JPS58144855U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS58144855U JPS58144855U JP4288082U JP4288082U JPS58144855U JP S58144855 U JPS58144855 U JP S58144855U JP 4288082 U JP4288082 U JP 4288082U JP 4288082 U JP4288082 U JP 4288082U JP S58144855 U JPS58144855 U JP S58144855U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- metal plate
- external lead
- semiconductor equipment
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図は本考案実施例の透視平面図、第２図は第１図に
おけるＡ−Ａ断面図である。 １・・・・・・金属板、１ａ・・・・・・第１の外部リ
ード、２・・・・・・半導体素子、３・・・・・・樹脂
、８・・・・・・溝。
おけるＡ−Ａ断面図である。 １・・・・・・金属板、１ａ・・・・・・第１の外部リ
ード、２・・・・・・半導体素子、３・・・・・・樹脂
、８・・・・・・溝。
Claims (1)
- 外部リードが一体に形成された金属板の一面に半導体素
子を固着し、その半導体素子を覆うよう樹脂でモールド
してなる半導体装置において、上記金属板の半導体素子
固着部から上記外部リードに至る間の上記金属板表面の
上記樹脂との接合面に、上記半導体素子から上部外部リ
ードに至る方向を横切る方向に凹凸を設けたことを特徴
とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4288082U JPS58144855U (ja) | 1982-03-25 | 1982-03-25 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4288082U JPS58144855U (ja) | 1982-03-25 | 1982-03-25 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58144855U true JPS58144855U (ja) | 1983-09-29 |
Family
ID=30053985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4288082U Pending JPS58144855U (ja) | 1982-03-25 | 1982-03-25 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58144855U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017179448A1 (ja) * | 2016-04-14 | 2017-10-19 | 株式会社東海理化電機製作所 | 半導体装置 |
| WO2017199647A1 (ja) * | 2016-05-16 | 2017-11-23 | 株式会社デンソー | 電子装置 |
-
1982
- 1982-03-25 JP JP4288082U patent/JPS58144855U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017179448A1 (ja) * | 2016-04-14 | 2017-10-19 | 株式会社東海理化電機製作所 | 半導体装置 |
| WO2017199647A1 (ja) * | 2016-05-16 | 2017-11-23 | 株式会社デンソー | 電子装置 |
| JP2017208385A (ja) * | 2016-05-16 | 2017-11-24 | 株式会社デンソー | 電子装置 |
| US10692792B2 (en) | 2016-05-16 | 2020-06-23 | Denso Corporation | Electronic device |
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