JPS59195837A - Ｌｓｉチツプボンデイング方法 - Google Patents

Ｌｓｉチツプボンデイング方法

Info

Publication number
JPS59195837A
JPS59195837A JP58071020A JP7102083A JPS59195837A JP S59195837 A JPS59195837 A JP S59195837A JP 58071020 A JP58071020 A JP 58071020A JP 7102083 A JP7102083 A JP 7102083A JP S59195837 A JPS59195837 A JP S59195837A
Authority
JP
Japan
Prior art keywords
powder
heat
seal agent
circuit board
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58071020A
Other languages
English (en)
Japanese (ja)
Inventor
Yoshitsugu Konno
今野　義継
Kazuhito Ozawa
小沢　一仁
Kanetomo Kitanishi
北西　謙友
Katsuhide Shino
志野　勝英
Yukihiro Inoue
幸弘 井上
Yoshinori Okita
大喜多　義憲
Kazuhiro Nakao
中尾　和弘
Shigeki Komaki
小牧　茂樹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP58071020A priority Critical patent/JPS59195837A/ja
Priority to DE19843414961 priority patent/DE3414961A1/de
Publication of JPS59195837A publication Critical patent/JPS59195837A/ja
Priority to US06/805,420 priority patent/US4744850A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
    • Y10T156/1077—Applying plural cut laminae to single face of additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
JP58071020A 1983-04-21 1983-04-21 Ｌｓｉチツプボンデイング方法 Pending JPS59195837A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP58071020A JPS59195837A (ja) 1983-04-21 1983-04-21 Ｌｓｉチツプボンデイング方法
DE19843414961 DE3414961A1 (de) 1983-04-21 1984-04-19 Verfahren zum bonden von lsi-chips auf einen anschlusssockel
US06/805,420 US4744850A (en) 1983-04-21 1985-12-09 Method for bonding an LSI chip on a wiring base

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58071020A JPS59195837A (ja) 1983-04-21 1983-04-21 Ｌｓｉチツプボンデイング方法

Publications (1)

Publication Number Publication Date
JPS59195837A true JPS59195837A (ja) 1984-11-07

Family

ID=13448415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58071020A Pending JPS59195837A (ja) 1983-04-21 1983-04-21 Ｌｓｉチツプボンデイング方法

Country Status (3)

Country Link
US (1) US4744850A (de)
JP (1) JPS59195837A (de)
DE (1) DE3414961A1 (de)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6150344A (ja) * 1984-08-18 1986-03-12 Hitachi Chem Co Ltd 集積回路の接続方法
JPS61186061A (ja) * 1985-02-13 1986-08-19 Fuji Xerox Co Ltd 異方導電性フィルム、これを用いた半導体装置およびその製造方法
JPS63160347A (ja) * 1986-12-24 1988-07-04 Seikosha Co Ltd Ｉｃチツプ
JPS642331A (en) * 1987-06-25 1989-01-06 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JPH0211329U (de) * 1988-07-06 1990-01-24
JPH07114314B2 (ja) * 1985-04-30 1995-12-06 アンプ インコ−ポレ−テツド 回路パネル組立体

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IE55524B1 (en) * 1983-06-13 1990-10-10 Minnesota Mining & Mfg Electrically and thermally conductive adhesive transfer tape
FR2575331B1 (fr) * 1984-12-21 1987-06-05 Labo Electronique Physique Boitier pour composant electronique
EP0218849A1 (de) * 1985-09-12 1987-04-22 Siemens Aktiengesellschaft Trägerband für einen filmmontierten Schaltkreis
EP0265077A3 (de) * 1986-09-25 1989-03-08 Sheldahl, Inc. Ein Anisotropisches Klebemittel zum Verbinden elektrischer Bauelemente
JPS63119552A (ja) * 1986-11-07 1988-05-24 Sharp Corp Ｌｓｉチツプ
CA1278876C (en) * 1986-12-25 1991-01-08 Sho Masujima Adhesive mounted electronic circuit element
US4818823A (en) * 1987-07-06 1989-04-04 Micro-Circuits, Inc. Adhesive component means for attaching electrical components to conductors
US4917466A (en) * 1987-08-13 1990-04-17 Shin-Etsu Polymer Co., Ltd. Method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby
JP2596960B2 (ja) * 1988-03-07 1997-04-02 シャープ株式会社 接続構造
US5502889A (en) * 1988-06-10 1996-04-02 Sheldahl, Inc. Method for electrically and mechanically connecting at least two conductive layers
US5068714A (en) * 1989-04-05 1991-11-26 Robert Bosch Gmbh Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made
DE3922671A1 (de) * 1989-07-10 1991-01-24 Siemens Ag Akustoelektronisches bauelement mit einer oberflaechenwellenanordnung und einer elektronischen halbleiterschaltung
DE69026992T2 (de) * 1989-08-17 1996-10-24 Canon Kk Prozess zur gegenseitigen Konnektion von Elektrodenanschlüssen
JPH0738502B2 (ja) * 1989-10-17 1995-04-26 シャープ株式会社 回路基板の接続方法
JPH03152992A (ja) * 1989-10-27 1991-06-28 W R Grace & Co 印刷回路板及びその製造方法
JP2547895B2 (ja) * 1990-03-20 1996-10-23 シャープ株式会社 半導体装置の実装方法
US5140405A (en) * 1990-08-30 1992-08-18 Micron Technology, Inc. Semiconductor assembly utilizing elastomeric single axis conductive interconnect
JP2756184B2 (ja) * 1990-11-27 1998-05-25 株式会社日立製作所 電子部品の表面実装構造
US5258577A (en) * 1991-11-22 1993-11-02 Clements James R Die mounting with uniaxial conductive adhesive
JPH05217121A (ja) * 1991-11-22 1993-08-27 Internatl Business Mach Corp <Ibm> 磁気変換器付きチップ等の感熱素子を結合する方法及び装置
US5221417A (en) * 1992-02-20 1993-06-22 At&T Bell Laboratories Conductive adhesive film techniques
US5727310A (en) * 1993-01-08 1998-03-17 Sheldahl, Inc. Method of manufacturing a multilayer electronic circuit
US5328087A (en) * 1993-03-29 1994-07-12 Microelectronics And Computer Technology Corporation Thermally and electrically conductive adhesive material and method of bonding with same
US5445308A (en) * 1993-03-29 1995-08-29 Nelson; Richard D. Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal
US5667884A (en) * 1993-04-12 1997-09-16 Bolger; Justin C. Area bonding conductive adhesive preforms
US5616206A (en) * 1993-06-15 1997-04-01 Ricoh Company, Ltd. Method for arranging conductive particles on electrodes of substrate
US5428190A (en) * 1993-07-02 1995-06-27 Sheldahl, Inc. Rigid-flex board with anisotropic interconnect and method of manufacture
EP0641019A3 (de) * 1993-08-27 1995-12-20 Poly Flex Circuits Inc Flexibler, auf einem Polymer gedruckter Leiterrahmen.
US5527998A (en) * 1993-10-22 1996-06-18 Sheldahl, Inc. Flexible multilayer printed circuit boards and methods of manufacture
US5592365A (en) * 1993-12-21 1997-01-07 Sharp Kabushiki Kaisha Panel assembly structure and panel assembling method capable of achieving a highly reliable connection of electrode terminals even when the electrode terminals have a fine pitch
US5627405A (en) * 1995-07-17 1997-05-06 National Semiconductor Corporation Integrated circuit assembly incorporating an anisotropic elecctrically conductive layer
CN1194059A (zh) * 1995-08-29 1998-09-23 美国3M公司 用于粘合电子器件的可变形基片部件
US6020220A (en) 1996-07-09 2000-02-01 Tessera, Inc. Compliant semiconductor chip assemblies and methods of making same
DE19630593C2 (de) * 1996-07-30 2001-07-05 Fraunhofer Ges Forschung Verfahren zum Verbinden einer integrierten Schatung mit einem Substrat und elektronische Schaltungsanordnung
US5786548A (en) * 1996-08-15 1998-07-28 Hughes Electronics Corporation Hermetic package for an electrical device
DE19702186C2 (de) * 1997-01-23 2002-06-27 Fraunhofer Ges Forschung Verfahren zur Gehäusung von integrierten Schaltkreisen
US6228206B1 (en) 1997-07-30 2001-05-08 Drug Delivery Technologies, Inc. Bonding agent composition containing conductive filler and method of bonding electrode to printed conductive trace with same
JP2000003977A (ja) * 1998-06-16 2000-01-07 Shinko Electric Ind Co Ltd 半導体チップ実装用基板
US6255208B1 (en) 1999-01-25 2001-07-03 International Business Machines Corporation Selective wafer-level testing and burn-in
US6177729B1 (en) 1999-04-03 2001-01-23 International Business Machines Corporation Rolling ball connector
US6630203B2 (en) 2001-06-15 2003-10-07 Nanopierce Technologies, Inc. Electroless process for the preparation of particle enhanced electric contact surfaces
EP1328373A2 (de) * 2000-10-24 2003-07-23 Nanopierce Technologies Inc. Verfahren und materialien zum drucken von teilchenverstärkten elektrischen kontakten
DE10059765A1 (de) * 2000-11-30 2002-06-06 Koninkl Philips Electronics Nv Baugruppe mit Verbindungsstruktur
WO2002067017A2 (en) * 2001-01-22 2002-08-29 Nanopierce Technologies, Inc. Optical device module and method of fabrication
US20040177921A1 (en) * 2001-06-29 2004-09-16 Akira Yamauchi Joining method using anisotropic conductive adhesive
US7147367B2 (en) 2002-06-11 2006-12-12 Saint-Gobain Performance Plastics Corporation Thermal interface material with low melting alloy
JP3893100B2 (ja) * 2002-10-29 2007-03-14 新光電気工業株式会社 配線基板への電子部品搭載方法
JP5252473B2 (ja) * 2006-10-19 2013-07-31 独立行政法人産業技術総合研究所 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置
US8816807B2 (en) * 2010-05-21 2014-08-26 Purdue Research Foundation Controlled self assembly of anisotropic conductive adhesives based on ferromagnetic particles

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3981070A (en) * 1973-04-05 1976-09-21 Amdahl Corporation LSI chip construction and method
US4113981A (en) * 1974-08-14 1978-09-12 Kabushiki Kaisha Seikosha Electrically conductive adhesive connecting arrays of conductors
US4064552A (en) * 1976-02-03 1977-12-20 Angelucci Thomas L Multilayer flexible printed circuit tape
NL7605233A (nl) * 1976-05-17 1977-11-21 Philips Nv Van een micro circuit voorziene elementaire schijf met electrolytisch aangegroeide soldeerbollen alsmede werkwijze voor het vervaardigen daarvan.
JPS535255A (en) * 1976-07-05 1978-01-18 Hitachi Ltd Mold for molding resin
JPS5357481A (en) * 1976-11-04 1978-05-24 Canon Inc Connecting process
JPS57111034A (en) * 1980-12-10 1982-07-10 Hitachi Ltd Semiconductor device and its manufacture
JPS57185316A (en) * 1981-05-11 1982-11-15 Sumitomo Metal Mining Co Ltd Electrically conductive resin paste
US4460804A (en) * 1982-08-02 1984-07-17 Svejkovsky Roger L Flexible electrically conductive adhesive tape

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6150344A (ja) * 1984-08-18 1986-03-12 Hitachi Chem Co Ltd 集積回路の接続方法
JPH0430742B2 (de) * 1984-08-18 1992-05-22
JPS61186061A (ja) * 1985-02-13 1986-08-19 Fuji Xerox Co Ltd 異方導電性フィルム、これを用いた半導体装置およびその製造方法
JPH07114314B2 (ja) * 1985-04-30 1995-12-06 アンプ インコ−ポレ−テツド 回路パネル組立体
JPS63160347A (ja) * 1986-12-24 1988-07-04 Seikosha Co Ltd Ｉｃチツプ
JPS642331A (en) * 1987-06-25 1989-01-06 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JPH0211329U (de) * 1988-07-06 1990-01-24

Also Published As

Publication number Publication date
DE3414961C2 (de) 1992-04-23
US4744850A (en) 1988-05-17
DE3414961A1 (de) 1984-10-25

Similar Documents

Publication Publication Date Title
JPS59195837A (ja) Ｌｓｉチツプボンデイング方法
JP2895872B2 (ja) 異方導電性材料、異方導電性接着剤およびその異方導電性接着剤を使用した電極間を電気的に接続する方法並びにその方法により形成される電気回路基板
CN105555023B (zh) 高导通透明玻璃基电路板
JP2007059480A (ja) 回路接続構造体及びその製造方法及び回路接続構造体用の半導体基板
JP2648712B2 (ja) 異方導電性接着剤およびその異方導電性接着剤を使用した電極間を電気的に接続する方法並びにその方法により形成される電気回路基板
TWI232564B (en) A COF semiconductor device and a manufacturing method for the same
TW200820360A (en) Method for mounting electronic component on substrate and method for forming solder surface
WO2002067317A1 (en) Bumpless semiconductor device
JP2906612B2 (ja) マイクロカプセル型導電性接着剤と接着方法
JP3727615B2 (ja) ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置
JPS61141196A (ja) 微細な導電性パターンを有する基体の選択接着方法
JPH0462714A (ja) 異方導電性接着剤
JPH09306231A (ja) 導電性微粒子及び基板
JPH10302926A (ja) 異方導電性接着フィルムの製造法
JPS59198728A (ja) Ｌｓｉチップの基板への取付方法
JP3148008B2 (ja) 導電性接着剤を用いた基板とチップの接続方法
JP2511909B2 (ja) 電気的接続材料のマイクロ形成方法
KR20140056668A (ko) 솔더 온 패드의 제조방법 및 그를 이용한 플립 칩 본딩 방법
JPS6414886A (en) Bond for terminal connection and connecting method
JPS5961940A (ja) 半導体チツプのボンデイング方法
JPS60120588A (ja) 印刷配線板
JPH04152540A (ja) 半導体装置の実装方法
JPH03283542A (ja) 半導体チップの接続方法
JP2001144120A (ja) 半導体装置およびその製造方法
JP2002009110A (ja) 半導体装置