JPH0250624B2 - - Google Patents

Info

Publication number
JPH0250624B2
JPH0250624B2 JP57143715A JP14371582A JPH0250624B2 JP H0250624 B2 JPH0250624 B2 JP H0250624B2 JP 57143715 A JP57143715 A JP 57143715A JP 14371582 A JP14371582 A JP 14371582A JP H0250624 B2 JPH0250624 B2 JP H0250624B2
Authority
JP
Japan
Prior art keywords
bed
resin
plate
inner leads
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57143715A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5933852A (ja
Inventor
Seiichi Hirata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP57143715A priority Critical patent/JPS5933852A/ja
Publication of JPS5933852A publication Critical patent/JPS5933852A/ja
Publication of JPH0250624B2 publication Critical patent/JPH0250624B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/435—Shapes or dispositions of insulating layers on leadframes, e.g. bridging members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57143715A 1982-08-19 1982-08-19 半導体装置の製造方法 Granted JPS5933852A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57143715A JPS5933852A (ja) 1982-08-19 1982-08-19 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57143715A JPS5933852A (ja) 1982-08-19 1982-08-19 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5933852A JPS5933852A (ja) 1984-02-23
JPH0250624B2 true JPH0250624B2 (enExample) 1990-11-02

Family

ID=15345295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57143715A Granted JPS5933852A (ja) 1982-08-19 1982-08-19 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5933852A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2503029B2 (ja) * 1987-10-06 1996-06-05 沖電気工業株式会社 薄型構造の半導体装置の製造方法
JPH0180952U (enExample) * 1987-11-19 1989-05-30
JP3631770B2 (ja) * 1993-01-22 2005-03-23 本田技研工業株式会社 内燃機関の吸気装置
JP3494284B2 (ja) 1999-09-03 2004-02-09 本田技研工業株式会社 ４ストロークサイクル内燃機関の吸気ポート構造

Also Published As

Publication number Publication date
JPS5933852A (ja) 1984-02-23

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