JPH1154692A5 - - Google Patents

Info

Publication number
JPH1154692A5
JPH1154692A5 JP1998202726A JP20272698A JPH1154692A5 JP H1154692 A5 JPH1154692 A5 JP H1154692A5 JP 1998202726 A JP1998202726 A JP 1998202726A JP 20272698 A JP20272698 A JP 20272698A JP H1154692 A5 JPH1154692 A5 JP H1154692A5
Authority
JP
Japan
Prior art keywords
outer leads
inner lead
semiconductor chip
chip
encapsulant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998202726A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1154692A (ja
Filing date
Publication date
Priority claimed from US08/899,672 external-priority patent/US5918112A/en
Application filed filed Critical
Publication of JPH1154692A publication Critical patent/JPH1154692A/ja
Publication of JPH1154692A5 publication Critical patent/JPH1154692A5/ja
Pending legal-status Critical Current

Links

JP10202726A 1997-07-24 1998-07-02 半導体素子および製造方法 Pending JPH1154692A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US899672 1997-07-24
US08/899,672 US5918112A (en) 1997-07-24 1997-07-24 Semiconductor component and method of fabrication

Publications (2)

Publication Number Publication Date
JPH1154692A JPH1154692A (ja) 1999-02-26
JPH1154692A5 true JPH1154692A5 (enExample) 2005-10-20

Family

ID=25411375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10202726A Pending JPH1154692A (ja) 1997-07-24 1998-07-02 半導体素子および製造方法

Country Status (4)

Country Link
US (1) US5918112A (enExample)
JP (1) JPH1154692A (enExample)
KR (1) KR100559062B1 (enExample)
DE (1) DE19830475A1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6777785B1 (en) * 1999-08-25 2004-08-17 Winbond Electronics Corp. Lead frame containing a master and a slave IC chips and a testing circuit embedded within the master IC chip
DE10010461A1 (de) * 2000-03-03 2001-09-13 Infineon Technologies Ag Vorrichtung zum Verpacken elektronischer Bauteile mittels Spritzgußtechnik
AT410727B (de) * 2000-03-14 2003-07-25 Austria Mikrosysteme Int Verfahren zum unterbringen von sensoren in einem gehäuse
DE10012883A1 (de) * 2000-03-16 2001-09-27 Infineon Technologies Ag Verfahren zum Herstellen eines Packages mit mindestens zwei Speicherchips
JP4614586B2 (ja) * 2001-06-28 2011-01-19 三洋電機株式会社 混成集積回路装置の製造方法
US7176506B2 (en) * 2001-08-28 2007-02-13 Tessera, Inc. High frequency chip packages with connecting elements
US6856007B2 (en) * 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
JP3744828B2 (ja) * 2001-09-14 2006-02-15 ユーディナデバイス株式会社 半導体装置
US7754537B2 (en) * 2003-02-25 2010-07-13 Tessera, Inc. Manufacture of mountable capped chips
US6683370B1 (en) 2003-04-15 2004-01-27 Motorola, Inc. Semiconductor component and method of manufacturing same
US6972480B2 (en) 2003-06-16 2005-12-06 Shellcase Ltd. Methods and apparatus for packaging integrated circuit devices
CN100587962C (zh) 2003-07-03 2010-02-03 泰塞拉技术匈牙利公司 用于封装集成电路器件的方法和设备
US7129576B2 (en) 2003-09-26 2006-10-31 Tessera, Inc. Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps
US8143095B2 (en) 2005-03-22 2012-03-27 Tessera, Inc. Sequential fabrication of vertical conductive interconnects in capped chips
US20070096269A1 (en) * 2005-10-31 2007-05-03 Mediatek Inc. Leadframe for semiconductor packages
CN101091312B (zh) * 2005-11-02 2011-12-28 松下电器产业株式会社 电子部件组件
US7936062B2 (en) 2006-01-23 2011-05-03 Tessera Technologies Ireland Limited Wafer level chip packaging
US20080067641A1 (en) * 2006-09-15 2008-03-20 En-Min Jow Package semiconductor and fabrication method thereof
US8604605B2 (en) 2007-01-05 2013-12-10 Invensas Corp. Microelectronic assembly with multi-layer support structure
SG148054A1 (en) * 2007-05-17 2008-12-31 Micron Technology Inc Semiconductor packages and method for fabricating semiconductor packages with discrete components
US8395247B1 (en) * 2009-06-29 2013-03-12 Integrated Device Technology, Inc. Method and apparatus for placing quartz SAW devices together with clock/oscillator
US8359927B2 (en) * 2009-08-12 2013-01-29 Freescale Semiconductor, Inc. Molded differential PRT pressure sensor
JP5796956B2 (ja) 2010-12-24 2015-10-21 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 回路装置およびその製造方法
US9236331B2 (en) 2014-02-25 2016-01-12 Freescale Semiconductor, Inc. Multiple die lead frame
DE102014016565B3 (de) * 2014-11-11 2015-11-12 Micronas Gmbh Schaltkreisgehäuse
US11088055B2 (en) * 2018-12-14 2021-08-10 Texas Instruments Incorporated Package with dies mounted on opposing surfaces of a leadframe

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2582013B2 (ja) * 1991-02-08 1997-02-19 株式会社東芝 樹脂封止型半導体装置及びその製造方法
US5096852A (en) * 1988-06-02 1992-03-17 Burr-Brown Corporation Method of making plastic encapsulated multichip hybrid integrated circuits
EP0408779B1 (en) * 1989-07-18 1993-03-17 International Business Machines Corporation High density semiconductor memory module
JPH05206365A (ja) * 1992-01-30 1993-08-13 Fuji Electric Co Ltd 半導体装置およびその組立用リードフレーム
JP2843464B2 (ja) * 1992-09-01 1999-01-06 シャープ株式会社 固体撮像装置
JPH06244231A (ja) * 1993-02-01 1994-09-02 Motorola Inc 気密半導体デバイスおよびその製造方法
US5796164A (en) * 1993-05-11 1998-08-18 Micromodule Systems, Inc. Packaging and interconnect system for integrated circuits
US5661336A (en) * 1994-05-03 1997-08-26 Phelps, Jr.; Douglas Wallace Tape application platform and processes therefor
JPH0846098A (ja) * 1994-07-22 1996-02-16 Internatl Business Mach Corp <Ibm> 直接的熱伝導路を形成する装置および方法
US5504370A (en) * 1994-09-15 1996-04-02 National Semiconductor Corporation Electronic system circuit package directly supporting components on isolated subsegments
US5523617A (en) * 1994-12-27 1996-06-04 National Semiconductor Corporation Fuse frames, programmable fuse frames, and methods for programming by fusing
US5608261A (en) * 1994-12-28 1997-03-04 Intel Corporation High performance and high capacitance package with improved thermal dissipation
US5796165A (en) * 1996-03-19 1998-08-18 Matsushita Electronics Corporation High-frequency integrated circuit device having a multilayer structure

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