JPS60113639U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60113639U
JPS60113639U JP1984000086U JP8684U JPS60113639U JP S60113639 U JPS60113639 U JP S60113639U JP 1984000086 U JP1984000086 U JP 1984000086U JP 8684 U JP8684 U JP 8684U JP S60113639 U JPS60113639 U JP S60113639U
Authority
JP
Japan
Prior art keywords
wedge
semiconductor equipment
shaped
container
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984000086U
Other languages
English (en)
Inventor
宏 渡辺
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1984000086U priority Critical patent/JPS60113639U/ja
Publication of JPS60113639U publication Critical patent/JPS60113639U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案の一実施例による構造を説明するための
側面説明図である。第２図は第１図のセラミック基板の
上表面図である。 −１・・・放熱用銅フィン、２・・・素子搭載用セラミ
ック基板、３・・・電極引き出し端子、４・・・ベース
リード電極、５・・・エミッタリード電極、６・・・コ
レクタリード電極、７・・・クサビ形溝、８・・・封止
用セラミックキャップ、９・・・クサビ形突起、１０・
・・接着材、１１・・・トランジスタチップ、１２・・
・ポンディ　。 ング線。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子を容器に封入した半導体装置に於いて、前記
    容器のキャップ部材と半導体素子搭載用基板とのそれぞ
    れの接着面にクサビ形突起と該クサビ形突起を嵌合する
    クサビ形溝構造を有し、これらクサビ形突起と溝とが接
    着材により接着されていることを特徴とする半導体装置
    。
JP1984000086U 1984-01-04 1984-01-04 半導体装置 Pending JPS60113639U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984000086U JPS60113639U (ja) 1984-01-04 1984-01-04 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984000086U JPS60113639U (ja) 1984-01-04 1984-01-04 半導体装置

Publications (1)

Publication Number Publication Date
JPS60113639U true JPS60113639U (ja) 1985-08-01

Family

ID=30471645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984000086U Pending JPS60113639U (ja) 1984-01-04 1984-01-04 半導体装置

Country Status (1)

Country Link
JP (1) JPS60113639U (ja)

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