JPS6218052Y2 - - Google Patents

Info

Publication number
JPS6218052Y2
JPS6218052Y2 JP19458782U JP19458782U JPS6218052Y2 JP S6218052 Y2 JPS6218052 Y2 JP S6218052Y2 JP 19458782 U JP19458782 U JP 19458782U JP 19458782 U JP19458782 U JP 19458782U JP S6218052 Y2 JPS6218052 Y2 JP S6218052Y2
Authority
JP
Japan
Prior art keywords
resin
sealed
chip
lead
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP19458782U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5998650U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982194587U priority Critical patent/JPS5998650U/ja
Publication of JPS5998650U publication Critical patent/JPS5998650U/ja
Application granted granted Critical
Publication of JPS6218052Y2 publication Critical patent/JPS6218052Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/5449
    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1982194587U 1982-12-22 1982-12-22 樹脂封止型モジユ−ル Granted JPS5998650U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982194587U JPS5998650U (ja) 1982-12-22 1982-12-22 樹脂封止型モジユ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982194587U JPS5998650U (ja) 1982-12-22 1982-12-22 樹脂封止型モジユ−ル

Publications (2)

Publication Number Publication Date
JPS5998650U JPS5998650U (ja) 1984-07-04
JPS6218052Y2 true JPS6218052Y2 (enExample) 1987-05-09

Family

ID=30418200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982194587U Granted JPS5998650U (ja) 1982-12-22 1982-12-22 樹脂封止型モジユ−ル

Country Status (1)

Country Link
JP (1) JPS5998650U (enExample)

Also Published As

Publication number Publication date
JPS5998650U (ja) 1984-07-04

Similar Documents

Publication Publication Date Title
JPH09162322A (ja) 表面実装型半導体装置とその製造方法
KR100260102B1 (ko) 기능 분화형 온도 보상 수정 발진기 및 그 제조 방법
JPH01303730A (ja) 半導体素子の実装構造とその製造方法
JPS6218052Y2 (enExample)
JP2591152Y2 (ja) 電子部品実装回路基板
JPS63213936A (ja) 混成集積回路装置の製造方法
KR100337462B1 (ko) 에어리어 어레이 범프드 반도체 패키지 몰딩금형
KR910000018B1 (ko) 리이드프레임을 갖춘 반도체장치 및 그 제조방법
US20040021219A1 (en) Method of mounting integrated circuit die in a package using a solder preform having isolatable portions
JP2663986B2 (ja) 高集積度半導体装置
JPH0447949Y2 (enExample)
JP2500610B2 (ja) 半導体装置
JPH06132443A (ja) 半導体装置およびその製造に用いられるリードフレーム
KR100206941B1 (ko) 버틈 리드 패키지 및 그 제조방법
JP3405718B2 (ja) 半導体装置
JPS635254Y2 (enExample)
KR100195507B1 (ko) 박형 반도체 칩 패키지 소자
JPH0281460A (ja) Icチップ
JPH0287654A (ja) 表面実装型半導体装置
JPS63265418A (ja) ヒューズ付きチップ状固体電解コンデンサおよび製造方法
JPH0536300Y2 (enExample)
JPS59204265A (ja) 混成集積回路の製造方法
JPS6132558A (ja) 半導体装置
JPS60256217A (ja) 表面波フイルタ
KR19990033645A (ko) 피시비 패키지 및 그의 제조방법