JPS578180A - Thermal head - Google Patents

Abstract

PURPOSE:To provide a fast recordable thermal head with simplification of various wirings by arranging a signal wire, a clock wire and power supply wires of logic circuits between a gate wire and a grounding wire which are formed at a specified position to be connected to several heating elements. CONSTITUTION:Power supply wire 7 of logic circuits and grounding wire 8 are arranged parallel with a plurality of heating elements 1 aligned at least by a length equal to the array length of the heating elements 1. At least a gate wire 4, a signal wire 5 and a clock wire are arranged in an area between the power supply wire 7 and the grounding wire 8. As the power wire 7 of logic circuits, the grounding wire 8, the gate wire 4 and the clock wire 6 are common to all silicon chips, they are continuous in arrangement. However, the signals 5 and 5' are arranged two per one silicon chip with one serving a signal input wire and the other a signal output wire. The connections with the silicon chips (fat line) numbers 6 per chip and all exist in an area between the power supply wire 7 of the logic circuit and the grounding line 8.