JPS578177A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS578177A JPS578177A JP8262780A JP8262780A JPS578177A JP S578177 A JPS578177 A JP S578177A JP 8262780 A JP8262780 A JP 8262780A JP 8262780 A JP8262780 A JP 8262780A JP S578177 A JPS578177 A JP S578177A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- wires
- gate
- heating elements
- thermal head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
- Facsimile Heads (AREA)
Abstract
PURPOSE:To provide a fast recordable thermal head with simplification of various wirings by arranging a signal wire, a clock wire and power supply wires of logic circuits between a gate wire and a grounding wire which are formed at a specified position to be connected to several heating elements. CONSTITUTION:Several gate wires 4 are formed at the position the farthest from a plurality of heating elements 1 aligned and a grounding wire 8 at the position the closest thereto respectively parallel with the heating element 1. At least signals 5 and 5', two clock wires 6 and 6' and a power supply wire 7 of logic circuits are arranged in an area between the gate wires 4 and the grounding wire 8. The first of the gate wires 4 is arranged at the position the closest to the heating elements 1 in such a length that it can be connected to a gate terminal of silicone chips 3 No. to No.M. The signal wire 5 is connected to a signal input terminal D.IN of silicon chips 3 No.1, No.M+1....
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8262780A JPS578177A (en) | 1980-06-17 | 1980-06-17 | Thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8262780A JPS578177A (en) | 1980-06-17 | 1980-06-17 | Thermal head |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS578177A true JPS578177A (en) | 1982-01-16 |
JPS6250313B2 JPS6250313B2 (en) | 1987-10-23 |
Family
ID=13779677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8262780A Granted JPS578177A (en) | 1980-06-17 | 1980-06-17 | Thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS578177A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58153672A (en) * | 1982-03-10 | 1983-09-12 | Nippon Telegr & Teleph Corp <Ntt> | Recording head with built-in thin film transistor circuit |
JPS58138633U (en) * | 1982-03-15 | 1983-09-17 | 京セラ株式会社 | thermal head |
JPS58160165A (en) * | 1982-03-18 | 1983-09-22 | Mitsubishi Electric Corp | Thermal head |
JPS58166072A (en) * | 1982-03-29 | 1983-10-01 | Toshiba Corp | Thermal head |
JPS58179666A (en) * | 1982-04-15 | 1983-10-20 | Nippon Telegr & Teleph Corp <Ntt> | Thermal head with plural heating element arrays |
JPS58205780A (en) * | 1982-05-26 | 1983-11-30 | Toshiba Corp | Heat sensitive printing head |
JPS59146139U (en) * | 1983-03-22 | 1984-09-29 | セイコーインスツルメンツ株式会社 | Driver-IC mounted recording/display element |
JPS6015174A (en) * | 1983-06-27 | 1985-01-25 | テレタイプ・コ−ポレ−シヨン | Thermal printing head |
JPS60110471A (en) * | 1983-11-21 | 1985-06-15 | Konishiroku Photo Ind Co Ltd | Thermal recording head |
-
1980
- 1980-06-17 JP JP8262780A patent/JPS578177A/en active Granted
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58153672A (en) * | 1982-03-10 | 1983-09-12 | Nippon Telegr & Teleph Corp <Ntt> | Recording head with built-in thin film transistor circuit |
JPS58138633U (en) * | 1982-03-15 | 1983-09-17 | 京セラ株式会社 | thermal head |
JPS58160165A (en) * | 1982-03-18 | 1983-09-22 | Mitsubishi Electric Corp | Thermal head |
JPS58166072A (en) * | 1982-03-29 | 1983-10-01 | Toshiba Corp | Thermal head |
JPS6363384B2 (en) * | 1982-03-29 | 1988-12-07 | ||
JPS58179666A (en) * | 1982-04-15 | 1983-10-20 | Nippon Telegr & Teleph Corp <Ntt> | Thermal head with plural heating element arrays |
JPS58205780A (en) * | 1982-05-26 | 1983-11-30 | Toshiba Corp | Heat sensitive printing head |
JPS59146139U (en) * | 1983-03-22 | 1984-09-29 | セイコーインスツルメンツ株式会社 | Driver-IC mounted recording/display element |
JPS6015174A (en) * | 1983-06-27 | 1985-01-25 | テレタイプ・コ−ポレ−シヨン | Thermal printing head |
JPS60110471A (en) * | 1983-11-21 | 1985-06-15 | Konishiroku Photo Ind Co Ltd | Thermal recording head |
JPH055670B2 (en) * | 1983-11-21 | 1993-01-22 | Konishiroku Photo Ind |
Also Published As
Publication number | Publication date |
---|---|
JPS6250313B2 (en) | 1987-10-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW371358B (en) | Semiconductor device | |
JPS578177A (en) | Thermal head | |
CA2111367A1 (en) | Semiconductor Integrated Circuit Device | |
EP0361825A3 (en) | Semiconductor chip and method of manufacturing it | |
JPS578179A (en) | Thermal head | |
JPS57121250A (en) | Semiconductor integrated circuit | |
DE69015847D1 (en) | Recording device and recording head substrate for use therein. | |
JPS5423484A (en) | Semiconductor integrated circuit and its manufacture | |
JPS578178A (en) | Thermal head | |
JPS578180A (en) | Thermal head | |
IE811262L (en) | Semiconductor integrated circuit devices | |
JPS57126154A (en) | Lsi package | |
JPS5661151A (en) | Package semiconductor integrated circuit | |
EP0139364A3 (en) | Multiple path signal distribution to large scale integration chips | |
JPS5712574A (en) | Superconductive integrated circuit chip | |
JPS57154861A (en) | Package | |
JPS5717146A (en) | Wiring for semiconductor element | |
JPS57111044A (en) | Master-slice type lsi device | |
JPS5543840A (en) | Power distributing structure of iil element | |
JPS5561041A (en) | Packaging device for semiconductor integrated circuit | |
JPS5617036A (en) | Semiconductor device | |
JPS6467361A (en) | Thermal head | |
JPS57164557A (en) | Integrated circuit device | |
JPS5642669A (en) | Thermal printer head | |
JPS5578561A (en) | Master-slice lsi circuit device |