JPS58184844U - セラミツクパツケ−ジ - Google Patents

セラミツクパツケ−ジ

Info

Publication number
JPS58184844U
JPS58184844U JP1982081159U JP8115982U JPS58184844U JP S58184844 U JPS58184844 U JP S58184844U JP 1982081159 U JP1982081159 U JP 1982081159U JP 8115982 U JP8115982 U JP 8115982U JP S58184844 U JPS58184844 U JP S58184844U
Authority
JP
Japan
Prior art keywords
ceramic package
terminal
chip
ceramic
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982081159U
Other languages
English (en)
Japanese (ja)
Other versions
JPH041737Y2 (enExample
Inventor
福島　敏高
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1982081159U priority Critical patent/JPS58184844U/ja
Publication of JPS58184844U publication Critical patent/JPS58184844U/ja
Application granted granted Critical
Publication of JPH041737Y2 publication Critical patent/JPH041737Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Landscapes

  • Wire Bonding (AREA)
JP1982081159U 1982-06-01 1982-06-01 セラミツクパツケ−ジ Granted JPS58184844U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982081159U JPS58184844U (ja) 1982-06-01 1982-06-01 セラミツクパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982081159U JPS58184844U (ja) 1982-06-01 1982-06-01 セラミツクパツケ−ジ

Publications (2)

Publication Number Publication Date
JPS58184844U true JPS58184844U (ja) 1983-12-08
JPH041737Y2 JPH041737Y2 (enExample) 1992-01-21

Family

ID=30090280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982081159U Granted JPS58184844U (ja) 1982-06-01 1982-06-01 セラミツクパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS58184844U (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50120577A (enExample) * 1974-03-08 1975-09-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50120577A (enExample) * 1974-03-08 1975-09-20

Also Published As

Publication number Publication date
JPH041737Y2 (enExample) 1992-01-21

Similar Documents

Publication Publication Date Title
JPS5827935U (ja) 混成集積回路装置
JPS58184844U (ja) セラミツクパツケ−ジ
JPS6120051U (ja) 半導体装置の外囲器
JPS60113636U (ja) 半導体集積回路装置
JPS6117751U (ja) テ−プキヤリア半導体装置
JPS58184840U (ja) 半導体装置
JPS63187330U (enExample)
JPS59145047U (ja) 半導体装置
JPS58109254U (ja) フエ−スダウン接続形チツプ用チツプキヤリヤ−
JPS5822741U (ja) 半導体パツケ−ジ
JPS5837152U (ja) 半導体装置
JPS602849U (ja) 集積回路装置
JPS63178340U (enExample)
JPS619844U (ja) 半導体パツケ−ジ
JPS6117743U (ja) 高周波トランジスタ用パツケ−ジ
JPS6094836U (ja) 半導体装置
JPS5878660U (ja) 集積回路
JPS59143051U (ja) 集積回路装置
JPS5881940U (ja) 半導体素子の取付構造
JPS6076040U (ja) 半導体装置
JPS5895054U (ja) 半導体装置
JPS60931U (ja) 半導体装置
JPS585347U (ja) 樹脂封止型半導体装置
JPS58182438U (ja) 半導体装置
JPH01120334U (enExample)