number
- JPS6035249Y2 JPS6035249Y2 JP1980170660U JP17066080U JPS6035249Y2 JP S6035249 Y2 JPS6035249 Y2 JP S6035249Y2 JP 1980170660 U JP1980170660 U JP 1980170660U JP 17066080 U JP17066080 U JP 17066080U JP S6035249 Y2 JPS6035249 Y2 JP S6035249Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- pattern
- circuit board
- alignment pattern
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980170660U JPS6035249Y2 (ja) | 1980-11-27 | 1980-11-27 | 半導体装置用回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980170660U JPS6035249Y2 (ja) | 1980-11-27 | 1980-11-27 | 半導体装置用回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5793148U JPS5793148U (enrdf_load_stackoverflow) | 1982-06-08 |
| JPS6035249Y2 true JPS6035249Y2 (ja) | 1985-10-19 |
Family
ID=29529087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980170660U Expired JPS6035249Y2 (ja) | 1980-11-27 | 1980-11-27 | 半導体装置用回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6035249Y2 (enrdf_load_stackoverflow) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5339235B2 (enrdf_load_stackoverflow) * | 1974-02-06 | 1978-10-20 | ||
| JPS5237768A (en) * | 1975-09-19 | 1977-03-23 | Seiko Instr & Electronics Ltd | Substrate having positioning marks |
| JPS5847704Y2 (ja) * | 1978-04-10 | 1983-10-31 | 日本電気株式会社 | 半導体装置用容器 |
-
1980
- 1980-11-27 JP JP1980170660U patent/JPS6035249Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5793148U (enrdf_load_stackoverflow) | 1982-06-08 |
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