JPS601838A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS601838A
JPS601838A JP58109529A JP10952983A JPS601838A JP S601838 A JPS601838 A JP S601838A JP 58109529 A JP58109529 A JP 58109529A JP 10952983 A JP10952983 A JP 10952983A JP S601838 A JPS601838 A JP S601838A
Authority
JP
Japan
Prior art keywords
semiconductor element
conductive lead
projecting
base film
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58109529A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0469425B2 (cs
Inventor
Izumi Okamoto
岡本　泉
Masayoshi Mihata
御幡　正芳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58109529A priority Critical patent/JPS601838A/ja
Publication of JPS601838A publication Critical patent/JPS601838A/ja
Publication of JPH0469425B2 publication Critical patent/JPH0469425B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
JP58109529A 1983-06-17 1983-06-17 半導体装置 Granted JPS601838A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58109529A JPS601838A (ja) 1983-06-17 1983-06-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58109529A JPS601838A (ja) 1983-06-17 1983-06-17 半導体装置

Publications (2)

Publication Number Publication Date
JPS601838A true JPS601838A (ja) 1985-01-08
JPH0469425B2 JPH0469425B2 (cs) 1992-11-06

Family

ID=14512563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58109529A Granted JPS601838A (ja) 1983-06-17 1983-06-17 半導体装置

Country Status (1)

Country Link
JP (1) JPS601838A (cs)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61195056U (cs) * 1985-05-25 1986-12-04
US4684975A (en) * 1985-12-16 1987-08-04 National Semiconductor Corporation Molded semiconductor package having improved heat dissipation
JPS6435925A (en) * 1987-07-30 1989-02-07 Mitsubishi Electric Corp Integrated circuit element
JPH02161738A (ja) * 1988-12-15 1990-06-21 Hitachi Cable Ltd Ｔａｂ用テープキャリア
US4989318A (en) * 1988-06-09 1991-02-05 Oki Electric Industry Co., Ltd. Process of assembling terminal structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5512791A (en) * 1978-07-14 1980-01-29 Nec Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5512791A (en) * 1978-07-14 1980-01-29 Nec Corp Semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61195056U (cs) * 1985-05-25 1986-12-04
US4684975A (en) * 1985-12-16 1987-08-04 National Semiconductor Corporation Molded semiconductor package having improved heat dissipation
JPS6435925A (en) * 1987-07-30 1989-02-07 Mitsubishi Electric Corp Integrated circuit element
US4989318A (en) * 1988-06-09 1991-02-05 Oki Electric Industry Co., Ltd. Process of assembling terminal structure
JPH02161738A (ja) * 1988-12-15 1990-06-21 Hitachi Cable Ltd Ｔａｂ用テープキャリア

Also Published As

Publication number Publication date
JPH0469425B2 (cs) 1992-11-06

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