JPS60142537A - 集積回路装置の製造方法 - Google Patents

集積回路装置の製造方法

Info

Publication number
JPS60142537A
JPS60142537A JP58246505A JP24650583A JPS60142537A JP S60142537 A JPS60142537 A JP S60142537A JP 58246505 A JP58246505 A JP 58246505A JP 24650583 A JP24650583 A JP 24650583A JP S60142537 A JPS60142537 A JP S60142537A
Authority
JP
Japan
Prior art keywords
resistance
electrode
resistor
circuit
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58246505A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0518264B2 (enExample
Inventor
Yusuke Mizuguchi
裕介 水口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP58246505A priority Critical patent/JPS60142537A/ja
Publication of JPS60142537A publication Critical patent/JPS60142537A/ja
Publication of JPH0518264B2 publication Critical patent/JPH0518264B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP58246505A 1983-12-29 1983-12-29 集積回路装置の製造方法 Granted JPS60142537A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58246505A JPS60142537A (ja) 1983-12-29 1983-12-29 集積回路装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58246505A JPS60142537A (ja) 1983-12-29 1983-12-29 集積回路装置の製造方法

Publications (2)

Publication Number Publication Date
JPS60142537A true JPS60142537A (ja) 1985-07-27
JPH0518264B2 JPH0518264B2 (enExample) 1993-03-11

Family

ID=17149393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58246505A Granted JPS60142537A (ja) 1983-12-29 1983-12-29 集積回路装置の製造方法

Country Status (1)

Country Link
JP (1) JPS60142537A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267582A (ja) * 1992-03-17 1993-10-15 Nec Yamagata Ltd 半導体ウェーハおよび半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS522386A (en) * 1975-06-23 1977-01-10 Ibm Semiconductor chip
JPS57112062A (en) * 1980-12-05 1982-07-12 Cii High density integrated circuit device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS522386A (en) * 1975-06-23 1977-01-10 Ibm Semiconductor chip
JPS57112062A (en) * 1980-12-05 1982-07-12 Cii High density integrated circuit device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267582A (ja) * 1992-03-17 1993-10-15 Nec Yamagata Ltd 半導体ウェーハおよび半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0518264B2 (enExample) 1993-03-11

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