JPS5927543A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS5927543A JPS5927543A JP57137705A JP13770582A JPS5927543A JP S5927543 A JPS5927543 A JP S5927543A JP 57137705 A JP57137705 A JP 57137705A JP 13770582 A JP13770582 A JP 13770582A JP S5927543 A JPS5927543 A JP S5927543A
- Authority
- JP
- Japan
- Prior art keywords
- film
- individual element
- element isolation
- silicon oxide
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W10/0128—
-
- H10W10/13—
Landscapes
- Element Separation (AREA)
- Local Oxidation Of Silicon (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57137705A JPS5927543A (ja) | 1982-08-06 | 1982-08-06 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57137705A JPS5927543A (ja) | 1982-08-06 | 1982-08-06 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5927543A true JPS5927543A (ja) | 1984-02-14 |
| JPS6242382B2 JPS6242382B2 (enExample) | 1987-09-08 |
Family
ID=15204888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57137705A Granted JPS5927543A (ja) | 1982-08-06 | 1982-08-06 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5927543A (enExample) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4622737A (en) * | 1984-09-25 | 1986-11-18 | Sgs-Ates Componeti Electtronici S.P.A. | Process for the fabrication of a nonvolatile memory cell with very small thin oxide area and cell |
| US4758530A (en) * | 1986-12-08 | 1988-07-19 | Delco Electronics Corporation | Doubly-self-aligned hole-within-a-hole structure in semiconductor fabrication involving a double LOCOS process aligned with sidewall spacers |
| JPH0172728U (enExample) * | 1987-11-04 | 1989-05-16 | ||
| JPH01143352A (ja) * | 1987-11-30 | 1989-06-05 | Nec Kyushu Ltd | 溝容量部を備えた半導体記憶装置 |
| US5116775A (en) * | 1986-06-18 | 1992-05-26 | Hitachi, Ltd. | Method of producing semiconductor memory device with buried barrier layer |
| US5128274A (en) * | 1989-08-01 | 1992-07-07 | Matsushita Electric Industrial Co., Ltd. | Method for producing a semiconductor device having a LOCOS insulating film with at least two different thickness |
| US5498564A (en) * | 1994-08-03 | 1996-03-12 | International Business Machines Corporation | Structure and method for reducing parasitic leakage in a memory array with merged isolation and node trench construction |
| US5679600A (en) * | 1995-10-11 | 1997-10-21 | Micron Technology, Inc. | Double locos for submicron isolation |
-
1982
- 1982-08-06 JP JP57137705A patent/JPS5927543A/ja active Granted
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4622737A (en) * | 1984-09-25 | 1986-11-18 | Sgs-Ates Componeti Electtronici S.P.A. | Process for the fabrication of a nonvolatile memory cell with very small thin oxide area and cell |
| US5116775A (en) * | 1986-06-18 | 1992-05-26 | Hitachi, Ltd. | Method of producing semiconductor memory device with buried barrier layer |
| US4758530A (en) * | 1986-12-08 | 1988-07-19 | Delco Electronics Corporation | Doubly-self-aligned hole-within-a-hole structure in semiconductor fabrication involving a double LOCOS process aligned with sidewall spacers |
| JPH0172728U (enExample) * | 1987-11-04 | 1989-05-16 | ||
| JPH01143352A (ja) * | 1987-11-30 | 1989-06-05 | Nec Kyushu Ltd | 溝容量部を備えた半導体記憶装置 |
| US5128274A (en) * | 1989-08-01 | 1992-07-07 | Matsushita Electric Industrial Co., Ltd. | Method for producing a semiconductor device having a LOCOS insulating film with at least two different thickness |
| US5498564A (en) * | 1994-08-03 | 1996-03-12 | International Business Machines Corporation | Structure and method for reducing parasitic leakage in a memory array with merged isolation and node trench construction |
| US5679600A (en) * | 1995-10-11 | 1997-10-21 | Micron Technology, Inc. | Double locos for submicron isolation |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6242382B2 (enExample) | 1987-09-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW393680B (en) | Semiconductor substrate and method of processing the same | |
| JPS5927543A (ja) | 半導体装置の製造方法 | |
| JPS60258957A (ja) | Soi型半導体装置の製造方法 | |
| JP2689710B2 (ja) | 半導体装置の製造方法 | |
| JPS59194472A (ja) | ゲ−ト酸化膜の形成方法 | |
| KR960002486A (ko) | 반도체 소자의 다중 금속층 형성방법 | |
| JPH01205553A (ja) | 素子間分離方法 | |
| JPH01161848A (ja) | フィールド酸化膜を有する半導体装置の製造方法 | |
| JPS59202649A (ja) | 半導体装置の製造方法 | |
| JP3688860B2 (ja) | 半導体集積回路の製造方法 | |
| TW415021B (en) | Method to produce integrated MOS-circuits | |
| JP2001196463A (ja) | 半導体装置の製造方法 | |
| TW466614B (en) | Manufacturing method of semiconductor device for preventing the gate oxide layer from being damaged | |
| JPS58169935A (ja) | 半導体装置の製造方法 | |
| JPH05218193A (ja) | 半導体装置の製造方法 | |
| JPS60101947A (ja) | 半導体装置の製造方法 | |
| JPS5868938A (ja) | 半導体装置の製造方法 | |
| JPS63144543A (ja) | 半導体素子間分離領域の形成方法 | |
| JPH0754824B2 (ja) | 半導体装置の製造方法 | |
| JPS59139675A (ja) | 接点層の開口の側壁に絶縁分離部分を形成する方法 | |
| JPH01173738A (ja) | 半導体装置の製造方法 | |
| JPS60101961A (ja) | バイポ−ラ集積回路装置およびその製造方法 | |
| JPS5961958A (ja) | 半導体記憶装置の製造方法 | |
| JPS58135651A (ja) | 半導体装置の製造方法 | |
| JPS59194473A (ja) | Mos半導体装置の製造方法 |