JPS59195837A - Ｌｓｉチツプボンデイング方法 - Google Patents

Ｌｓｉチツプボンデイング方法

Info

Publication number
JPS59195837A
JPS59195837A JP58071020A JP7102083A JPS59195837A JP S59195837 A JPS59195837 A JP S59195837A JP 58071020 A JP58071020 A JP 58071020A JP 7102083 A JP7102083 A JP 7102083A JP S59195837 A JPS59195837 A JP S59195837A
Authority
JP
Japan
Prior art keywords
bonding method
chip bonding
integrated circuit
substrate
scale integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58071020A
Other languages
English (en)
Japanese (ja)
Inventor
Yoshitsugu Konno
今野　義継
Kazuhito Ozawa
小沢　一仁
Kanetomo Kitanishi
北西　謙友
Katsuhide Shino
志野　勝英
Yukihiro Inoue
幸弘 井上
Yoshinori Okita
大喜多　義憲
Kazuhiro Nakao
中尾　和弘
Shigeki Komaki
小牧　茂樹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP58071020A priority Critical patent/JPS59195837A/ja
Priority to DE19843414961 priority patent/DE3414961A1/de
Publication of JPS59195837A publication Critical patent/JPS59195837A/ja
Priority to US06/805,420 priority patent/US4744850A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
    • Y10T156/1077—Applying plural cut laminae to single face of additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina

Landscapes

  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP58071020A 1983-04-21 1983-04-21 Ｌｓｉチツプボンデイング方法 Pending JPS59195837A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP58071020A JPS59195837A (ja) 1983-04-21 1983-04-21 Ｌｓｉチツプボンデイング方法
DE19843414961 DE3414961A1 (de) 1983-04-21 1984-04-19 Verfahren zum bonden von lsi-chips auf einen anschlusssockel
US06/805,420 US4744850A (en) 1983-04-21 1985-12-09 Method for bonding an LSI chip on a wiring base

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58071020A JPS59195837A (ja) 1983-04-21 1983-04-21 Ｌｓｉチツプボンデイング方法

Publications (1)

Publication Number Publication Date
JPS59195837A true JPS59195837A (ja) 1984-11-07

Family

ID=13448415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58071020A Pending JPS59195837A (ja) 1983-04-21 1983-04-21 Ｌｓｉチツプボンデイング方法

Country Status (3)

Country Link
US (1) US4744850A (https=)
JP (1) JPS59195837A (https=)
DE (1) DE3414961A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6150344A (ja) * 1984-08-18 1986-03-12 Hitachi Chem Co Ltd 集積回路の接続方法
JPS61186061A (ja) * 1985-02-13 1986-08-19 Fuji Xerox Co Ltd 異方導電性フィルム、これを用いた半導体装置およびその製造方法
JPS63160347A (ja) * 1986-12-24 1988-07-04 Seikosha Co Ltd Ｉｃチツプ
JPS642331A (en) * 1987-06-25 1989-01-06 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JPH0211329U (https=) * 1988-07-06 1990-01-24
JPH07114314B2 (ja) * 1985-04-30 1995-12-06 アンプ インコ−ポレ−テツド 回路パネル組立体

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IE55524B1 (en) * 1983-06-13 1990-10-10 Minnesota Mining & Mfg Electrically and thermally conductive adhesive transfer tape
FR2575331B1 (fr) * 1984-12-21 1987-06-05 Labo Electronique Physique Boitier pour composant electronique
EP0218849A1 (de) * 1985-09-12 1987-04-22 Siemens Aktiengesellschaft Trägerband für einen filmmontierten Schaltkreis
EP0265077A3 (en) * 1986-09-25 1989-03-08 Sheldahl, Inc. An anisotropic adhesive for bonding electrical components
JPS63119552A (ja) * 1986-11-07 1988-05-24 Sharp Corp Ｌｓｉチツプ
GB2200801B (en) * 1986-12-25 1991-01-09 Tdk Corp Electronic circuit element
US4818823A (en) * 1987-07-06 1989-04-04 Micro-Circuits, Inc. Adhesive component means for attaching electrical components to conductors
US4917466A (en) * 1987-08-13 1990-04-17 Shin-Etsu Polymer Co., Ltd. Method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby
JP2596960B2 (ja) * 1988-03-07 1997-04-02 シャープ株式会社 接続構造
US5502889A (en) * 1988-06-10 1996-04-02 Sheldahl, Inc. Method for electrically and mechanically connecting at least two conductive layers
US5068714A (en) * 1989-04-05 1991-11-26 Robert Bosch Gmbh Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made
DE3922671A1 (de) * 1989-07-10 1991-01-24 Siemens Ag Akustoelektronisches bauelement mit einer oberflaechenwellenanordnung und einer elektronischen halbleiterschaltung
DE69026992T2 (de) * 1989-08-17 1996-10-24 Canon Kk Prozess zur gegenseitigen Konnektion von Elektrodenanschlüssen
JPH0738502B2 (ja) * 1989-10-17 1995-04-26 シャープ株式会社 回路基板の接続方法
JPH03152992A (ja) * 1989-10-27 1991-06-28 W R Grace & Co 印刷回路板及びその製造方法
JP2547895B2 (ja) * 1990-03-20 1996-10-23 シャープ株式会社 半導体装置の実装方法
US5140405A (en) * 1990-08-30 1992-08-18 Micron Technology, Inc. Semiconductor assembly utilizing elastomeric single axis conductive interconnect
JP2756184B2 (ja) * 1990-11-27 1998-05-25 株式会社日立製作所 電子部品の表面実装構造
US5258577A (en) * 1991-11-22 1993-11-02 Clements James R Die mounting with uniaxial conductive adhesive
JPH05217121A (ja) * 1991-11-22 1993-08-27 Internatl Business Mach Corp <Ibm> 磁気変換器付きチップ等の感熱素子を結合する方法及び装置
US5221417A (en) * 1992-02-20 1993-06-22 At&T Bell Laboratories Conductive adhesive film techniques
US5727310A (en) * 1993-01-08 1998-03-17 Sheldahl, Inc. Method of manufacturing a multilayer electronic circuit
US5445308A (en) * 1993-03-29 1995-08-29 Nelson; Richard D. Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal
US5328087A (en) * 1993-03-29 1994-07-12 Microelectronics And Computer Technology Corporation Thermally and electrically conductive adhesive material and method of bonding with same
WO1994024704A1 (en) * 1993-04-12 1994-10-27 Bolger Justin C Area bonding conductive adhesive preforms
US5616206A (en) * 1993-06-15 1997-04-01 Ricoh Company, Ltd. Method for arranging conductive particles on electrodes of substrate
US5428190A (en) * 1993-07-02 1995-06-27 Sheldahl, Inc. Rigid-flex board with anisotropic interconnect and method of manufacture
EP0641019A3 (en) * 1993-08-27 1995-12-20 Poly Flex Circuits Inc Flexible lead frame printed on a polymer.
US5527998A (en) * 1993-10-22 1996-06-18 Sheldahl, Inc. Flexible multilayer printed circuit boards and methods of manufacture
KR950020972A (ko) * 1993-12-21 1995-07-26 쯔지 하루오 전극 단자가 미소 피치를 갖는 경우에도 전극 단자의 고신뢰성 접속을 달성할 수 있는 패널 실장 구조 및 패널 실장 방법
US5627405A (en) * 1995-07-17 1997-05-06 National Semiconductor Corporation Integrated circuit assembly incorporating an anisotropic elecctrically conductive layer
JPH11510649A (ja) * 1995-08-29 1999-09-14 ミネソタ・マイニング・アンド・マニュファクチャリング・カンパニー 接着剤接合した電子デバイス用の変形可能な基板アセンブリ
US6020220A (en) 1996-07-09 2000-02-01 Tessera, Inc. Compliant semiconductor chip assemblies and methods of making same
DE19630593C2 (de) * 1996-07-30 2001-07-05 Fraunhofer Ges Forschung Verfahren zum Verbinden einer integrierten Schatung mit einem Substrat und elektronische Schaltungsanordnung
US5786548A (en) * 1996-08-15 1998-07-28 Hughes Electronics Corporation Hermetic package for an electrical device
DE19702186C2 (de) * 1997-01-23 2002-06-27 Fraunhofer Ges Forschung Verfahren zur Gehäusung von integrierten Schaltkreisen
US6228206B1 (en) 1997-07-30 2001-05-08 Drug Delivery Technologies, Inc. Bonding agent composition containing conductive filler and method of bonding electrode to printed conductive trace with same
JP2000003977A (ja) * 1998-06-16 2000-01-07 Shinko Electric Ind Co Ltd 半導体チップ実装用基板
US6255208B1 (en) 1999-01-25 2001-07-03 International Business Machines Corporation Selective wafer-level testing and burn-in
US6177729B1 (en) 1999-04-03 2001-01-23 International Business Machines Corporation Rolling ball connector
US6630203B2 (en) 2001-06-15 2003-10-07 Nanopierce Technologies, Inc. Electroless process for the preparation of particle enhanced electric contact surfaces
EP1328373A2 (en) * 2000-10-24 2003-07-23 Nanopierce Technologies Inc. Method and materials for printing particle-enhanced electrical contacts
DE10059765A1 (de) * 2000-11-30 2002-06-06 Koninkl Philips Electronics Nv Baugruppe mit Verbindungsstruktur
WO2002067017A2 (en) * 2001-01-22 2002-08-29 Nanopierce Technologies, Inc. Optical device module and method of fabrication
WO2003003798A1 (fr) * 2001-06-29 2003-01-09 Toray Engineering Co., Ltd. Methode d'assemblage utilisant un adhesif conducteur anisotrope
US7147367B2 (en) 2002-06-11 2006-12-12 Saint-Gobain Performance Plastics Corporation Thermal interface material with low melting alloy
JP3893100B2 (ja) * 2002-10-29 2007-03-14 新光電気工業株式会社 配線基板への電子部品搭載方法
JP5252473B2 (ja) * 2006-10-19 2013-07-31 独立行政法人産業技術総合研究所 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置
US8816807B2 (en) * 2010-05-21 2014-08-26 Purdue Research Foundation Controlled self assembly of anisotropic conductive adhesives based on ferromagnetic particles

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3981070A (en) * 1973-04-05 1976-09-21 Amdahl Corporation LSI chip construction and method
US4113981A (en) * 1974-08-14 1978-09-12 Kabushiki Kaisha Seikosha Electrically conductive adhesive connecting arrays of conductors
US4064552A (en) * 1976-02-03 1977-12-20 Angelucci Thomas L Multilayer flexible printed circuit tape
NL7605233A (nl) * 1976-05-17 1977-11-21 Philips Nv Van een micro circuit voorziene elementaire schijf met electrolytisch aangegroeide soldeerbollen alsmede werkwijze voor het vervaardigen daarvan.
JPS535255A (en) * 1976-07-05 1978-01-18 Hitachi Ltd Mold for molding resin
JPS5357481A (en) * 1976-11-04 1978-05-24 Canon Inc Connecting process
JPS57111034A (en) * 1980-12-10 1982-07-10 Hitachi Ltd Semiconductor device and its manufacture
JPS57185316A (en) * 1981-05-11 1982-11-15 Sumitomo Metal Mining Co Ltd Electrically conductive resin paste
US4460804A (en) * 1982-08-02 1984-07-17 Svejkovsky Roger L Flexible electrically conductive adhesive tape

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6150344A (ja) * 1984-08-18 1986-03-12 Hitachi Chem Co Ltd 集積回路の接続方法
JPS61186061A (ja) * 1985-02-13 1986-08-19 Fuji Xerox Co Ltd 異方導電性フィルム、これを用いた半導体装置およびその製造方法
JPH07114314B2 (ja) * 1985-04-30 1995-12-06 アンプ インコ−ポレ−テツド 回路パネル組立体
JPS63160347A (ja) * 1986-12-24 1988-07-04 Seikosha Co Ltd Ｉｃチツプ
JPS642331A (en) * 1987-06-25 1989-01-06 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JPH0211329U (https=) * 1988-07-06 1990-01-24

Also Published As

Publication number Publication date
US4744850A (en) 1988-05-17
DE3414961C2 (https=) 1992-04-23
DE3414961A1 (de) 1984-10-25

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