JPS5998650U - 樹脂封止型モジユ−ル - Google Patents

樹脂封止型モジユ−ル

Info

Publication number
JPS5998650U
JPS5998650U JP1982194587U JP19458782U JPS5998650U JP S5998650 U JPS5998650 U JP S5998650U JP 1982194587 U JP1982194587 U JP 1982194587U JP 19458782 U JP19458782 U JP 19458782U JP S5998650 U JPS5998650 U JP S5998650U
Authority
JP
Japan
Prior art keywords
resin
sealed
circuit
lead
circuit elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982194587U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6218052Y2 (enExample
Inventor
宅間　俊則
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toko Inc
Original Assignee
Toko Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toko Inc filed Critical Toko Inc
Priority to JP1982194587U priority Critical patent/JPS5998650U/ja
Publication of JPS5998650U publication Critical patent/JPS5998650U/ja
Application granted granted Critical
Publication of JPS6218052Y2 publication Critical patent/JPS6218052Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/5449—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1982194587U 1982-12-22 1982-12-22 樹脂封止型モジユ−ル Granted JPS5998650U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982194587U JPS5998650U (ja) 1982-12-22 1982-12-22 樹脂封止型モジユ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982194587U JPS5998650U (ja) 1982-12-22 1982-12-22 樹脂封止型モジユ−ル

Publications (2)

Publication Number Publication Date
JPS5998650U true JPS5998650U (ja) 1984-07-04
JPS6218052Y2 JPS6218052Y2 (enExample) 1987-05-09

Family

ID=30418200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982194587U Granted JPS5998650U (ja) 1982-12-22 1982-12-22 樹脂封止型モジユ−ル

Country Status (1)

Country Link
JP (1) JPS5998650U (enExample)

Also Published As

Publication number Publication date
JPS6218052Y2 (enExample) 1987-05-09

Similar Documents

Publication Publication Date Title
JPS58219757A (ja) 半導体装置
JPS5998650U (ja) 樹脂封止型モジユ−ル
JPS5827934U (ja) 半導体装置
JPH06103731B2 (ja) 半導体パッケ−ジ
JPS5993148U (ja) 樹脂封止型モジユ−ル
JPS60130649U (ja) 樹脂封止型半導体装置
JPS592155U (ja) 樹脂封止集積回路
JPH0366150A (ja) 半導体集積回路装置
JPS5996846U (ja) 樹脂封止型モジユ−ル
JP2629461B2 (ja) 樹脂封止形半導体装置
JPH04174548A (ja) リードフレーム
JPS5881940U (ja) 半導体素子の取付構造
JPS5856446U (ja) 樹脂封止半導体装置
JPS5963441U (ja) 樹脂封止集積回路
JPS60137436U (ja) 半導体集積回路装置
JPS5954941U (ja) 半導体装置の封止構造
JPH03220712A (ja) ワイヤボンディング構造体
JPS59111051U (ja) 混成集積回路装置
JPS5840843U (ja) 樹脂封止型半導体装置
JPS6169850U (enExample)
JPS60183427U (ja) チツプ形電解コンデンサ
JPS6132451A (ja) 樹脂封止型半導体装置
JPS59143051U (ja) 集積回路装置
JPS59185851U (ja) 半導体集積回路装置
JPS5977264U (ja) 樹脂封止型半導体装置