JPS5866655U - 半導体抵抗チツプ - Google Patents

半導体抵抗チツプ

Info

Publication number
JPS5866655U
JPS5866655U JP1981161560U JP16156081U JPS5866655U JP S5866655 U JPS5866655 U JP S5866655U JP 1981161560 U JP1981161560 U JP 1981161560U JP 16156081 U JP16156081 U JP 16156081U JP S5866655 U JPS5866655 U JP S5866655U
Authority
JP
Japan
Prior art keywords
semiconductor substrate
resistance chip
semiconductor resistance
layer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981161560U
Other languages
English (en)
Inventor
鎌崎　啓二
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP1981161560U priority Critical patent/JPS5866655U/ja
Publication of JPS5866655U publication Critical patent/JPS5866655U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Landscapes

  • Non-Adjustable Resistors (AREA)
  • Bipolar Transistors (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図はＬＥＤランプの等価回路図、第２図は半導体抵
抗チップを内蔵したＬＥＤランプの断面図、第３図Ａは
従来の半導体抵抗チップの断面図であり、同図Ｂはその
等価回路図、第４図Ａは本考案の一実施例になる半導体
抵抗チップの断面図であり、同図Ｂはその等価回路図、
第４図Ｃは第４図Ａ、　Ｂの半導体抵抗チップにおける
特性図である。 ２１・・・ｎ型シリコン基板、１２２・・・拡散抵抗領
域、２３．２７・・・ｎ＋型不純物領域、２４・・・シ
リコン酸化膜、２５・・・導電体層、２６．２８・・・
電極。

Claims (1)

    【実用新案登録請求の範囲】
  1. 第一導電型の半導体基板と、該半導体基板の表層に形成
    された第二導電型の拡散抵抗層と、該拡散抵抗層の一端
    と前記半導体基板とをオーミック接続する導電体層と、
    前記拡散抵抗層の他端および前記半導体基板の裏面に形
    成された電流取り出し用の電極とを具備したことを特徴
    とする半導体抵抗チップ。
JP1981161560U 1981-10-29 1981-10-29 半導体抵抗チツプ Pending JPS5866655U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981161560U JPS5866655U (ja) 1981-10-29 1981-10-29 半導体抵抗チツプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981161560U JPS5866655U (ja) 1981-10-29 1981-10-29 半導体抵抗チツプ

Publications (1)

Publication Number Publication Date
JPS5866655U true JPS5866655U (ja) 1983-05-06

Family

ID=29953922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981161560U Pending JPS5866655U (ja) 1981-10-29 1981-10-29 半導体抵抗チツプ

Country Status (1)

Country Link
JP (1) JPS5866655U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49114884A (ja) * 1973-02-28 1974-11-01

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49114884A (ja) * 1973-02-28 1974-11-01

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