JPS60211897A - 多層配線基板 - Google Patents

多層配線基板

Info

Publication number
JPS60211897A
JPS60211897A JP6801084A JP6801084A JPS60211897A JP S60211897 A JPS60211897 A JP S60211897A JP 6801084 A JP6801084 A JP 6801084A JP 6801084 A JP6801084 A JP 6801084A JP S60211897 A JPS60211897 A JP S60211897A
Authority
JP
Japan
Prior art keywords
wiring
thin film
ground
ceramic
multilayer wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6801084A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0137879B2 (OSRAM
Inventor
龍雄 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP6801084A priority Critical patent/JPS60211897A/ja
Publication of JPS60211897A publication Critical patent/JPS60211897A/ja
Publication of JPH0137879B2 publication Critical patent/JPH0137879B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP6801084A 1984-04-05 1984-04-05 多層配線基板 Granted JPS60211897A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6801084A JPS60211897A (ja) 1984-04-05 1984-04-05 多層配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6801084A JPS60211897A (ja) 1984-04-05 1984-04-05 多層配線基板

Publications (2)

Publication Number Publication Date
JPS60211897A true JPS60211897A (ja) 1985-10-24
JPH0137879B2 JPH0137879B2 (OSRAM) 1989-08-09

Family

ID=13361448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6801084A Granted JPS60211897A (ja) 1984-04-05 1984-04-05 多層配線基板

Country Status (1)

Country Link
JP (1) JPS60211897A (OSRAM)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03215995A (ja) * 1990-01-10 1991-09-20 Internatl Business Mach Corp <Ibm> 多層配線モジュール
JPH03102766U (OSRAM) * 1990-02-08 1991-10-25
JPH04127598A (ja) * 1990-09-19 1992-04-28 Nec Corp 多層配線基板
JPH04132295A (ja) * 1990-09-21 1992-05-06 Nec Corp 多層配線基板
JPH04252095A (ja) * 1991-01-28 1992-09-08 Fujitsu Ltd セラミックプリント配線板
JPH0685106A (ja) * 1992-03-06 1994-03-25 Internatl Business Mach Corp <Ibm> ハイブリッド半導体モジュール
EP1137333A4 (en) * 1998-09-17 2004-03-24 Ibiden Co Ltd MULTILAYER ACCUMULATION WIRING PANEL
US20160163611A1 (en) * 2014-12-03 2016-06-09 International Business Machines Corporation Laminate substrates having radial cut metallic planes

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56160100A (en) * 1980-05-13 1981-12-09 Nippon Electric Co Multilayer thick film circuit board
JPS5957976A (ja) * 1982-09-27 1984-04-03 日本特殊陶業株式会社 金属膜積層セラミツクス
JPS6437879A (en) * 1987-07-17 1989-02-08 Suisse Electronique Microtech Ionized particle detector

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56160100A (en) * 1980-05-13 1981-12-09 Nippon Electric Co Multilayer thick film circuit board
JPS5957976A (ja) * 1982-09-27 1984-04-03 日本特殊陶業株式会社 金属膜積層セラミツクス
JPS6437879A (en) * 1987-07-17 1989-02-08 Suisse Electronique Microtech Ionized particle detector

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03215995A (ja) * 1990-01-10 1991-09-20 Internatl Business Mach Corp <Ibm> 多層配線モジュール
JPH03102766U (OSRAM) * 1990-02-08 1991-10-25
JPH04127598A (ja) * 1990-09-19 1992-04-28 Nec Corp 多層配線基板
JPH04132295A (ja) * 1990-09-21 1992-05-06 Nec Corp 多層配線基板
JPH04252095A (ja) * 1991-01-28 1992-09-08 Fujitsu Ltd セラミックプリント配線板
JPH0685106A (ja) * 1992-03-06 1994-03-25 Internatl Business Mach Corp <Ibm> ハイブリッド半導体モジュール
EP1137333A4 (en) * 1998-09-17 2004-03-24 Ibiden Co Ltd MULTILAYER ACCUMULATION WIRING PANEL
EP1868423A1 (en) * 1998-09-17 2007-12-19 Ibiden Co., Ltd. Multilayer build-up wiring board
US7514779B2 (en) 1998-09-17 2009-04-07 Ibiden Co., Ltd. Multilayer build-up wiring board
US7847318B2 (en) 1998-09-17 2010-12-07 Ibiden Co., Ltd. Multilayer build-up wiring board including a chip mount region
US20160163611A1 (en) * 2014-12-03 2016-06-09 International Business Machines Corporation Laminate substrates having radial cut metallic planes
US9818682B2 (en) * 2014-12-03 2017-11-14 International Business Machines Corporation Laminate substrates having radial cut metallic planes

Also Published As

Publication number Publication date
JPH0137879B2 (OSRAM) 1989-08-09

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term