JPS5817705A - 自動車の窓ガラス加熱用導電線を兼ねたアンテナ - Google Patents

自動車の窓ガラス加熱用導電線を兼ねたアンテナ

Info

Publication number
JPS5817705A
JPS5817705A JP56116273A JP11627381A JPS5817705A JP S5817705 A JPS5817705 A JP S5817705A JP 56116273 A JP56116273 A JP 56116273A JP 11627381 A JP11627381 A JP 11627381A JP S5817705 A JPS5817705 A JP S5817705A
Authority
JP
Japan
Prior art keywords
conductive wire
antenna
heating
conductor
window glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56116273A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6367762B2 (enExample
Inventor
Shinko Tsuchie
土江　真弘
Tomihiko Takeoka
竹岡　富彦
Takanobu Nomura
野村　孝信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mazda Motor Corp
Original Assignee
Mazda Motor Corp
Toyo Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mazda Motor Corp, Toyo Kogyo Co Ltd filed Critical Mazda Motor Corp
Priority to JP56116273A priority Critical patent/JPS5817705A/ja
Priority to US06/400,677 priority patent/US4491844A/en
Publication of JPS5817705A publication Critical patent/JPS5817705A/ja
Publication of JPS6367762B2 publication Critical patent/JPS6367762B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/1271—Supports; Mounting means for mounting on windscreens
    • H01Q1/1278—Supports; Mounting means for mounting on windscreens in association with heating wires or layers

Landscapes

  • Details Of Aerials (AREA)
JP56116273A 1981-07-23 1981-07-23 自動車の窓ガラス加熱用導電線を兼ねたアンテナ Granted JPS5817705A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP56116273A JPS5817705A (ja) 1981-07-23 1981-07-23 自動車の窓ガラス加熱用導電線を兼ねたアンテナ
US06/400,677 US4491844A (en) 1981-07-23 1982-07-22 Automobile antenna windshield

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56116273A JPS5817705A (ja) 1981-07-23 1981-07-23 自動車の窓ガラス加熱用導電線を兼ねたアンテナ

Publications (2)

Publication Number Publication Date
JPS5817705A true JPS5817705A (ja) 1983-02-02
JPS6367762B2 JPS6367762B2 (enExample) 1988-12-27

Family

ID=14682989

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56116273A Granted JPS5817705A (ja) 1981-07-23 1981-07-23 自動車の窓ガラス加熱用導電線を兼ねたアンテナ

Country Status (2)

Country Link
US (1) US4491844A (enExample)
JP (1) JPS5817705A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6187692U (enExample) * 1984-11-15 1986-06-07
JPH02504453A (ja) * 1987-05-21 1990-12-13 ビー・エス・エイチ、エレクトロニクス、リミテッド 車輌用アンテナ

Families Citing this family (69)

* Cited by examiner, † Cited by third party
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US4608570A (en) * 1982-11-18 1986-08-26 Central Glass Company, Limited Automotive window glass antenna
US4903035A (en) * 1983-12-20 1990-02-20 Bsh Electronics, Ltd. Electrical signal separating device having isolating and matching circuitry
US4928108A (en) * 1983-12-20 1990-05-22 Bsh Electronics, Ltd. Electrical signal separating device having isolating and matching circuitry for split passband matching
US4903034A (en) * 1983-12-20 1990-02-20 Bsh Electronics, Ltd. Electrical signal separating device having isolating and matching circuitry
JPS61100004A (ja) * 1984-10-22 1986-05-19 Nippon Sheet Glass Co Ltd アンテナ素子付自動車用窓ガラス
GB2173644B (en) * 1985-03-30 1989-06-28 Bsh Electronics Ltd Signal separating device
JPH032975Y2 (enExample) * 1985-05-30 1991-01-25
EP0629018A3 (en) * 1988-07-14 1995-06-14 Asahi Glass Co Ltd Motor vehicle antenna.
DE3917829A1 (de) * 1989-06-01 1990-12-06 Flachglas Ag Kraftfahrzeugscheibe, insbesondere fuer ein heckfenster, mit einer mehrzahl von heizleitern und antennenleitern
JPH04249407A (ja) * 1991-02-05 1992-09-04 Harada Ind Co Ltd 自動車用ガラスアンテナ
JPH04298102A (ja) * 1991-03-26 1992-10-21 Nippon Sheet Glass Co Ltd 自動車用ガラスアンテナ
DE69427506T2 (de) * 1993-08-20 2001-10-04 Asahi Glass Co. Ltd., Tokio/Tokyo Scheibenantenne für ein Automobil
US6150985A (en) * 1995-05-24 2000-11-21 R. A. Van De Velde And Associates Antenna for a cellular phone
US5867093A (en) * 1996-10-02 1999-02-02 Identec Limited Communication system for vehicles with aerial incorporated in steering wheel
US6893900B1 (en) 1998-06-24 2005-05-17 Amkor Technology, Inc. Method of making an integrated circuit package
US7071541B1 (en) 1998-06-24 2006-07-04 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7332375B1 (en) 1998-06-24 2008-02-19 Amkor Technology, Inc. Method of making an integrated circuit package
US7112474B1 (en) 1998-06-24 2006-09-26 Amkor Technology, Inc. Method of making an integrated circuit package
US7005326B1 (en) 1998-06-24 2006-02-28 Amkor Technology, Inc. Method of making an integrated circuit package
US6143981A (en) 1998-06-24 2000-11-07 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7030474B1 (en) 1998-06-24 2006-04-18 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
JP2000164788A (ja) 1998-11-20 2000-06-16 Anam Semiconductor Inc 半導体パッケ―ジ用リ―ドフレ―ムとこれを用いた半導体パッケ―ジ及びその製造方法
KR20010037247A (ko) 1999-10-15 2001-05-07 마이클 디. 오브라이언 반도체패키지
KR100403142B1 (ko) 1999-10-15 2003-10-30 앰코 테크놀로지 코리아 주식회사 반도체패키지
US6580159B1 (en) 1999-11-05 2003-06-17 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US6847103B1 (en) 1999-11-09 2005-01-25 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
MXPA02007453A (es) * 2000-02-11 2002-12-13 Ppg Ind Ohio Inc Antena de vehiculo.
KR100583494B1 (ko) 2000-03-25 2006-05-24 앰코 테크놀로지 코리아 주식회사 반도체패키지
KR20020058209A (ko) 2000-12-29 2002-07-12 마이클 디. 오브라이언 반도체패키지
US6967395B1 (en) 2001-03-20 2005-11-22 Amkor Technology, Inc. Mounting for a package containing a chip
KR100393448B1 (ko) 2001-03-27 2003-08-02 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조 방법
KR100369393B1 (ko) 2001-03-27 2003-02-05 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지와 그 제조 방법
US7045883B1 (en) 2001-04-04 2006-05-16 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US6597059B1 (en) 2001-04-04 2003-07-22 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package
US7064009B1 (en) 2001-04-04 2006-06-20 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US6900527B1 (en) 2001-09-19 2005-05-31 Amkor Technology, Inc. Lead-frame method and assembly for interconnecting circuits within a circuit module
US7485952B1 (en) 2001-09-19 2009-02-03 Amkor Technology, Inc. Drop resistant bumpers for fully molded memory cards
US6630726B1 (en) 2001-11-07 2003-10-07 Amkor Technology, Inc. Power semiconductor package with strap
US6790104B2 (en) * 2002-07-26 2004-09-14 Antaya Technologies Corporation Electrical terminal
US6818973B1 (en) 2002-09-09 2004-11-16 Amkor Technology, Inc. Exposed lead QFP package fabricated through the use of a partial saw process
US6905914B1 (en) 2002-11-08 2005-06-14 Amkor Technology, Inc. Wafer level package and fabrication method
US7190062B1 (en) 2004-06-15 2007-03-13 Amkor Technology, Inc. Embedded leadframe semiconductor package
US7361533B1 (en) 2002-11-08 2008-04-22 Amkor Technology, Inc. Stacked embedded leadframe
US6847099B1 (en) 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package
US7001799B1 (en) 2003-03-13 2006-02-21 Amkor Technology, Inc. Method of making a leadframe for semiconductor devices
US6794740B1 (en) 2003-03-13 2004-09-21 Amkor Technology, Inc. Leadframe package for semiconductor devices
US7008825B1 (en) 2003-05-27 2006-03-07 Amkor Technology, Inc. Leadframe strip having enhanced testability
US7245007B1 (en) 2003-09-18 2007-07-17 Amkor Technology, Inc. Exposed lead interposer leadframe package
US6921967B2 (en) 2003-09-24 2005-07-26 Amkor Technology, Inc. Reinforced die pad support structure
US7144517B1 (en) 2003-11-07 2006-12-05 Amkor Technology, Inc. Manufacturing method for leadframe and for semiconductor package using the leadframe
US7211879B1 (en) 2003-11-12 2007-05-01 Amkor Technology, Inc. Semiconductor package with chamfered corners and method of manufacturing the same
US7057268B1 (en) 2004-01-27 2006-06-06 Amkor Technology, Inc. Cavity case with clip/plug for use on multi-media card
US7091594B1 (en) 2004-01-28 2006-08-15 Amkor Technology, Inc. Leadframe type semiconductor package having reduced inductance and its manufacturing method
US20100026590A1 (en) * 2004-07-28 2010-02-04 Kuo-Ching Chiang Thin film multi-band antenna
US7202554B1 (en) 2004-08-19 2007-04-10 Amkor Technology, Inc. Semiconductor package and its manufacturing method
US7217991B1 (en) 2004-10-22 2007-05-15 Amkor Technology, Inc. Fan-in leadframe semiconductor package
US7507603B1 (en) 2005-12-02 2009-03-24 Amkor Technology, Inc. Etch singulated semiconductor package
US7572681B1 (en) 2005-12-08 2009-08-11 Amkor Technology, Inc. Embedded electronic component package
US7723852B1 (en) 2008-01-21 2010-05-25 Amkor Technology, Inc. Stacked semiconductor package and method of making same
US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US8487445B1 (en) 2010-10-05 2013-07-16 Amkor Technology, Inc. Semiconductor device having through electrodes protruding from dielectric layer
US8390130B1 (en) 2011-01-06 2013-03-05 Amkor Technology, Inc. Through via recessed reveal structure and method
US8552548B1 (en) 2011-11-29 2013-10-08 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method
KR101486790B1 (ko) 2013-05-02 2015-01-28 앰코 테크놀로지 코리아 주식회사 강성보강부를 갖는 마이크로 리드프레임
KR101563911B1 (ko) 2013-10-24 2015-10-28 앰코 테크놀로지 코리아 주식회사 반도체 패키지

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52147622A (en) * 1976-06-03 1977-12-08 Toyota Motor Co Ltd Window glass having defogger hot wire for vehicles
US4063247A (en) * 1976-10-07 1977-12-13 Nippon Sheet Glass Co., Ltd. Heater glass sheet with broad band receiver antennae
JPS6010793B2 (ja) * 1980-07-18 1985-03-20 三菱電機株式会社 樹脂被覆方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6187692U (enExample) * 1984-11-15 1986-06-07
JPH02504453A (ja) * 1987-05-21 1990-12-13 ビー・エス・エイチ、エレクトロニクス、リミテッド 車輌用アンテナ

Also Published As

Publication number Publication date
JPS6367762B2 (enExample) 1988-12-27
US4491844A (en) 1985-01-01

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