JPS6134741U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6134741U
JPS6134741U JP1984117137U JP11713784U JPS6134741U JP S6134741 U JPS6134741 U JP S6134741U JP 1984117137 U JP1984117137 U JP 1984117137U JP 11713784 U JP11713784 U JP 11713784U JP S6134741 U JPS6134741 U JP S6134741U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
abstract
recorded
electronic filing
before electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984117137U
Other languages
English (en)
Inventor
広一 井上
保敏 栗原
太佐男 曽我
守 沢畠
耕明 八野
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP1984117137U priority Critical patent/JPS6134741U/ja
Publication of JPS6134741U publication Critical patent/JPS6134741U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本発明の一実施例の斜視図ａ及び断面図ｂ、第
２図ないし第４歯は本発明の別の実施例を示す一部断面
斜視図、第５図はＰ−ｎ接合の電圧一電流特性図、第６
図は第四実施例ないし第七実施例の断面図である。 １・・・シリコンチツ７’、２，７，８，１０・・・電
極、３，６・・・Ｐ型層、４・・・ｎ型層、９・・・薄
膜。

Claims (1)

  1. 【実用新案登録請求の範囲】 シリコン半導体装置において、 回路を形成する面の反対側の面に、通電により発熱する
    部材を備えたことを特徴とする半導体装置。
JP1984117137U 1984-08-01 1984-08-01 半導体装置 Pending JPS6134741U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984117137U JPS6134741U (ja) 1984-08-01 1984-08-01 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984117137U JPS6134741U (ja) 1984-08-01 1984-08-01 半導体装置

Publications (1)

Publication Number Publication Date
JPS6134741U true JPS6134741U (ja) 1986-03-03

Family

ID=30676047

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984117137U Pending JPS6134741U (ja) 1984-08-01 1984-08-01 半導体装置

Country Status (1)

Country Link
JP (1) JPS6134741U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019150687A1 (ja) * 2018-02-05 2019-08-08 千住スプリンクラー株式会社 スプリンクラーヘッド

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019150687A1 (ja) * 2018-02-05 2019-08-08 千住スプリンクラー株式会社 スプリンクラーヘッド

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