JPS60206143A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS60206143A
JPS60206143A JP59060997A JP6099784A JPS60206143A JP S60206143 A JPS60206143 A JP S60206143A JP 59060997 A JP59060997 A JP 59060997A JP 6099784 A JP6099784 A JP 6099784A JP S60206143 A JPS60206143 A JP S60206143A
Authority
JP
Japan
Prior art keywords
semiconductor element
lead
finger
film carrier
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59060997A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0462458B2 (enExample
Inventor
Minoru Hirai
平井　稔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59060997A priority Critical patent/JPS60206143A/ja
Publication of JPS60206143A publication Critical patent/JPS60206143A/ja
Publication of JPH0462458B2 publication Critical patent/JPH0462458B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP59060997A 1984-03-30 1984-03-30 半導体装置の製造方法 Granted JPS60206143A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59060997A JPS60206143A (ja) 1984-03-30 1984-03-30 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59060997A JPS60206143A (ja) 1984-03-30 1984-03-30 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS60206143A true JPS60206143A (ja) 1985-10-17
JPH0462458B2 JPH0462458B2 (enExample) 1992-10-06

Family

ID=13158576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59060997A Granted JPS60206143A (ja) 1984-03-30 1984-03-30 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS60206143A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04343239A (ja) * 1991-05-20 1992-11-30 Fujitsu Ltd ボンディングツール

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5449069A (en) * 1977-09-27 1979-04-18 Nec Corp Method and device for lead correction

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5449069A (en) * 1977-09-27 1979-04-18 Nec Corp Method and device for lead correction

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04343239A (ja) * 1991-05-20 1992-11-30 Fujitsu Ltd ボンディングツール

Also Published As

Publication number Publication date
JPH0462458B2 (enExample) 1992-10-06

Similar Documents

Publication Publication Date Title
JP3197788B2 (ja) 半導体装置の製造方法
JP2547895B2 (ja) 半導体装置の実装方法
JPS60206143A (ja) 半導体装置の製造方法
JPH0121620B2 (enExample)
JP2001313301A (ja) ボンディング方法
JPS618938A (ja) 半導体素子の製造方法
US4099660A (en) Apparatus for and method of shaping interconnect leads
US5649981A (en) Tool and fixture for the removal of tab leads bonded to semiconductor die pads
JPS62132331A (ja) 半導体装置の製造方法
JP2821777B2 (ja) フリップチップ用ｉｃ及びその製造方法
JPH0582596A (ja) リードフレーム
JPH07211758A (ja) 半導体装置の製造方法
JP2961825B2 (ja) 液晶装置の製造方法
JP3365879B2 (ja) 半導体装置の製造方法
JPH11163027A (ja) 二工程ワイヤ接合プロセス
TWI299400B (en) Method of bump test
JP3618268B2 (ja) 半導体装置の製造方法
JP2506848B2 (ja) 半導体装置の検査方法
JPS5948544B2 (ja) 半導体装置の製造方法
JPH0731542Y2 (ja) ボンディングツール
JPH11251512A (ja) 半導体チップの積層方法およびこれを用いた半導体装置
JPH06216191A (ja) フリップチップボンディング方法
JP2000195829A (ja) 半導体装置の製造方法及びダイシング方法
JPH05198615A (ja) 半導体装置の製造方法
JPS62132350A (ja) 金バンプ形成法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term