JPS60257592A - 多層プリント配線板 - Google Patents
多層プリント配線板Info
- Publication number
- JPS60257592A JPS60257592A JP11526384A JP11526384A JPS60257592A JP S60257592 A JPS60257592 A JP S60257592A JP 11526384 A JP11526384 A JP 11526384A JP 11526384 A JP11526384 A JP 11526384A JP S60257592 A JPS60257592 A JP S60257592A
- Authority
- JP
- Japan
- Prior art keywords
- fluororesin
- multilayer printed
- layer material
- inner layer
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 23
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000010410 layer Substances 0.000 description 23
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920006361 Polyflon Polymers 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- -1 tetrafluoroethylene ethylene Chemical compound 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11526384A JPS60257592A (ja) | 1984-06-04 | 1984-06-04 | 多層プリント配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11526384A JPS60257592A (ja) | 1984-06-04 | 1984-06-04 | 多層プリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60257592A true JPS60257592A (ja) | 1985-12-19 |
| JPH0354875B2 JPH0354875B2 (enrdf_load_stackoverflow) | 1991-08-21 |
Family
ID=14658338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11526384A Granted JPS60257592A (ja) | 1984-06-04 | 1984-06-04 | 多層プリント配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60257592A (enrdf_load_stackoverflow) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62285498A (ja) * | 1986-06-03 | 1987-12-11 | 松下電工株式会社 | 多層プリント配線基板 |
| JPS62295495A (ja) * | 1986-06-14 | 1987-12-22 | 松下電工株式会社 | 多層プリント配線板 |
| JPH03283492A (ja) * | 1990-03-30 | 1991-12-13 | Hitachi Ltd | 多層プリント回路板およびその製造方法 |
| JPH06344503A (ja) * | 1993-06-03 | 1994-12-20 | Nippon Pillar Packing Co Ltd | 積層板の製造方法および積層板用複合フィルム |
| US8995146B2 (en) | 2010-02-23 | 2015-03-31 | Semblant Limited | Electrical assembly and method |
| US9055700B2 (en) | 2008-08-18 | 2015-06-09 | Semblant Limited | Apparatus with a multi-layer coating and method of forming the same |
| US9648720B2 (en) | 2007-02-19 | 2017-05-09 | Semblant Global Limited | Method for manufacturing printed circuit boards |
| US11786930B2 (en) | 2016-12-13 | 2023-10-17 | Hzo, Inc. | Protective coating |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5745997A (en) * | 1980-09-02 | 1982-03-16 | Matsushita Electric Works Ltd | Multilayer printed circuit board |
| JPS57150567A (en) * | 1981-03-13 | 1982-09-17 | Hitachi Cable | Copper lined laminated board |
| JPS5846691A (ja) * | 1981-09-14 | 1983-03-18 | 東レ株式会社 | 高周波用電気回路基板およびその製造法 |
-
1984
- 1984-06-04 JP JP11526384A patent/JPS60257592A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5745997A (en) * | 1980-09-02 | 1982-03-16 | Matsushita Electric Works Ltd | Multilayer printed circuit board |
| JPS57150567A (en) * | 1981-03-13 | 1982-09-17 | Hitachi Cable | Copper lined laminated board |
| JPS5846691A (ja) * | 1981-09-14 | 1983-03-18 | 東レ株式会社 | 高周波用電気回路基板およびその製造法 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62285498A (ja) * | 1986-06-03 | 1987-12-11 | 松下電工株式会社 | 多層プリント配線基板 |
| JPS62295495A (ja) * | 1986-06-14 | 1987-12-22 | 松下電工株式会社 | 多層プリント配線板 |
| JPH03283492A (ja) * | 1990-03-30 | 1991-12-13 | Hitachi Ltd | 多層プリント回路板およびその製造方法 |
| JPH06344503A (ja) * | 1993-06-03 | 1994-12-20 | Nippon Pillar Packing Co Ltd | 積層板の製造方法および積層板用複合フィルム |
| US9648720B2 (en) | 2007-02-19 | 2017-05-09 | Semblant Global Limited | Method for manufacturing printed circuit boards |
| US9055700B2 (en) | 2008-08-18 | 2015-06-09 | Semblant Limited | Apparatus with a multi-layer coating and method of forming the same |
| US8995146B2 (en) | 2010-02-23 | 2015-03-31 | Semblant Limited | Electrical assembly and method |
| US11786930B2 (en) | 2016-12-13 | 2023-10-17 | Hzo, Inc. | Protective coating |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0354875B2 (enrdf_load_stackoverflow) | 1991-08-21 |
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