JPS59189252U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS59189252U
JPS59189252U JP8478483U JP8478483U JPS59189252U JP S59189252 U JPS59189252 U JP S59189252U JP 8478483 U JP8478483 U JP 8478483U JP 8478483 U JP8478483 U JP 8478483U JP S59189252 U JPS59189252 U JP S59189252U
Authority
JP
Japan
Prior art keywords
island
resin
semiconductor equipment
semiconductor device
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8478483U
Other languages
English (en)
Inventor
山口　耕二
義康 井上
竹中　慎一
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP8478483U priority Critical patent/JPS59189252U/ja
Publication of JPS59189252U publication Critical patent/JPS59189252U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の半導体装置の斜視図、第２図はその断面
図、第３図は従来の他の装置の断面図、第４図は従来の
薄型の半導体装置の断面図、第５図は本考案の一実施例
の断面図である。 １．５・・・・・・リードフレーム部分、２，６・・・
・・・ペレット、３．７・・・・・・金、アルミ等のワ
イヤ、４゜８・・・・・・樹脂、ｔ□ｖ　ｔ２・・・・
・・リードフレーム上部、下部の樹脂の厚さ、ａ・・・
・・・リード部の折曲げ点、ｂ・・・・・・リードの段
差量である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子を搭載するアイランドと、前記アイランド周
    囲に先端が集まるように配置された複数のリードとをも
    ち、前記アイランドと複数のリードを樹脂で封止した半
    導体装置において、樹脂に履われた部分の前記リードを
    折り曲げ、かつ折り曲げた個所よりアイランドに近い側
    が樹脂厚み方向の中心部に位置するようにしたことを特
    徴とする半導体装置。
JP8478483U 1983-06-03 1983-06-03 半導体装置 Pending JPS59189252U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8478483U JPS59189252U (ja) 1983-06-03 1983-06-03 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8478483U JPS59189252U (ja) 1983-06-03 1983-06-03 半導体装置

Publications (1)

Publication Number Publication Date
JPS59189252U true JPS59189252U (ja) 1984-12-15

Family

ID=30214751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8478483U Pending JPS59189252U (ja) 1983-06-03 1983-06-03 半導体装置

Country Status (1)

Country Link
JP (1) JPS59189252U (ja)

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