JP2000133762A5 - - Google Patents

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Publication number
JP2000133762A5
JP2000133762A5 JP1998307078A JP30707898A JP2000133762A5 JP 2000133762 A5 JP2000133762 A5 JP 2000133762A5 JP 1998307078 A JP1998307078 A JP 1998307078A JP 30707898 A JP30707898 A JP 30707898A JP 2000133762 A5 JP2000133762 A5 JP 2000133762A5
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JP
Japan
Prior art keywords
semiconductor chip
lead
metal plate
bonding material
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998307078A
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English (en)
Japanese (ja)
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JP3686267B2 (ja
JP2000133762A (ja
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Publication date
Application filed filed Critical
Priority to JP30707898A priority Critical patent/JP3686267B2/ja
Priority claimed from JP30707898A external-priority patent/JP3686267B2/ja
Publication of JP2000133762A publication Critical patent/JP2000133762A/ja
Publication of JP2000133762A5 publication Critical patent/JP2000133762A5/ja
Application granted granted Critical
Publication of JP3686267B2 publication Critical patent/JP3686267B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP30707898A 1998-10-28 1998-10-28 半導体装置の製造方法 Expired - Fee Related JP3686267B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30707898A JP3686267B2 (ja) 1998-10-28 1998-10-28 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30707898A JP3686267B2 (ja) 1998-10-28 1998-10-28 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2000133762A JP2000133762A (ja) 2000-05-12
JP2000133762A5 true JP2000133762A5 (enExample) 2005-02-03
JP3686267B2 JP3686267B2 (ja) 2005-08-24

Family

ID=17964781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30707898A Expired - Fee Related JP3686267B2 (ja) 1998-10-28 1998-10-28 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP3686267B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4173346B2 (ja) * 2001-12-14 2008-10-29 株式会社ルネサステクノロジ 半導体装置
JP7346372B2 (ja) 2020-09-08 2023-09-19 株式会社東芝 半導体装置
CN114420569B (zh) * 2021-12-23 2024-08-20 南通通富微电子有限公司 扇出式封装方法及封装结构

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