JPS5956752A - 電子部品の製造方法 - Google Patents

電子部品の製造方法

Info

Publication number
JPS5956752A
JPS5956752A JP58157808A JP15780883A JPS5956752A JP S5956752 A JPS5956752 A JP S5956752A JP 58157808 A JP58157808 A JP 58157808A JP 15780883 A JP15780883 A JP 15780883A JP S5956752 A JPS5956752 A JP S5956752A
Authority
JP
Japan
Prior art keywords
leads
lead
solder
small holes
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58157808A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6156623B2 (enExample
Inventor
Kanji Otsuka
寛治 大塚
Eiji Yamamoto
英治 山本
Tamotsu Usami
保 宇佐美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58157808A priority Critical patent/JPS5956752A/ja
Publication of JPS5956752A publication Critical patent/JPS5956752A/ja
Publication of JPS6156623B2 publication Critical patent/JPS6156623B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/433—Shapes or dispositions of deformation-absorbing parts, e.g. leads having meandering shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP58157808A 1983-08-31 1983-08-31 電子部品の製造方法 Granted JPS5956752A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58157808A JPS5956752A (ja) 1983-08-31 1983-08-31 電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58157808A JPS5956752A (ja) 1983-08-31 1983-08-31 電子部品の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP490977A Division JPS5390868A (en) 1977-01-21 1977-01-21 Semiconductor device of glass ceramic package type

Publications (2)

Publication Number Publication Date
JPS5956752A true JPS5956752A (ja) 1984-04-02
JPS6156623B2 JPS6156623B2 (enExample) 1986-12-03

Family

ID=15657735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58157808A Granted JPS5956752A (ja) 1983-08-31 1983-08-31 電子部品の製造方法

Country Status (1)

Country Link
JP (1) JPS5956752A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7961454B2 (en) * 2005-05-18 2011-06-14 Sanyo Electric Co., Ltd. Multi-layered solid electrolytic capacitor and method of manufacturing same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6321618A (ja) * 1986-07-15 1988-01-29 Olympus Optical Co Ltd 内視鏡
JPS6366525A (ja) * 1986-09-09 1988-03-25 Olympus Optical Co Ltd 電子内視鏡
JPS63274907A (ja) * 1987-05-06 1988-11-11 Olympus Optical Co Ltd ビデオ硬性内視鏡
JPH06148530A (ja) * 1993-06-07 1994-05-27 Olympus Optical Co Ltd 電子内視鏡

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7961454B2 (en) * 2005-05-18 2011-06-14 Sanyo Electric Co., Ltd. Multi-layered solid electrolytic capacitor and method of manufacturing same

Also Published As

Publication number Publication date
JPS6156623B2 (enExample) 1986-12-03

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