JPS5996846U - 樹脂封止型モジユ−ル - Google Patents

樹脂封止型モジユ−ル

Info

Publication number
JPS5996846U
JPS5996846U JP1982192790U JP19279082U JPS5996846U JP S5996846 U JPS5996846 U JP S5996846U JP 1982192790 U JP1982192790 U JP 1982192790U JP 19279082 U JP19279082 U JP 19279082U JP S5996846 U JPS5996846 U JP S5996846U
Authority
JP
Japan
Prior art keywords
resin
opening
sealed
module
sealed module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982192790U
Other languages
English (en)
Other versions
JPS635254Y2 (ja
Inventor
宅間　俊則
Original Assignee
東光株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東光株式会社 filed Critical 東光株式会社
Priority to JP1982192790U priority Critical patent/JPS5996846U/ja
Publication of JPS5996846U publication Critical patent/JPS5996846U/ja
Application granted granted Critical
Publication of JPS635254Y2 publication Critical patent/JPS635254Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来のリードフレームの平面図、第２−　図は
本考案に係る樹脂封止型モジュールの一実施例を示す斜
視図、第３図は可変コイルの斜視図、第４図は本考案の
樹脂封止型モジュールのリードフレームの一実施例を示
す平面図、第５図はり−ドに固定されたチップコンデン
サの斜視図、第６図は高周波コイルの装着の一例を示す
一部切欠き斜視図。 １：リードフレーム、２：タブ、３：半導体集積回路素
子、４：ワイヤー、５：リード、６：ダブリード、　　
　−９１１９２、９ａ：開口部、１０：樹脂封止体、１
５：チップコンデンサ、１６：タム、１１：チップコイ
ル、１７：半田、１８：樹脂或いは低融点ガラス、１９
：電極、−２０＝可変コイル。

Claims (3)

    【実用新案登録請求の範囲】
  1. （１）　　リードフレームに回路素子を組込んで樹脂で
    封止し−た樹脂封止型モジュールに於て、樹脂封止部に
    開口部が形成され、該開口部の内壁面に複数のリードが
    突出し、該開口部内に回路素子が挿入され該開口部の突
    出した該リード部の舌片に回路素子の電極が電気的に結
    合されたことを特徴とした樹脂封止型モジュール。
  2. （２）モジュールの開口部内に可変コイルを挿入した実
    用新案登録請求の範囲第１項記載の樹脂封止型モジュー
    ル。
  3. （３）モジュールの開口部内の突出したリードに載置さ
    れた可変コイルめ電極面が平面状である実用新案登録請
    求の範囲子２項記載の樹脂封止型モジュール。
JP1982192790U 1982-12-20 1982-12-20 樹脂封止型モジユ−ル Granted JPS5996846U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982192790U JPS5996846U (ja) 1982-12-20 1982-12-20 樹脂封止型モジユ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982192790U JPS5996846U (ja) 1982-12-20 1982-12-20 樹脂封止型モジユ−ル

Publications (2)

Publication Number Publication Date
JPS5996846U true JPS5996846U (ja) 1984-06-30
JPS635254Y2 JPS635254Y2 (ja) 1988-02-12

Family

ID=30414806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982192790U Granted JPS5996846U (ja) 1982-12-20 1982-12-20 樹脂封止型モジユ−ル

Country Status (1)

Country Link
JP (1) JPS5996846U (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50108559A (ja) * 1974-01-28 1975-08-27
JPS5242249U (ja) * 1975-09-19 1977-03-25
JPS56161347U (ja) * 1980-04-30 1981-12-01

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5242249B2 (ja) * 1973-08-17 1977-10-24

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50108559A (ja) * 1974-01-28 1975-08-27
JPS5242249U (ja) * 1975-09-19 1977-03-25
JPS56161347U (ja) * 1980-04-30 1981-12-01

Also Published As

Publication number Publication date
JPS635254Y2 (ja) 1988-02-12

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