JPS5877292A - 印刷配線板の製造方法 - Google Patents
印刷配線板の製造方法Info
- Publication number
- JPS5877292A JPS5877292A JP17609181A JP17609181A JPS5877292A JP S5877292 A JPS5877292 A JP S5877292A JP 17609181 A JP17609181 A JP 17609181A JP 17609181 A JP17609181 A JP 17609181A JP S5877292 A JPS5877292 A JP S5877292A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- circuit board
- printed circuit
- printed
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 27
- 238000007747 plating Methods 0.000 claims description 100
- 239000004020 conductor Substances 0.000 claims description 41
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 15
- 239000010931 gold Substances 0.000 claims description 15
- 229910052737 gold Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 19
- 229910052802 copper Inorganic materials 0.000 description 18
- 239000010949 copper Substances 0.000 description 18
- 238000007650 screen-printing Methods 0.000 description 8
- 238000007639 printing Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000010146 3D printing Methods 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17609181A JPS5877292A (ja) | 1981-11-02 | 1981-11-02 | 印刷配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17609181A JPS5877292A (ja) | 1981-11-02 | 1981-11-02 | 印刷配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5877292A true JPS5877292A (ja) | 1983-05-10 |
| JPH0137877B2 JPH0137877B2 (enrdf_load_html_response) | 1989-08-09 |
Family
ID=16007542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17609181A Granted JPS5877292A (ja) | 1981-11-02 | 1981-11-02 | 印刷配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5877292A (enrdf_load_html_response) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01124295A (ja) * | 1987-11-09 | 1989-05-17 | Fujitsu Ltd | プリント配線板の部品取付け孔の形成方法 |
-
1981
- 1981-11-02 JP JP17609181A patent/JPS5877292A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01124295A (ja) * | 1987-11-09 | 1989-05-17 | Fujitsu Ltd | プリント配線板の部品取付け孔の形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0137877B2 (enrdf_load_html_response) | 1989-08-09 |
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