JPH0211329U - - Google Patents
Info
- Publication number
- JPH0211329U JPH0211329U JP9011688U JP9011688U JPH0211329U JP H0211329 U JPH0211329 U JP H0211329U JP 9011688 U JP9011688 U JP 9011688U JP 9011688 U JP9011688 U JP 9011688U JP H0211329 U JPH0211329 U JP H0211329U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- conductor pattern
- conductive adhesive
- anisotropic conductive
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9011688U JPH0211329U (de) | 1988-07-06 | 1988-07-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9011688U JPH0211329U (de) | 1988-07-06 | 1988-07-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0211329U true JPH0211329U (de) | 1990-01-24 |
Family
ID=31314648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9011688U Pending JPH0211329U (de) | 1988-07-06 | 1988-07-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0211329U (de) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59195837A (ja) * | 1983-04-21 | 1984-11-07 | Sharp Corp | Ｌｓｉチツプボンデイング方法 |
-
1988
- 1988-07-06 JP JP9011688U patent/JPH0211329U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59195837A (ja) * | 1983-04-21 | 1984-11-07 | Sharp Corp | Ｌｓｉチツプボンデイング方法 |