JPS5933852A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS5933852A
JPS5933852A JP57143715A JP14371582A JPS5933852A JP S5933852 A JPS5933852 A JP S5933852A JP 57143715 A JP57143715 A JP 57143715A JP 14371582 A JP14371582 A JP 14371582A JP S5933852 A JPS5933852 A JP S5933852A
Authority
JP
Japan
Prior art keywords
bed
resin
plate
heat resistant
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57143715A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0250624B2 (enExample
Inventor
Seiichi Hirata
誠一 平田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP57143715A priority Critical patent/JPS5933852A/ja
Publication of JPS5933852A publication Critical patent/JPS5933852A/ja
Publication of JPH0250624B2 publication Critical patent/JPH0250624B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/121—
    • H10W70/435—
    • H10W72/5449—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57143715A 1982-08-19 1982-08-19 半導体装置の製造方法 Granted JPS5933852A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57143715A JPS5933852A (ja) 1982-08-19 1982-08-19 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57143715A JPS5933852A (ja) 1982-08-19 1982-08-19 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5933852A true JPS5933852A (ja) 1984-02-23
JPH0250624B2 JPH0250624B2 (enExample) 1990-11-02

Family

ID=15345295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57143715A Granted JPS5933852A (ja) 1982-08-19 1982-08-19 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5933852A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0194643A (ja) * 1987-10-06 1989-04-13 Oki Electric Ind Co Ltd 薄型構造の半導体装置の製造方法
JPH0180952U (enExample) * 1987-11-19 1989-05-30
US5463995A (en) * 1993-01-22 1995-11-07 Honda Giken Kogyo Kabushiki Kaisha Intake system for internal combustion engine
US6363903B1 (en) 1999-09-03 2002-04-02 Honda Giken Kogyo Kabushiki Kaisha Intake port structure in four-stroke cycle internal combustion engine

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0194643A (ja) * 1987-10-06 1989-04-13 Oki Electric Ind Co Ltd 薄型構造の半導体装置の製造方法
JPH0180952U (enExample) * 1987-11-19 1989-05-30
US5463995A (en) * 1993-01-22 1995-11-07 Honda Giken Kogyo Kabushiki Kaisha Intake system for internal combustion engine
US6363903B1 (en) 1999-09-03 2002-04-02 Honda Giken Kogyo Kabushiki Kaisha Intake port structure in four-stroke cycle internal combustion engine

Also Published As

Publication number Publication date
JPH0250624B2 (enExample) 1990-11-02

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