JPS6367762B2 - - Google Patents

Info

Publication number
JPS6367762B2
JPS6367762B2 JP56116273A JP11627381A JPS6367762B2 JP S6367762 B2 JPS6367762 B2 JP S6367762B2 JP 56116273 A JP56116273 A JP 56116273A JP 11627381 A JP11627381 A JP 11627381A JP S6367762 B2 JPS6367762 B2 JP S6367762B2
Authority
JP
Japan
Prior art keywords
conductive wire
heating
receiving antenna
serves
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56116273A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5817705A (ja
Inventor
Shinko Tsuche
Tomihiko Takeoka
Takanobu Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mazda Motor Corp
Original Assignee
Mazda Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mazda Motor Corp filed Critical Mazda Motor Corp
Priority to JP56116273A priority Critical patent/JPS5817705A/ja
Priority to US06/400,677 priority patent/US4491844A/en
Publication of JPS5817705A publication Critical patent/JPS5817705A/ja
Publication of JPS6367762B2 publication Critical patent/JPS6367762B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/1271—Supports; Mounting means for mounting on windscreens
    • H01Q1/1278—Supports; Mounting means for mounting on windscreens in association with heating wires or layers

Landscapes

  • Details Of Aerials (AREA)
JP56116273A 1981-07-23 1981-07-23 自動車の窓ガラス加熱用導電線を兼ねたアンテナ Granted JPS5817705A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP56116273A JPS5817705A (ja) 1981-07-23 1981-07-23 自動車の窓ガラス加熱用導電線を兼ねたアンテナ
US06/400,677 US4491844A (en) 1981-07-23 1982-07-22 Automobile antenna windshield

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56116273A JPS5817705A (ja) 1981-07-23 1981-07-23 自動車の窓ガラス加熱用導電線を兼ねたアンテナ

Publications (2)

Publication Number Publication Date
JPS5817705A JPS5817705A (ja) 1983-02-02
JPS6367762B2 true JPS6367762B2 (enExample) 1988-12-27

Family

ID=14682989

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56116273A Granted JPS5817705A (ja) 1981-07-23 1981-07-23 自動車の窓ガラス加熱用導電線を兼ねたアンテナ

Country Status (2)

Country Link
US (1) US4491844A (enExample)
JP (1) JPS5817705A (enExample)

Cited By (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6844615B1 (en) 2003-03-13 2005-01-18 Amkor Technology, Inc. Leadframe package for semiconductor devices
US6846704B2 (en) 2001-03-27 2005-01-25 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
US6873041B1 (en) 2001-11-07 2005-03-29 Amkor Technology, Inc. Power semiconductor package with strap
US6873032B1 (en) 2001-04-04 2005-03-29 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US6893900B1 (en) 1998-06-24 2005-05-17 Amkor Technology, Inc. Method of making an integrated circuit package
US6921967B2 (en) 2003-09-24 2005-07-26 Amkor Technology, Inc. Reinforced die pad support structure
US6953988B2 (en) 2000-03-25 2005-10-11 Amkor Technology, Inc. Semiconductor package
US6965157B1 (en) 1999-11-09 2005-11-15 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US6967395B1 (en) 2001-03-20 2005-11-22 Amkor Technology, Inc. Mounting for a package containing a chip
US6995459B2 (en) 2002-09-09 2006-02-07 Amkor Technology, Inc. Semiconductor package with increased number of input and output pins
US6998702B1 (en) 2001-09-19 2006-02-14 Amkor Technology, Inc. Front edge chamfer feature for fully-molded memory cards
US7001799B1 (en) 2003-03-13 2006-02-21 Amkor Technology, Inc. Method of making a leadframe for semiconductor devices
US7005326B1 (en) 1998-06-24 2006-02-28 Amkor Technology, Inc. Method of making an integrated circuit package
US7008825B1 (en) 2003-05-27 2006-03-07 Amkor Technology, Inc. Leadframe strip having enhanced testability
US7030474B1 (en) 1998-06-24 2006-04-18 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7045883B1 (en) 2001-04-04 2006-05-16 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US7045882B2 (en) 2000-12-29 2006-05-16 Amkor Technology, Inc. Semiconductor package including flip chip
US7057280B2 (en) 1998-11-20 2006-06-06 Amkor Technology, Inc. Leadframe having lead locks to secure leads to encapsulant
US7057268B1 (en) 2004-01-27 2006-06-06 Amkor Technology, Inc. Cavity case with clip/plug for use on multi-media card
US7064009B1 (en) 2001-04-04 2006-06-20 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US7067908B2 (en) 1999-10-15 2006-06-27 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
US7071541B1 (en) 1998-06-24 2006-07-04 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7091594B1 (en) 2004-01-28 2006-08-15 Amkor Technology, Inc. Leadframe type semiconductor package having reduced inductance and its manufacturing method
US7112474B1 (en) 1998-06-24 2006-09-26 Amkor Technology, Inc. Method of making an integrated circuit package
US7115445B2 (en) 1999-10-15 2006-10-03 Amkor Technology, Inc. Semiconductor package having reduced thickness
US7144517B1 (en) 2003-11-07 2006-12-05 Amkor Technology, Inc. Manufacturing method for leadframe and for semiconductor package using the leadframe
US7170150B2 (en) 2001-03-27 2007-01-30 Amkor Technology, Inc. Lead frame for semiconductor package
US7190062B1 (en) 2004-06-15 2007-03-13 Amkor Technology, Inc. Embedded leadframe semiconductor package
US7192807B1 (en) 2002-11-08 2007-03-20 Amkor Technology, Inc. Wafer level package and fabrication method
US7202554B1 (en) 2004-08-19 2007-04-10 Amkor Technology, Inc. Semiconductor package and its manufacturing method
US7211879B1 (en) 2003-11-12 2007-05-01 Amkor Technology, Inc. Semiconductor package with chamfered corners and method of manufacturing the same
US7217991B1 (en) 2004-10-22 2007-05-15 Amkor Technology, Inc. Fan-in leadframe semiconductor package
US7245007B1 (en) 2003-09-18 2007-07-17 Amkor Technology, Inc. Exposed lead interposer leadframe package
US7253503B1 (en) 1999-11-05 2007-08-07 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US7332375B1 (en) 1998-06-24 2008-02-19 Amkor Technology, Inc. Method of making an integrated circuit package
US7361533B1 (en) 2002-11-08 2008-04-22 Amkor Technology, Inc. Stacked embedded leadframe
US7485952B1 (en) 2001-09-19 2009-02-03 Amkor Technology, Inc. Drop resistant bumpers for fully molded memory cards
US7507603B1 (en) 2005-12-02 2009-03-24 Amkor Technology, Inc. Etch singulated semiconductor package
US7572681B1 (en) 2005-12-08 2009-08-11 Amkor Technology, Inc. Embedded electronic component package
US7598598B1 (en) 2003-02-05 2009-10-06 Amkor Technology, Inc. Offset etched corner leads for semiconductor package
US7906855B1 (en) 2008-01-21 2011-03-15 Amkor Technology, Inc. Stacked semiconductor package and method of making same
US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US8853836B1 (en) 1998-06-24 2014-10-07 Amkor Technology, Inc. Integrated circuit package and method of making the same
US8900995B1 (en) 2010-10-05 2014-12-02 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method
US9082833B1 (en) 2011-01-06 2015-07-14 Amkor Technology, Inc. Through via recessed reveal structure and method
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
US9184118B2 (en) 2013-05-02 2015-11-10 Amkor Technology Inc. Micro lead frame structure having reinforcing portions and method
US9543235B2 (en) 2013-10-24 2017-01-10 Amkor Technology, Inc. Semiconductor package and method therefor
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US12494414B2 (en) 2024-01-08 2025-12-09 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor device with through-mold via

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4608570A (en) * 1982-11-18 1986-08-26 Central Glass Company, Limited Automotive window glass antenna
US4903035A (en) * 1983-12-20 1990-02-20 Bsh Electronics, Ltd. Electrical signal separating device having isolating and matching circuitry
US4903034A (en) * 1983-12-20 1990-02-20 Bsh Electronics, Ltd. Electrical signal separating device having isolating and matching circuitry
US4928108A (en) * 1983-12-20 1990-05-22 Bsh Electronics, Ltd. Electrical signal separating device having isolating and matching circuitry for split passband matching
JPS61100004A (ja) * 1984-10-22 1986-05-19 Nippon Sheet Glass Co Ltd アンテナ素子付自動車用窓ガラス
JPS6187692U (enExample) * 1984-11-15 1986-06-07
GB2173644B (en) * 1985-03-30 1989-06-28 Bsh Electronics Ltd Signal separating device
JPH032975Y2 (enExample) * 1985-05-30 1991-01-25
GB8711995D0 (en) * 1987-05-21 1987-06-24 Bsh Electronics Ltd Vehicle antenna
EP0629018A3 (en) * 1988-07-14 1995-06-14 Asahi Glass Co Ltd Motor vehicle antenna.
DE3917829A1 (de) * 1989-06-01 1990-12-06 Flachglas Ag Kraftfahrzeugscheibe, insbesondere fuer ein heckfenster, mit einer mehrzahl von heizleitern und antennenleitern
JPH04249407A (ja) * 1991-02-05 1992-09-04 Harada Ind Co Ltd 自動車用ガラスアンテナ
JPH04298102A (ja) * 1991-03-26 1992-10-21 Nippon Sheet Glass Co Ltd 自動車用ガラスアンテナ
EP0639868B1 (en) * 1993-08-20 2001-06-20 Asahi Glass Company Ltd. Glass antenna device for an automobile
US6150985A (en) * 1995-05-24 2000-11-21 R. A. Van De Velde And Associates Antenna for a cellular phone
US5867093A (en) * 1996-10-02 1999-02-02 Identec Limited Communication system for vehicles with aerial incorporated in steering wheel
WO2001059875A2 (en) * 2000-02-11 2001-08-16 Ppg Industries Ohio, Inc. Vehicle antenna
US6790104B2 (en) 2002-07-26 2004-09-14 Antaya Technologies Corporation Electrical terminal
US20100026590A1 (en) * 2004-07-28 2010-02-04 Kuo-Ching Chiang Thin film multi-band antenna

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52147622A (en) * 1976-06-03 1977-12-08 Toyota Motor Co Ltd Window glass having defogger hot wire for vehicles
US4063247A (en) * 1976-10-07 1977-12-13 Nippon Sheet Glass Co., Ltd. Heater glass sheet with broad band receiver antennae
JPS6010793B2 (ja) * 1980-07-18 1985-03-20 三菱電機株式会社 樹脂被覆方法

Cited By (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7005326B1 (en) 1998-06-24 2006-02-28 Amkor Technology, Inc. Method of making an integrated circuit package
US7332375B1 (en) 1998-06-24 2008-02-19 Amkor Technology, Inc. Method of making an integrated circuit package
US7560804B1 (en) 1998-06-24 2009-07-14 Amkor Technology, Inc. Integrated circuit package and method of making the same
US6893900B1 (en) 1998-06-24 2005-05-17 Amkor Technology, Inc. Method of making an integrated circuit package
US8853836B1 (en) 1998-06-24 2014-10-07 Amkor Technology, Inc. Integrated circuit package and method of making the same
US8963301B1 (en) 1998-06-24 2015-02-24 Amkor Technology, Inc. Integrated circuit package and method of making the same
US7112474B1 (en) 1998-06-24 2006-09-26 Amkor Technology, Inc. Method of making an integrated circuit package
US7071541B1 (en) 1998-06-24 2006-07-04 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US9224676B1 (en) 1998-06-24 2015-12-29 Amkor Technology, Inc. Integrated circuit package and method of making the same
US7030474B1 (en) 1998-06-24 2006-04-18 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7564122B2 (en) 1998-11-20 2009-07-21 Amkor Technology, Inc. Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
US7057280B2 (en) 1998-11-20 2006-06-06 Amkor Technology, Inc. Leadframe having lead locks to secure leads to encapsulant
US7067908B2 (en) 1999-10-15 2006-06-27 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
US7115445B2 (en) 1999-10-15 2006-10-03 Amkor Technology, Inc. Semiconductor package having reduced thickness
US7321162B1 (en) 1999-10-15 2008-01-22 Amkor Technology, Inc. Semiconductor package having reduced thickness
US7535085B2 (en) 1999-10-15 2009-05-19 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
US7253503B1 (en) 1999-11-05 2007-08-07 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US6965157B1 (en) 1999-11-09 2005-11-15 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US6953988B2 (en) 2000-03-25 2005-10-11 Amkor Technology, Inc. Semiconductor package
US7045882B2 (en) 2000-12-29 2006-05-16 Amkor Technology, Inc. Semiconductor package including flip chip
US6967395B1 (en) 2001-03-20 2005-11-22 Amkor Technology, Inc. Mounting for a package containing a chip
US7521294B2 (en) 2001-03-27 2009-04-21 Amkor Technology, Inc. Lead frame for semiconductor package
US6846704B2 (en) 2001-03-27 2005-01-25 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
US7170150B2 (en) 2001-03-27 2007-01-30 Amkor Technology, Inc. Lead frame for semiconductor package
US7064009B1 (en) 2001-04-04 2006-06-20 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US6873032B1 (en) 2001-04-04 2005-03-29 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US7045883B1 (en) 2001-04-04 2006-05-16 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US7176062B1 (en) 2001-09-19 2007-02-13 Amkor Technology, Inc. Lead-frame method and assembly for interconnecting circuits within a circuit module
US6998702B1 (en) 2001-09-19 2006-02-14 Amkor Technology, Inc. Front edge chamfer feature for fully-molded memory cards
US7485952B1 (en) 2001-09-19 2009-02-03 Amkor Technology, Inc. Drop resistant bumpers for fully molded memory cards
US6873041B1 (en) 2001-11-07 2005-03-29 Amkor Technology, Inc. Power semiconductor package with strap
US7211471B1 (en) 2002-09-09 2007-05-01 Amkor Technology, Inc. Exposed lead QFP package fabricated through the use of a partial saw process
US6995459B2 (en) 2002-09-09 2006-02-07 Amkor Technology, Inc. Semiconductor package with increased number of input and output pins
US9054117B1 (en) 2002-11-08 2015-06-09 Amkor Technology, Inc. Wafer level package and fabrication method
US7192807B1 (en) 2002-11-08 2007-03-20 Amkor Technology, Inc. Wafer level package and fabrication method
US7420272B1 (en) 2002-11-08 2008-09-02 Amkor Technology, Inc. Two-sided wafer escape package
US7247523B1 (en) 2002-11-08 2007-07-24 Amkor Technology, Inc. Two-sided wafer escape package
US8952522B1 (en) 2002-11-08 2015-02-10 Amkor Technology, Inc. Wafer level package and fabrication method
US7361533B1 (en) 2002-11-08 2008-04-22 Amkor Technology, Inc. Stacked embedded leadframe
US7598598B1 (en) 2003-02-05 2009-10-06 Amkor Technology, Inc. Offset etched corner leads for semiconductor package
US7001799B1 (en) 2003-03-13 2006-02-21 Amkor Technology, Inc. Method of making a leadframe for semiconductor devices
US6844615B1 (en) 2003-03-13 2005-01-18 Amkor Technology, Inc. Leadframe package for semiconductor devices
US7008825B1 (en) 2003-05-27 2006-03-07 Amkor Technology, Inc. Leadframe strip having enhanced testability
US7245007B1 (en) 2003-09-18 2007-07-17 Amkor Technology, Inc. Exposed lead interposer leadframe package
US6921967B2 (en) 2003-09-24 2005-07-26 Amkor Technology, Inc. Reinforced die pad support structure
US7214326B1 (en) 2003-11-07 2007-05-08 Amkor Technology, Inc. Increased capacity leadframe and semiconductor package using the same
US7144517B1 (en) 2003-11-07 2006-12-05 Amkor Technology, Inc. Manufacturing method for leadframe and for semiconductor package using the leadframe
US7211879B1 (en) 2003-11-12 2007-05-01 Amkor Technology, Inc. Semiconductor package with chamfered corners and method of manufacturing the same
US7057268B1 (en) 2004-01-27 2006-06-06 Amkor Technology, Inc. Cavity case with clip/plug for use on multi-media card
US7091594B1 (en) 2004-01-28 2006-08-15 Amkor Technology, Inc. Leadframe type semiconductor package having reduced inductance and its manufacturing method
US7190062B1 (en) 2004-06-15 2007-03-13 Amkor Technology, Inc. Embedded leadframe semiconductor package
US7202554B1 (en) 2004-08-19 2007-04-10 Amkor Technology, Inc. Semiconductor package and its manufacturing method
US7473584B1 (en) 2004-10-22 2009-01-06 Amkor Technology, Inc. Method for fabricating a fan-in leadframe semiconductor package
US7217991B1 (en) 2004-10-22 2007-05-15 Amkor Technology, Inc. Fan-in leadframe semiconductor package
US7507603B1 (en) 2005-12-02 2009-03-24 Amkor Technology, Inc. Etch singulated semiconductor package
US7572681B1 (en) 2005-12-08 2009-08-11 Amkor Technology, Inc. Embedded electronic component package
US7906855B1 (en) 2008-01-21 2011-03-15 Amkor Technology, Inc. Stacked semiconductor package and method of making same
US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US8900995B1 (en) 2010-10-05 2014-12-02 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US9082833B1 (en) 2011-01-06 2015-07-14 Amkor Technology, Inc. Through via recessed reveal structure and method
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
US9184118B2 (en) 2013-05-02 2015-11-10 Amkor Technology Inc. Micro lead frame structure having reinforcing portions and method
US9543235B2 (en) 2013-10-24 2017-01-10 Amkor Technology, Inc. Semiconductor package and method therefor
US12494414B2 (en) 2024-01-08 2025-12-09 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor device with through-mold via

Also Published As

Publication number Publication date
US4491844A (en) 1985-01-01
JPS5817705A (ja) 1983-02-02

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