JPS578179A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS578179A JPS578179A JP8262280A JP8262280A JPS578179A JP S578179 A JPS578179 A JP S578179A JP 8262280 A JP8262280 A JP 8262280A JP 8262280 A JP8262280 A JP 8262280A JP S578179 A JPS578179 A JP S578179A
- Authority
- JP
- Japan
- Prior art keywords
- wires
- wire
- gate
- heating elements
- grounding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
- Facsimile Heads (AREA)
Abstract
PURPOSE:To provide a fast recordable thermal head with simplification of various wirings by arranging a signal wire, a clock wire and power supply wires of logic circuits between a gate wire and a grounding wire which are formed at a specified position to be connected to several heating elements. CONSTITUTION:Several gate wires 4 are formed at the position the closest to a plurality of heating elements 1 aligned and grounding wires 8 at the position farthest therefrom respectively parallel with the heating elements 1. At least, signal wires 5 and 5', two clock wires 6 and 6' and a power supply wire 7 of a logic circuits are arranged in an area between gate wires 4 and the grounding wires 8. The first of the gate wires is arranged at the position the farthest from the heating elements 1 in such a length that it can be connected to a gate terminal of a silicon chip 3 covering from No.1 to No.M. The signal wire 5 is connected to a signal input terminal D.IN of the silicon chips 3 No.1, No.M+1,....
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8262280A JPS578179A (en) | 1980-06-17 | 1980-06-17 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8262280A JPS578179A (en) | 1980-06-17 | 1980-06-17 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS578179A true JPS578179A (en) | 1982-01-16 |
Family
ID=13779547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8262280A Pending JPS578179A (en) | 1980-06-17 | 1980-06-17 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS578179A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58138633U (en) * | 1982-03-15 | 1983-09-17 | 京セラ株式会社 | thermal head |
| EP2098373A1 (en) * | 2008-03-07 | 2009-09-09 | Seiko Epson Corporation | Head substrate and thermal head substrate |
-
1980
- 1980-06-17 JP JP8262280A patent/JPS578179A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58138633U (en) * | 1982-03-15 | 1983-09-17 | 京セラ株式会社 | thermal head |
| EP2098373A1 (en) * | 2008-03-07 | 2009-09-09 | Seiko Epson Corporation | Head substrate and thermal head substrate |
| US8194413B2 (en) | 2008-03-07 | 2012-06-05 | Seiko Epson Corporation | Head substrate and thermal head substrate |
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