JPS5844735A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS5844735A JPS5844735A JP56142383A JP14238381A JPS5844735A JP S5844735 A JPS5844735 A JP S5844735A JP 56142383 A JP56142383 A JP 56142383A JP 14238381 A JP14238381 A JP 14238381A JP S5844735 A JPS5844735 A JP S5844735A
- Authority
- JP
- Japan
- Prior art keywords
- polysilicon
- film
- groove
- semiconductor device
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W10/041—
-
- H10W10/40—
Landscapes
- Local Oxidation Of Silicon (AREA)
- Element Separation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56142383A JPS5844735A (ja) | 1981-09-11 | 1981-09-11 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56142383A JPS5844735A (ja) | 1981-09-11 | 1981-09-11 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5844735A true JPS5844735A (ja) | 1983-03-15 |
| JPS6359538B2 JPS6359538B2 (index.php) | 1988-11-21 |
Family
ID=15314082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56142383A Granted JPS5844735A (ja) | 1981-09-11 | 1981-09-11 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5844735A (index.php) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4611386A (en) * | 1982-12-27 | 1986-09-16 | Fujitsu Limited | Method of producing a semiconductor device |
| EP0278159A3 (en) * | 1986-11-19 | 1990-03-14 | Plessey Overseas Limited | Method of manufacturing a semiconductor device comprising an isolation structure |
| US5897360A (en) * | 1996-10-21 | 1999-04-27 | Nec Corporation | Manufacturing method of semiconductor integrated circuit |
| KR100256813B1 (ko) * | 1993-12-28 | 2000-05-15 | 김영환 | 반도체소자의 소자분리방법 |
| JP2005051225A (ja) * | 2003-07-10 | 2005-02-24 | Internatl Rectifier Corp | 半導体装置のための、SiまたはSiC上に厚い酸化物を形成する方法 |
-
1981
- 1981-09-11 JP JP56142383A patent/JPS5844735A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4611386A (en) * | 1982-12-27 | 1986-09-16 | Fujitsu Limited | Method of producing a semiconductor device |
| EP0278159A3 (en) * | 1986-11-19 | 1990-03-14 | Plessey Overseas Limited | Method of manufacturing a semiconductor device comprising an isolation structure |
| KR100256813B1 (ko) * | 1993-12-28 | 2000-05-15 | 김영환 | 반도체소자의 소자분리방법 |
| US5897360A (en) * | 1996-10-21 | 1999-04-27 | Nec Corporation | Manufacturing method of semiconductor integrated circuit |
| JP2005051225A (ja) * | 2003-07-10 | 2005-02-24 | Internatl Rectifier Corp | 半導体装置のための、SiまたはSiC上に厚い酸化物を形成する方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6359538B2 (index.php) | 1988-11-21 |
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