JPS60110471A - Thermal recording head - Google Patents
Thermal recording headInfo
- Publication number
- JPS60110471A JPS60110471A JP58220023A JP22002383A JPS60110471A JP S60110471 A JPS60110471 A JP S60110471A JP 58220023 A JP58220023 A JP 58220023A JP 22002383 A JP22002383 A JP 22002383A JP S60110471 A JPS60110471 A JP S60110471A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- bonding
- wiring
- ball
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- H—ELECTRICITY
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- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
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Abstract
Description
【発明の詳細な説明】 １、産業上の利用分野 本発明は感熱記録ヘッドに関するものである。[Detailed description of the invention] 1. Industrial application field The present invention relates to a thermal recording head.
２、従来技術
感熱記録ヘッド（以下、単にヘッドと略す。）は、被記
録紙又は感熱紙等の被記録体に対して直接的に若しくは
インクフィルムを介して当接された状態で、記録用の電
気信号によって発熱部がドツト状に選択加熱され、これ
によって被記録体に画像等を記録できるように構成され
ている。2. Prior art Thermal recording heads (hereinafter simply referred to as heads) are used for recording while in contact with a recording medium such as recording paper or thermal paper, either directly or via an ink film. The heating section is selectively heated in a dot-like manner by an electric signal, and thereby an image or the like can be recorded on a recording medium.
従来のヘッドでは一般に、基板上に発熱体層を設け、こ
の上に多数の対向電極を形成して発熱部を構成しておプ
、その（信号）［極に対し基板外に配した集積回路（以
下、ＩＣと称する。）部から目的とする画像パターンに
対応した信号を与えるようにしている。In conventional heads, a heating layer is generally provided on a substrate, and a number of opposing electrodes are formed on this layer to form a heating section. (hereinafter referred to as IC) section provides a signal corresponding to a target image pattern.
こうしたヘッドとしては、例えば特開昭５６−７８９８
５号、５７−８１７７号、５７−８１７８号、５７−８
１７９号、５７−８１８０号、５７−４３８８３号、５
７−４３８８４号、５７−１０７８６６号、５７−１０
７８６７号、５７−１０７８６８−Ｗ、５７−１８２４
６１号、５７−１８５１７０号、５７−２０３５７１号
、５７−２０３５７２号、等各公報に開示されたものが
ある。As such a head, for example, Japanese Patent Application Laid-Open No. 56-7898
No. 5, No. 57-8177, No. 57-8178, No. 57-8
No. 179, No. 57-8180, No. 57-43883, 5
No. 7-43884, No. 57-107866, 57-10
No. 7867, 57-107868-W, 57-1824
There are those disclosed in various publications such as No. 61, No. 57-185170, No. 57-203571, and No. 57-203572.
ヘッドには、ダイオードマトリックス方式（以下、ＤＭ
方式と称する）と、ダイレクトドライブ方式（以下、Ｄ
Ｄ方式と称する）との２棟類の駆動方式が知られている
。いずれの方式でも、発熱体構成要素（ドツト）の数は
例えばＢ４サイズの記録では２０４８個と非常に多く、
これらの構成要素に対し同数のダイオード（１）Ｍ方式
）又は工Ｃチップ（ＤＤ方式）を接続することが必要と
される。この場合、それらの電気的接続個所（例えばダ
イオード又はＩＣチップの実装部分、発熱部と隣接した
回路素子との間）の数は発熱体構成要素数の数倍にも及
んでいる。しかも、各発熱体構成要素の大きさは、分解
能の面から８本／ｍｍとすれば１２Ｆ１ｍピッチで１１
００ｐの幅となシ、極めて微細なものとなる。従って、
こうした微細な構成要素に対する電気的接続は、高精度
であること、及び高信頼性、経済性を保持することが要
求される。The head uses a diode matrix method (hereinafter referred to as DM).
method) and direct drive method (hereinafter referred to as D
Two types of drive systems are known, called the D system. In either method, the number of heating element components (dots) is extremely large, for example 2048 for B4 size recording.
It is necessary to connect the same number of diodes (1) (M type) or C chips (DD type) to these components. In this case, the number of electrical connection points (for example, the mounting portion of a diode or an IC chip, between a heat generating part and an adjacent circuit element) is several times greater than the number of heat generating elements. Furthermore, if the size of each heating element component is 8 pieces/mm from the viewpoint of resolution, then the size of each heating element component is 12F/1m pitch and 11 pieces.
With a width of 00p, it becomes extremely fine. Therefore,
Electrical connections to such minute components are required to be highly accurate, reliable, and economical.
従来から知られている電気的接続方式には次の３つがあ
る。There are three conventionally known electrical connection methods:
（１）、Ａｕのボールボンディング
（２）、フィルムキャリア
（３）、Ａｔのウェッジボンディング
しかしながら、これらの接続方式はいずれも次の如き欠
点を有している。(1) Au ball bonding (2) Film carrier (3) At wedge bonding However, all of these connection methods have the following drawbacks.
まずＡｕのボールボンディングでは、Ａｕの価格が高く
て経済性が悪いことに加えて、ダイオードやＩＣチップ
のポンディングパッドがＡｔからなっているためにボン
ディング個所はＡｕ −Ａｔ接合となり、この接合は温
度上昇時に合金化してもろくなり、破壊し易く々って断
線を生じ易い。First, in Au ball bonding, in addition to the high price of Au and poor economic efficiency, the bonding pads of diodes and IC chips are made of At, so the bonding location is an Au-At junction, and this junction is When the temperature rises, it becomes alloyed, becomes brittle, and easily breaks, resulting in wire breakage.
しかも、Ａｕは重くて振動の影響を受け易い。Moreover, Au is heavy and easily affected by vibration.
また、フィルムキャリアの場合、テープの製作費が高く
、シかもヘッドの如く高精度に多数の接続を行なう製品
では接続の自動化を行なうことが困難である。Furthermore, in the case of film carriers, the manufacturing cost of the tape is high, and it is difficult to automate the connections in products such as film heads that make a large number of connections with high precision.
また、ＡＡのウェッジボンディングは、第１のボンディ
ングの終了後に次の第２のボンディング位置へＡｔワイ
ヤを導ひくときに、第１のボンディングの方向をそのま
ま保持して第２のボンディングを行なわねばならないか
ら、第２のボンディング位置が制限される。このため、
ボンディングの自由度が低く、生産性はＡｕのボールボ
ンディングよりも悪くなる。これに加えて、Ａ４ワイヤ
を押し潰してボンディングするためにボンディング位置
でのワイヤ径（厚み）が細くなり、強度が低下して断線
を生じ易く、かつ上記したボンディング位置の制限によ
シ、オートボンダーとボンディングステージとを相対的
に回転させなければ所望の接続を行なえないため位置精
度が悪い。Furthermore, in AA wedge bonding, when the At wire is guided to the next second bonding position after the first bonding is completed, the second bonding must be performed while maintaining the direction of the first bonding. , the second bonding position is limited. For this reason,
The degree of freedom of bonding is low, and the productivity is worse than that of Au ball bonding. In addition, since the A4 wire is crushed and bonded, the wire diameter (thickness) at the bonding position becomes thinner, the strength decreases, and wire breaks easily occur. Positional accuracy is poor because the desired connection cannot be made unless the bonder and bonding stage are rotated relative to each other.
このように、従来のボンディング方式はいずれも、ヘッ
ドの如き多数でかつ微細な接続個所のある製品における
接続には不適当である。As described above, all conventional bonding methods are unsuitable for connecting products such as heads that have a large number of fine connection points.
３、発明の目的
本発明の目的は、高精度にして信頼性及び生産性良く、
低コストにボンディングが可能なヘッド構造を提供する
ことにある。3. Purpose of the invention The purpose of the present invention is to achieve high precision, reliability, and productivity.
An object of the present invention is to provide a head structure that allows bonding at low cost.
４、発明の構成
即ち、本発明は、発熱部と、この発熱部を駆動する集積
回路部（ＩＣ部）とを有する感熱記録ヘッドにおいて、
互いに電気的に接続されるべき複数の個所がアルミニウ
ムのボールボンディングによって接続されていることを
特徴とする感熱記録ヘッドに係るものである。4. Structure of the Invention That is, the present invention provides a thermal recording head having a heat generating section and an integrated circuit section (IC section) for driving the heat generating section.
The present invention relates to a thermal recording head characterized in that a plurality of points to be electrically connected to each other are connected by aluminum ball bonding.
５、実施例 以下、本発明を実施例について詳細に説明する。5. Examples Hereinafter, the present invention will be described in detail with reference to examples.
まず第１図につき、ＤＮ方式のヘッド２００基本的回路
構成を説明する。これによれば、発熱部２の各構成要素
（抵抗で示しである）Ｒは例えば３２ブロツクに分けら
れ、各ブロックには逆流防止ダイオードＤが６４個ずつ
接続され、各ブロック毎にドライブ回路（図示せず）に
よシ群制御が行なわれる。構成要素Ｒの他端側は夫々、
６４本の信号ラインから記録信号Ｓｉｎが選択的に印加
され、この信号に対応して上記ブロックにドライブ信号
が入った場合に、構成要素■（がジュール熱によりドツ
ト状に発熱することになる。First, the basic circuit configuration of a DN type head 200 will be explained with reference to FIG. According to this, each component R (represented by a resistor) of the heat generating part 2 is divided into, for example, 32 blocks, each block is connected with 64 backflow prevention diodes D, and each block has a drive circuit ( (not shown) performs group control. The other end side of the component R is
When a recording signal Sin is selectively applied from 64 signal lines and a drive signal is applied to the block in response to this signal, the component (2) generates heat in a dot shape due to Joule heat.
ここで、第１図に一点鎖線２６で示したラインは、各ダ
イオードＤと要素Ｒとが電気的に接続される個所を示し
、この接続個所数は２０４８個所にも及ぶ。本実施例に
よれば、これらの多数の接続を第２図〜第４図に示すｋ
ｔのボールボンディングで行々っている。Here, the line shown by the dashed-dotted line 26 in FIG. 1 indicates the location where each diode D and the element R are electrically connected, and the number of these connection locations reaches 2048 locations. According to the present embodiment, these many connections are connected as shown in FIGS. 2 to 4.
I am using T ball bonding.
即ち、各ダイオードＤは、基体（例えばアルミニウム）
１上に固定されたプリント基板５にマウントされたＩＣ
チップ２７に形成されていて、Ｓｉ基板２８に公知の半
導体技術で拡散形成されたＰ型ウェル２９及びＮ＋型領
領域３０の接合ダイオードからなっている。ＩＣチップ
２７は簡略化して示されておシ、表面側にはＳ ｉ０２
からなるパツシベーシヨン層３１が形成され、この膜に
設けた貫通孔にＡｔ電極３２が被着され、更に絶縁膜３
３を介して電極３２に接続されたＡｔポンディングパッ
ド３４が被着されている。プリント基板５上には、ＩＣ
チップ２７に隣接して発熱部２へ導ひかれるＡ７配線３
５が各ダイオードＤに対応し−て設けられている。そし
て、上記のダイオードＤのＡｔポンディングパッド３４
と上記Ａｔ配線３５とは、同じＡｔ製のワイヤ３６によ
って互いに電気的に接続されるが、この接続がボールボ
ンディング方式で行なわれていることに注目すべきであ
る。That is, each diode D has a substrate (e.g. aluminum)
IC mounted on a printed circuit board 5 fixed on 1
It is formed on the chip 27 and consists of a junction diode of a P type well 29 and an N + type region 30 which are diffused into a Si substrate 28 using known semiconductor technology. The IC chip 27 is shown in a simplified manner, with Si02 on the front side.
A passivation layer 31 consisting of
An At bonding pad 34 connected to the electrode 32 via 3 is deposited. On the printed circuit board 5, an IC
A7 wiring 3 adjacent to the chip 27 and led to the heat generating part 2
5 is provided corresponding to each diode D. And the At bonding pad 34 of the diode D mentioned above.
and the At wiring 35 are electrically connected to each other by the same wire 36 made of At, but it should be noted that this connection is made by a ball bonding method.
このボンディング方式によれば、Ａｔワイヤ３６の一端
側は予めボール状に形成されていて、このボール部分３
６ａを上記パッド３４上に加熱下で押し付けることによ
ってパッド３４に対し電気的（更には機械的）に結合せ
しめられる。従って、コノホンディング部分は同じ八ｔ
Ｎのボール部分３６ａ とパッド３４との接合からなる
ために、両者は充分に一体化して強力に結合し合い、破
壊に充二分に耐える構造となる。まだ、Ａｔワイヤ３・
６の他端側３６ｂＦｉＡｔ配線３５上にウェッジボンデ
ィングと同様の構造で結合せしめられるが、両者は共に
Ａ４製であるためにＡｕとＡｔの様々もろい合金化が生
じず、結合強度は充分である。但、ば、実用上充分に破
壊に耐えると共に、上記一端側３６ ａがボールボンデ
ィングでパッド３４と接続されているためにワイヤ３６
全体としての結合強度は強力なものとなっている。これ
に反し、従来のＡｔウェッジボンディングを第３図に適
用した場合、ＡＡワイヤの両端部が共にウェッジボンデ
ィングでパッド３４及び配線３５に接続されることにな
るから、本例によるボンディング構造に比べて強度的に
ずっと弱くなる。々お、ワイヤ３６として例えばＡＡ−
８ｉ（９９：１）製のものを使用するワイヤ自体の強度
を大きくできる。According to this bonding method, one end side of the At wire 36 is previously formed into a ball shape, and this ball portion 3
By pressing 6a onto the pad 34 under heat, it is electrically (and mechanically) coupled to the pad 34. Therefore, the conohonding part is the same 8t
Since the N ball portion 36a and the pad 34 are joined together, the two are sufficiently integrated and strongly bonded to each other, resulting in a structure that is sufficiently resistant to breakage. Still, At wire 3.
It is bonded to the FiAt wiring 35 on the other end side 36b of 6 in a structure similar to wedge bonding, but since both are made of A4, various brittle alloys of Au and At do not occur, and the bonding strength is sufficient. However, since the wire 36 is sufficiently resistant to breakage in practical use and the one end side 36a is connected to the pad 34 by ball bonding, the wire 36
The overall bond strength is strong. On the other hand, when the conventional At wedge bonding is applied to the structure shown in FIG. 3, both ends of the AA wire are connected to the pad 34 and the wiring 35 by wedge bonding. It becomes much weaker in strength. For example, the wire 36 is AA-
The strength of the wire itself made of 8i (99:1) can be increased.
また、本例による上記のＡｔボールボンディング方式は
、軽量のＡｔワイヤ３６を使用するものであるから、振
動に強くガっておシ、これも破壊が生じない一因である
。しかも、コストが非常に安いので経済的にも有利であ
る。Further, since the above-mentioned At ball bonding method according to this example uses the lightweight At wire 36, it is strongly resistant to vibration, which is also one of the reasons why no breakage occurs. Furthermore, since the cost is very low, it is economically advantageous.
更に、Ａｔワイヤ３６によるポールボンディングである
から、ダイオードＤと配線３５との間をオートボンダー
によって高精度でかつ自動的に接続することができる。Furthermore, since pole bonding is performed using the At wire 36, the diode D and the wiring 35 can be automatically connected with high precision by an autobonder.
なお、上記の配線３５は、セラミックス等の抵抗体板３
上に対応した個数設けられた発熱体層（例えば窒化メン
タル膜）８（第１図のＲに相当）上に導びかれ、対向し
たＡｔ配線に（第１図のＳｉｎの印加されるライン）と
の間に流れる電流で発熱体層８を選択的に発熱させる構
造となっている。Note that the above wiring 35 is connected to the resistor plate 3 made of ceramic or the like.
The heat generating layer (for example, nitride mental film) 8 (corresponding to R in FIG. 1), which is provided in a corresponding number on the top, is guided to the opposing At wiring (the line where Sin is applied in FIG. 1). The structure is such that the heating element layer 8 selectively generates heat by a current flowing between the two.
第４図には、本例によるボンディングの状況が示されて
いる。キャピラリー３７の中心部には公知のウェッジボ
ンディングの場合と同様にＡｔワイヤ３６が通されるが
、その下端部３６ａは公知の放電又は水素トーチによる
加熱で溶融せしめられて予めボール状に形成される。そ
して、キャピラリー３７を下方３８へ下げ、加熱下にパ
ッド３４上に押し付けてボール状にパッド３４と接続セ
ージめた後、キャピラリー３７を配ａ３５上に移動ぜせ
、その下端エツジ３７ａでワイヤ３６を押し潰した後、
ワイヤをクランプし、矢印３９方向へ移動させると、ワ
イヤ端３６ｂが切断され、配線３５上に結合せしめられ
る。FIG. 4 shows the bonding situation according to this example. An At wire 36 is passed through the center of the capillary 37 as in the case of known wedge bonding, but its lower end 36a is melted by known discharge or heating with a hydrogen torch and formed into a ball shape in advance. . Then, the capillary 37 is lowered downward 38 and pressed onto the pad 34 under heating to form a ball-like connection with the pad 34.Then, the capillary 37 is moved onto the arrangement a35, and the wire 36 is connected with its lower edge 37a. After crushing
When the wire is clamped and moved in the direction of arrow 39, wire end 36b is cut and bonded onto wiring 35.
この人ｔボールボンディングによれば、キャピラリー３
７下に露出したＡＡクワイヤ下端３６ａを予めボール状
にしているので、パッド３４上への接続後、次のボンデ
ィング位置のキャピラリー３７の移動方向はボール部分
３６ａの全周において任意に選択できる。従って、図示
した配線３５の如くパッド３４に対し一定の方向で対応
している第２のボンディング位置へのキャピラリー３７
の移動は、配線３５の位置が仮にずれていても常に実現
可能であり、ボンディング方向の自由度及びボンディン
グの位置精度を高くする仁とができる。According to this person t-ball bonding, capillary 3
Since the lower end 36a of the AA choir exposed below the capillary 37 is made into a ball shape in advance, the moving direction of the capillary 37 at the next bonding position after connection onto the pad 34 can be arbitrarily selected around the entire circumference of the ball portion 36a. Therefore, the capillary 37 is connected to a second bonding position corresponding to the pad 34 in a fixed direction as shown in the wiring 35.
This movement can always be realized even if the position of the wiring 35 is shifted, and it is possible to increase the degree of freedom in the bonding direction and the accuracy of the bonding position.
こうして、ダイオードＤと発熱部構成要素との間におけ
る２０００〜３０００個所にも及ぶ接続個所を高精度に
して信頼性良く、低コストに接続することができ、接続
の歩留シもＡｔウェッジボンディングの不良率（４〜５
本／１０００本）及びＡｕボールボンディングの不良率
（１〜２本／ １０００２７．）に比べ１本以下／１０
００本の不良率に向上さぜることか可能である。In this way, as many as 2,000 to 3,000 connection points between the diode D and the heat generating component can be connected with high accuracy, reliability, and low cost, and the connection yield is also lower than that of At wedge bonding. Defective rate (4~5
less than 1 piece/10 compared to Au ball bonding (1~2 pieces/100027.)
It is possible to improve the defective rate to 0.00 pieces.
このことは、次の実験事実にょシ確認された。This was confirmed by the following experimental facts.
第２図及び第３図において、各部を次の如くに形成した
。In FIGS. 2 and 3, each part was formed as follows.
Ａ、ａパッド３４：１＋５＋厚、１．００Ｘ１００／１
７７！Ａｔパツド３４の数＝１ブロック当シロ４個Ａｔ
ワイヤ３６ ｍ ＡＡ＋ＩＸＳ＋、２５ｐｍφボンディ
ング個所： ４０９６個所（Ａｔワイヤ本数で２０４８
本）
ボンディング条件：
Ａｔバッド３４上ヘノ抑圧： ４００ｍＮ（＝ ユ゛−
トン）
Ａｔバッド３４上への抑圧時間：３０ｍ５ｅｃ超音波振
幅：０．７ｐｍ（周波数６０ Ｋｌ−Ｊｚ ）ボール部
分３６ａ：Ａｒガス中、容量放電（ｃａｐａｃｉｔｏｒ
ｄｉｓｃｈａｒｇｅ ）法により形成
配線３５：Ａｔ薄膜（又はＰｃｔ−Ａｇ薄膜）配線３５
（又は１２）：１１００ｐ幅、１２５ｐｍピッチ
結果は以下の通シであシ、従来のボンディング方式と比
較して示した。A, a pad 34:1+5+thickness, 1.00X100/1
77! Number of At pads 34 = 4 pieces per block
Wire 36 m AA+IXS+, 25 pmφ Bonding locations: 4096 locations (2048 At wires)
Bonding conditions: Atbud 34 top heno suppression: 400mN (= Yu-
) Suppression time on the At pad 34: 30 m5ec Ultrasonic amplitude: 0.7 pm (frequency 60 Kl-Jz) Ball portion 36a: Capacitive discharge (capacitor) in Ar gas
Wiring 35 formed by the discharge method: At thin film (or Pct-Ag thin film) wiring 35
(or 12): 1100p width, 125pm pitch The results are shown below in comparison with the conventional bonding method.
ボンディング速度：０．２ｓｅｃ以下／ワイヤ１本（従
来のＡＡウェッジボ
ンディングでは約０．５ｓｅｃ
／ワイヤ１本）
歩留り：不良率１本以下／２０００本
（従来のＡｔウェッジボンディング
では４〜５本／１０００本）
完全自動化：Ａｕボールボンディングとほぼ同様の装置
で実現可能
信頼性：耐熱、熱サイクル試験（耐熱試験は２５０℃で
１０００ｈｒで、熱サイクル試験は一５０℃から２５０
℃まで１０００ｃｙｃ ｌ ｅで、いずれも各２０００
本をチェックし、接続抵抗変化と、引張強
度を調べた。）でＡｕボールボンデ
ィングやＡｔウェッジボンディング
より良好
次に、本発明の第２の実施例を第５図〜第７図につき述
べる。Bonding speed: 0.2 sec or less/1 wire (about 0.5 sec/1 wire in conventional AA wedge bonding) Yield: 1 or less defective wire/2000 wires (4 to 5 wires/1000 in conventional At wedge bonding) Full automation: Can be achieved with almost the same equipment as Au ball bonding Reliability: Heat resistance, thermal cycle test (Heat resistance test is 250℃ for 1000 hours, thermal cycle test is from -50℃ to 250℃)
1000 cycles up to ℃, 2000 cycles each
I checked the book and examined the change in connection resistance and tensile strength. ) is better than Au ball bonding or At wedge bonding.Next, a second embodiment of the present invention will be described with reference to FIGS. 5 to 7.
この例のヘッド２０はＤＤ方式であって、共通の基体（
例えばアルミニウム基板）１上に、発熱部２を設けた抵
抗体板（例えばアルミナ等のセラミックス板）３と、多
数（例えば６４個）のＩＣチップ４を固定したプリント
基板（例えばガラス拳エポキシ又はセラミックス板）５
とが一定の間隙６を置いて対向して固定されている。Ｉ
Ｃチップ４と発熱部２との電気的接続は、上記間隙６上
にてプリント基板５と抵抗体板３との間に架は渡された
フィルムキャリアテープ７によって行なわれている。The head 20 in this example is of the DD type, and has a common base (
For example, an aluminum substrate) 1 has a resistor plate (for example, a ceramic plate made of alumina, etc.) 3 on which a heat generating part 2 is provided, and a printed circuit board (for example, a glass fist epoxy or ceramic plate) on which a large number (for example, 64) of IC chips 4 are fixed. board) 5
are fixed facing each other with a certain gap 6 between them. I
Electrical connection between the C-chip 4 and the heat generating section 2 is made by a film carrier tape 7 which is stretched between the printed circuit board 5 and the resistor plate 3 above the gap 6.
この接続方式を詳述すると、発熱部２は、抵抗体板３上
に被着された発熱体（例えば窒化タンタル）層８上に形
成されている例えばアルミニウム環の共通の接地電極９
と、同発熱体層８上において接地電極９の長さ方向に多
数本（Ｂ４サイズでは８本／耐）配列せしめられている
例えばアルミニウム環の信号電極１０との各対向部分１
１によって形成されている。一方、ＩＣチップ４は一定
個数毎に、３０で示した分離ラインで互いに接合された
別々のプリント基板５上にマウントされ、そのＡｔ製ポ
ンディングパッド４０と、プリント基板５上に所定パタ
ーンに設けられた例えばアルミニウム環の配線１２との
間がＡｔのワイヤ１３によって上述したと同様のボール
ボンディングによりボンディングされている。なお、上
記の各配線パターンは簡略図示され、かつ他の配線部分
は図示省略されている。また、発熱体層８は発熱部２に
のみ設けられてよい。To explain this connection method in detail, the heat generating part 2 is connected to a common ground electrode 9 made of, for example, an aluminum ring, which is formed on a heat generating body (for example, tantalum nitride) layer 8 deposited on the resistor plate 3.
and each facing portion 1 of the signal electrode 10 made of, for example, an aluminum ring, which is arranged in the length direction of the ground electrode 9 on the heating element layer 8 in large numbers (8 pieces/proof in B4 size).
It is formed by 1. On the other hand, the IC chips 4 are mounted in fixed numbers on separate printed circuit boards 5 that are bonded to each other at the separation line 30, and the At bonding pads 40 and the IC chips 4 are mounted in a predetermined pattern on the printed circuit board 5. The At wire 13 is bonded to the wire 12 made of, for example, an aluminum ring by the same ball bonding as described above. Note that each of the above-mentioned wiring patterns is illustrated in a simplified manner, and other wiring portions are omitted from the illustration. Further, the heat generating layer 8 may be provided only in the heat generating section 2.
フィルムキャリアテープ７は、例えばポリイミド基板１
４上に、上記信号電極１ｏ及び配線１２に対応した本数
（例えば６４本）の例えば銅箔製のリード１５が接着さ
れたものからなっている。The film carrier tape 7 is, for example, a polyimide substrate 1.
A number of leads 15 (for example, 64 leads) corresponding to the signal electrodes 1o and wiring lines 12 (for example, 64 leads) made of, for example, copper foil are bonded onto the lead wires 4.
これらのリード１５と信号電極１０及び配１ｉ１１１２
との接続はいわゆるビームリード方式で行なってよく、
リード１５の両端部を予め幾分張出させておき、ここを
熱圧着して接続を行なうことができる。These leads 15, signal electrodes 10 and wiring 1i1112
The connection may be made by the so-called beam lead method,
Connection can be made by making both ends of the lead 15 slightly overhang in advance and then thermocompression bonding them.
なお、上記した各電極又は配線の形成、ＩＣチップのマ
ウント及びワイヤボンディングは、公知の半導体装技術
によって行なえるので、それらの詳細な説明は省略する
。また、図示省略したが、第３図において抵抗体板３上
には更に、５ｉｎ２膜及び酸化タンタル膜（耐摩耗被膜
）が順次被着される。Note that the formation of the above-mentioned electrodes or wiring, mounting of the IC chip, and wire bonding can be performed using known semiconductor device technology, so detailed explanation thereof will be omitted. Although not shown, a 5in2 film and a tantalum oxide film (wear-resistant coating) are further sequentially deposited on the resistor plate 3 in FIG.
上記の如くに構成されたヘッドにおいては、ＩＣチップ
４のパッド４０に対しＡｔワイヤ１３のボール状部分が
ボールボンディング方式で結合され、かつ他端部は配線
１２に対しウェッジボンディングで結合されている。こ
のようなボンディング方式では、ＩＣチップ４の各ポン
ディングパッドに対しＡｔボールボンディングが採用さ
れているので、既述した如くＡｔボール部分があらゆる
方向において第２のボンディング位置に対し等価であシ
、配線１２に対し位置的な制約を受けることなくボンデ
ィングが可能となる。従ってＡｔワイヤによるボンディ
ングを高精度に行なうことができると共に、キャピラリ
ーとプリント基板とを相対的に回転させなくてもキャピ
ラリーのみを所定方向へ動かすだけでボンディングが可
能である。In the head configured as described above, the ball-shaped portion of the At wire 13 is bonded to the pad 40 of the IC chip 4 by ball bonding, and the other end is bonded to the wiring 12 by wedge bonding. . In such a bonding method, since At ball bonding is adopted for each bonding pad of the IC chip 4, the At ball portion is equivalent to the second bonding position in all directions as described above. Bonding can be performed without positional restrictions on the wiring 12. Therefore, bonding using At wires can be performed with high precision, and bonding can be performed simply by moving only the capillary in a predetermined direction without rotating the capillary and the printed circuit board relative to each other.
第８図は、本発明の他の実施例を示すものである。FIG. 8 shows another embodiment of the invention.
この例では、上記のフィルムキャリアテープ７に代えて
、両配線１２−１０の接続ＫＡｔワイヤ１６によるワイ
ヤボンディングを適用している。In this example, instead of the film carrier tape 7 described above, wire bonding is applied using a KAt wire 16 connecting both wirings 12-10.
仁の接続は、既述したＡｔボールボンディング方式によ
って行なっている。これは、ＩＣチップ４と配線１２と
をＡｔボールボンディングで接続することと併用してよ
い。The connection between the two ends is performed by the At ball bonding method described above. This may be used in combination with connecting the IC chip 4 and the wiring 12 by At ball bonding.
なお、第６図においてテープ７上にリード１５を形成す
る代りに通常の配線を形成し、これらを上記配線１２．
１０とＡｔボールボンディングすることも可能である。In FIG. 6, instead of forming the leads 15 on the tape 7, ordinary wiring is formed and these are connected to the wiring 12.
10 and At ball bonding is also possible.
また、第８図では、 ＩＣチップ４は、上記したように
ワイヤボンディングで配線１２と接続する以外にも、フ
リップチップ方法がなく、接続の信頼性がよシ向上する
。Further, in FIG. 8, the IC chip 4 is connected to the wiring 12 by wire bonding as described above, but there is no flip-chip method, and the reliability of the connection is further improved.
第９図は、更に他の実施例を示すものである。FIG. 9 shows yet another embodiment.
この例によれば、上述した例とは異なって、発熱部２と
ＩＣ部とを共通の基体２１の表、裏に夫々設けている。According to this example, unlike the above-mentioned example, the heat generating section 2 and the IC section are provided on the front and back sides of a common base 21, respectively.
このためには、基体２１の端部にスルーホール１７を形
成し、公知のスルーホールメッキ技術等によってＡｔ配
線１０を基体２１の表側から裏側にまで延設し、との延
設部分を上述した配線１２に置き換えて使用することが
できる。For this purpose, a through hole 17 is formed at the end of the base 21, and the At wiring 10 is extended from the front side to the back side of the base 21 using a known through hole plating technique, etc., and the extension portion is as described above. It can be used in place of the wiring 12.
このようにすれば、ヘッドを更にコンパクト化できると
同時に、発熱部とＩＣ部との接続にワイヤボンディング
やフィルムキャリアテープが不要となるから、信頼性が
更に向上する。但、発熱部２０発熱がＩＣ部へ影響しな
いように、基体２１を！サンドイッチ構造とし、中間層
として一点鎖線で示す如き断熱層（例えばセラミックス
）１８を設けるのが望ましい。In this way, the head can be made more compact, and at the same time, wire bonding and film carrier tape are not necessary for connecting the heat generating part and the IC part, so reliability is further improved. However, the base 21 should be carefully fixed so that the heat generated by the heat generating part 20 does not affect the IC part! It is preferable to adopt a sandwich structure and provide a heat insulating layer (eg, ceramic) 18 as shown by a dashed line as an intermediate layer.
なお、第９図において、スルーホール１７を介しての接
続以外にも、配線１０を基体２１の側端面上で表から裏
へと延設しても差支えない。In addition, in FIG. 9, in addition to the connection through the through hole 17, the wiring 10 may be extended from the front to the back on the side end surface of the base 21.
なお、上述した各側によるヘッドはいずれも、発熱部２
と共にＩＣチップ４を共通の支持体である基体上に設け
ているので、ヘッド構成が著しく簡略化若しくはコンパ
クトなものとなる。との場合、特にＩＣ部は、ＩＣチッ
プ４のマウント及び配線へのワイヤボンディングで実装
されるが、作動時にＩＣチップ４から発生する熱は下地
の基板５（更には１）を通して放散されるから、ＩＣの
熱破壊を効果的に防止できる。また、プリント基板５は
発熱部２側の抵抗体板３に対し上記間隙６を置いて分離
して対向配置されているので、発熱部２で生じた熱はプ
リント基板５側へ殆んど伝達されることはなく、この点
でもＩＣ部を有効に保護することができる。Incidentally, all of the above-mentioned heads on each side have a heating part 2.
At the same time, since the IC chip 4 is provided on the base which is a common support, the head structure can be significantly simplified or compacted. In this case, the IC part in particular is mounted by mounting the IC chip 4 and wire bonding to the wiring, but the heat generated from the IC chip 4 during operation is dissipated through the underlying substrate 5 (and even 1). , heat damage to the IC can be effectively prevented. In addition, since the printed circuit board 5 is arranged to face the resistor plate 3 on the side of the heat generating section 2, separated by the above-mentioned gap 6, most of the heat generated in the heat generating section 2 is transferred to the printed circuit board 5 side. In this respect as well, the IC section can be effectively protected.
プリント基板５と抵抗体板３とが上記のように分離して
設けることの他の利点としては、そのように構成するこ
とによって抵抗体板３自体の幅を狭くできる（即ち小幅
で長尺状の抵抗体板にできる）から、発熱体層８を例え
ばスパッタ法で形成する際に抵抗体板３をスパッタ装置
内へ装入し易く、また一度に処理される抵抗体板の個数
も増やせるために量産性が向上することになる。Another advantage of arranging the printed circuit board 5 and the resistor plate 3 separately as described above is that by configuring them in this way, the width of the resistor plate 3 itself can be narrowed (i.e., it can be made narrow and elongated). ), it is easy to load the resistor plate 3 into the sputtering device when forming the heating element layer 8 by sputtering, for example, and the number of resistor plates processed at one time can be increased. This will improve mass productivity.
また、ＩＣチップ４をマウントするプリント基板５は、
上述した如く、ＩＣチップの一定個数毎に別々に設けら
れているので、ＩＣチップのワイヤボンディングとの関
連で顕著な効果がある。一般に知られているように、全
自動化されたワイヤボンディング時の歩留りは、ボンデ
ィング位置のずれ等の要因から０．９９８（９９，８％
）であるとされ、ワイヤ数（ｎ）に応じて（０，９９８
）ｎ になるものとされている。従って仮に、上記とは
異なって１枚のみのプリント基板上に多数のＩＣチップ
をマウントしたとき、例えばワイヤの総本数を、３００
０本とすれば歩留は（ｏ、 ９９ Ｂ ）１８０００キ
０．００２５となることがある。これに対し、本実施例
のようにプリント基板５を幾つかに分けると、プリント
基板上のＩＣチップ数（従ってワイヤ本数）を減らせる
から、各プリント基板５上のＩＣチップ数に応じたワイ
ヤ数を各プリント基板につき例えば５００本にでき、こ
のためにワイヤボンディングの歩留は各プリント基板に
ついて夫々（０，９９８）５６０キ０．３６７５となる
。従って、本実施例のようにプリント基板を複数（例え
ば６枚）に分けることによって、歩留が大幅に向上する
ことになる。Moreover, the printed circuit board 5 on which the IC chip 4 is mounted is
As described above, since they are provided separately for each fixed number of IC chips, there is a significant effect in connection with wire bonding of IC chips. As is generally known, the yield rate during fully automated wire bonding is 0.998 (99.8%) due to factors such as deviations in the bonding position.
), and depending on the number of wires (n), (0,998
)n. Therefore, unlike the above, if a large number of IC chips are mounted on only one printed circuit board, for example, the total number of wires is 300.
If it is set to 0, the yield may be (o, 99 B) 18000 x 0.0025. On the other hand, if the printed circuit board 5 is divided into several parts as in this embodiment, the number of IC chips (and therefore the number of wires) on the printed circuit board can be reduced. The number can be, for example, 500 for each printed circuit board, so that the wire bonding yield is (0,998)560 x 0.3675 for each printed circuit board. Therefore, by dividing the printed circuit board into a plurality of parts (for example, six boards) as in this embodiment, the yield can be significantly improved.
ＩＣチップ４は各プリント基板５毎にマウントされ、ワ
イヤボンディングされた後に、各プリント基板５が基体
１上に接着等で固定されるが、この際、基体１には必ず
と言ってよい程反りがあシ、その表面は全体として平担
ではない。このため、仮に、１枚のみのプリント基板を
基体１上に固定した場合、両者の密着性が悪く、接着不
良が生じ易い。しかし、本実施例によれば、プリント基
板を分割し、個々に基体１上に固定できるので、上記に
比べて基体１の表面性の影響を緩和し、個々のプリント
基板５の基体１に対する密着性は良くなり、接着強度が
向上する。The IC chip 4 is mounted on each printed circuit board 5, and after wire bonding, each printed circuit board 5 is fixed onto the base 1 by adhesive or the like, but at this time, the base 1 is almost always warped. The surface is not flat as a whole. For this reason, if only one printed circuit board is fixed onto the base 1, the adhesion between the two will be poor and poor adhesion will likely occur. However, according to this embodiment, since the printed circuit board can be divided and individually fixed onto the base 1, the influence of the surface properties of the base 1 can be alleviated compared to the above, and the individual printed circuit boards 5 can be tightly attached to the base 1. The adhesive properties are improved and the adhesive strength is improved.
なお、本実施例において、上記の如くに位置調整された
プリント基板５上の各配線１２と、発熱部２側の信号電
極配線１０との間が、フィルムキャリアテープ７のリー
ド１５によってビームリード方式で電気的（及び機械的
）に接接される場合、ＩＣチップ４の複数個（例えば２
個）当たり１枚のテープ７が夫々使用されている。１個
のＩＣチップ４に対し１枚のテープ７を使用してもよい
が、上記のように複数のＩＣチップ当９１枚のテープ７
を使用すれば、ヘッド全体としてのフィルムキャリアテ
ープの使用枚数を減らせ、この分かなシのコストダウン
を図れることになる。但、いずれの場合も、フィルムキ
ャリアテープ７を用い、ＩＣチップ４を別のプリント基
板５上にマウントすると、テープ上には配線としてのＣ
ｕ１Ｊ−ド１５のみを所定パターンに設けるだけでよく
、そのパターは簡略化できる。第８図の例では、フィル
ムキャリアテープを用いていないのでコストダウンが可
能である。しかも、ＩＣチップ４をすべてプリント基板
５側に配し、これを配線１２、リード１５、配線１０を
介して発熱部２に接続すれは、ＩＣチップの実装密度を
高めることができ、テープ７では配線本数に応じた数の
リードを公知のメタライジング技術で容易かつ正確に形
成することができる。In this embodiment, a beam lead method is used to connect each wiring 12 on the printed circuit board 5 whose position has been adjusted as described above and the signal electrode wiring 10 on the side of the heat generating part 2 using the leads 15 of the film carrier tape 7. If the IC chips 4 are electrically (and mechanically) connected to
One piece of tape 7 is used for each piece. One piece of tape 7 may be used for one IC chip 4, but as described above, 91 pieces of tape 7 may be used for each plurality of IC chips.
By using this, the number of film carrier tapes used for the entire head can be reduced, and the cost of this component can be reduced. However, in either case, when the IC chip 4 is mounted on another printed circuit board 5 using the film carrier tape 7, the C as wiring is placed on the tape.
It is sufficient to provide only the u1J-dos 15 in a predetermined pattern, and the putter can be simplified. In the example shown in FIG. 8, cost reduction is possible because no film carrier tape is used. Moreover, by arranging all the IC chips 4 on the printed circuit board 5 side and connecting them to the heat generating part 2 via the wiring 12, leads 15, and wiring 10, it is possible to increase the mounting density of the IC chips. The number of leads corresponding to the number of wires can be easily and accurately formed using a known metallizing technique.
次に、上述した各実施例によるヘッド、例えば第５図〜
第７図に示したヘッドを使用した感熱記録方法及びその
装置を説明する。Next, the head according to each of the above-mentioned embodiments, for example, FIGS.
A thermal recording method and apparatus using the head shown in FIG. 7 will be explained.
第１０図の例によれば、第５図〜第７図に示したヘッド
２０をインクフィルム４１を介して被記録紙３３に当接
させた感熱転写タイプの感熱記録装置５９において、ケ
ース５３内に感熱記録のだめの各種装置が組込まれてい
る。According to the example of FIG. 10, in a thermal transfer type thermal recording device 59 in which the head 20 shown in FIGS. 5 to 7 is brought into contact with the recording paper 33 via the ink film 41, Various types of heat-sensitive recording devices are incorporated.
被記録紙６３は、例えばカセット６４内に折畳み状態で
収能され、ローラー５５を経て熱転写部５６へ、送られ
、転写後は矢印Ａの如く装置外へ排紙される。インクフ
ィルム４１は、供給ロール４２から、ガイドローラ４３
、駆動ローラー４４を経て熱転写部５６へ送られ、更に
駆動ローラー４５から巻取りローラー４６に巻取られる
。なお、インクフィルム４１は、例えば供給ロール４２
とガイドローラー４３との間で、熱溶融性インク（図示
せず）が塗布されるように構成されている。The recording paper 63 is stored in a folded state in a cassette 64, for example, and is sent to a thermal transfer section 56 via a roller 55. After being transferred, the paper is discharged out of the apparatus as shown by arrow A. The ink film 41 is transferred from the supply roll 42 to the guide roller 43.
, and is sent to a thermal transfer section 56 via a drive roller 44, and then wound up from a drive roller 45 to a winding roller 46. Note that the ink film 41 is, for example, a supply roll 42.
The structure is such that hot-melt ink (not shown) is applied between the guide roller 43 and the guide roller 43 .
インクフィルム４１の移動経路中において、駆動ローラ
−４４０手前位置に熱溶融性インクを塗布したインクフ
ィルム４１を検出するだめの７オトセンサ（例えば赤外
光センサ）４７が配されている。まだ被記録紙６３の検
出用として、圧接ローラー４８の手前位置にフォトセン
サ（例えば赤外光センサ）４９が配されている。In the movement path of the ink film 41, a seven-dimensional sensor (for example, an infrared light sensor) 47 for detecting the ink film 41 coated with heat-melting ink is arranged at a position in front of the drive roller 440. A photosensor (for example, an infrared light sensor) 49 is disposed in front of the pressure roller 48 to detect the recording paper 63.
熱転写部５６には、上述したヘッド２０とプラテンロー
ラー５４との組が設けられている。また、被記録紙３３
及びインクフィルム４１を挾着するための圧接ローラー
４８が配されている。The thermal transfer section 56 is provided with a combination of the above-described head 20 and platen roller 54. In addition, the recording paper 33
A pressure roller 48 for clamping the ink film 41 is also provided.
なお、図面中の矢印Ｂは、圧接駆動機構を有することを
示している。Note that arrow B in the drawings indicates that a pressure contact drive mechanism is provided.
こうした感熱記録装置５９において注目すべきことは、
第１１図に拡大図示する如くにプラテンローラー５４と
ヘッド２０との間に被記録紙６３とインクフィルム４１
とを発熱部２の位置で挾着して記録を行なう（即ち、イ
ンクフィルム４］上の熱溶融性インク５０を選択的に加
熱、溶融せしめて被記録紙６３上に記録パターン５０′
を形成する）際に、上述した如きヘッド構成に基いて発
熱部２を図中のへ□ラド左端側に設けることができるこ
とから、記録直後に被記録紙６３をヘッド２０外へ取出
せることである。この結果、記録後、寸もない時間内に
被記録紙６３上の記録パターン５０′を目視することが
でき、椿めて都合がよい。これに反し、従来のヘッドの
ように、発熱部がヘッドの中間位置にある場合には、発
熱部とヘッド端部との間には本実施例のヘッドに比較（
−てかなりの距離があるため、その分だけ記録直後に被
記録紙が出てくるまでに時間を要し、使用者にとって扱
いすらいという問題が生じる。What should be noted about such a thermal recording device 59 is that
As shown in an enlarged view in FIG. 11, a recording paper 63 and an ink film 41 are placed between the platen roller 54 and the head 20.
The heat-melting ink 50 on the ink film 4 is selectively heated and melted to form a recording pattern 50' on the recording paper 63.
Since the heat generating part 2 can be provided on the left side of the head 20 in the figure based on the head configuration as described above, the recording paper 63 can be taken out of the head 20 immediately after recording. be. As a result, the recorded pattern 50' on the recording paper 63 can be visually observed within a very short time after recording, which is very convenient. On the other hand, when the heat generating part is located in the middle of the head as in the conventional head, there is a gap between the heat generating part and the end of the head (compared to the head of this embodiment).
- Since there is a considerable distance between the recording paper and the recording paper, it takes time for the recording paper to come out immediately after recording, which creates a problem for the user in handling the recording paper.
第１２図には、感熱紙を用いる感熱記録装置５９を示し
、これによれば、ケース５３内にて感熱紙６１が供給ロ
ール６２から送出され、ヘッド２０と（２３）
プラテンローラー７４との間で挾着されてヘッド２０に
よる加熱で選択的に発色せしめられる。そして、この感
熱紙は画像が色パターンとして記録された状態で搬送ロ
ーラー６５及び６６間から排出される。FIG. 12 shows a thermal recording device 59 using thermal paper. According to this, thermal paper 61 is fed out from a supply roll 62 in a case 53, and passes between the head 20 and the (23) platen roller 74. and is selectively colored by heating with the head 20. The thermal paper is then discharged from between the transport rollers 65 and 66 with the image recorded as a color pattern.
以上、本発明を例示したが、上述の例は本発明の技術的
思想に基いて更に変形が可能である。Although the present invention has been illustrated above, the above-mentioned example can be further modified based on the technical idea of the present invention.
例えば、発熱部及びＩＣ部の配置や形状、層構成、材料
、電気的接続方式等は種々変更してよい。For example, the arrangement, shape, layer structure, material, electrical connection method, etc. of the heat generating part and the IC part may be changed in various ways.
上述のプリント基板はヘッド全長に亘って１枚のみ使用
してよいし、また発熱部とＩＣとは単一の基体に対し直
接設けることもできる。また、上述のＡｔボールボンデ
ィングが適用される個所は、上述した位置に限定される
ことばなく、ヘッドにおける他の電気的接続個所にも適
用可能である。Only one printed circuit board may be used over the entire length of the head, and the heat generating section and IC may be directly provided on a single base. Furthermore, the locations to which the above-described At ball bonding is applied are not limited to the above-mentioned locations, and can also be applied to other electrical connection locations in the head.
６ 発明の作用効果
本発明は上述した如く、Ａｔのボールボンディングによ
多接続するようにしたので、コストダウンを図れると共
に、Ａｔ−Ａｔ間の強力な結合が得られかつ断線のしに
くい信頼性の高いボンディング（２４）
と、第２のボンディング位置へはあらゆる方向であるこ
とによる高精度で自由度のあるボンディングとが可能と
なる。6. Effects of the Invention As described above, the present invention allows multiple connections to be made by At ball bonding, thereby reducing costs, providing a strong connection between At and At, and providing reliability that prevents disconnection. It is possible to perform bonding (24) with a high degree of accuracy and a high degree of freedom in bonding since the second bonding position can be reached in any direction.
図面は本発明の実施例を示すものであって、第１図は感
熱記録ヘッドの等価回路図、第２図はこのヘッドの一部
分の拡大平面図、第３図は第２図のＸ−Ｘ線拡大断面図
、第４図はＡｔボールボンディングの状況を示す断面図
、
第５図は他の感熱記録ヘッドの一部分の平面図、
第６図は第５図のＹ−Ｘ線拡大断面図、第７図は第５図
のＺ−Ｚ線拡大断面図、第８図、第９図は更に他の感熱
記録ヘッドの各断面図、
第１０図は感熱転写記録装置全体の概略断面図、
第１１図は第１０図の要部拡大図、
第１２図は感熱紙を用いる感熱記録装置全体の概略断面
図
である。
なお、図面に示された符号において、
１．２１＊ｓ＊＊１１０・基体
２・・・・・・・・・・・発熱部
３・・・・・・・・・・・抵抗体板
４．２７・・・・・・・ＩＣチップ
５・・・・・・・・・・・プリント基板８、 Ｒ・・・
・・・・・発熱体層
１０、 １２ 、３５ 壷 ・ ・ Ａｔ 配線１３．
１６．３６ ・・・Ａｔワイヤ
２．０・・拳・・・・−・書ヘッド
３４．４０ ・ｅ・・・争Ａｔパッド
３５ Ｂ −ｅ ＊ ＊ −ｅ −−−ボール状部分３
７・・・・・・・・會・キャピラリーＤ ・・・・・・
・・・・ダイオード
である。
代理人 弁理士 逢 坂 宏（他１名）（２７）
Ｃ）The drawings show an embodiment of the present invention, in which FIG. 1 is an equivalent circuit diagram of a thermal recording head, FIG. 2 is an enlarged plan view of a portion of this head, and FIG. 3 is taken along line X-X in FIG. 4 is a sectional view showing the state of At ball bonding; FIG. 5 is a plan view of a portion of another thermal recording head; FIG. 6 is an enlarged sectional view taken along the Y-X line of FIG. 5; 7 is an enlarged sectional view taken along the Z-Z line in FIG. 5, FIGS. 8 and 9 are sectional views of other thermal recording heads, FIG. 10 is a schematic sectional view of the entire thermal transfer recording device, FIG. 11 is an enlarged view of the main part of FIG. 10, and FIG. 12 is a schematic sectional view of the entire thermal recording apparatus using thermal paper. In addition, in the symbols shown in the drawings, 1.21*s**110・Base 2・・・・・・・・・・ Heat generating part 3・・・・・・・・・・・・Resistor plate 4 .27...IC chip 5...Printed circuit board 8, R...
...Heating element layer 10, 12, 35 pot... At wiring 13.
16.36 ...At wire 2.0...Fist...--Written head 34.40 -e...At pad 35 B -e * * -e ---Ball-shaped part 3
7...... Meeting/Capillary D...
...It is a diode. Agent: Patent attorney Hiroshi Aisaka (1 other person) (27) C)
Claims (1)
する感熱記録ヘッドにおいて、互いに電気的に接続され
るべき複数の個所がアルミニウムのポールボンディング
によって接続されていることを特徴とする感熱記録ヘッ
ド。1. A thermal recording head having a heat generating section and an integrated circuit section for driving the heat generating section, characterized in that a plurality of points to be electrically connected to each other are connected by aluminum pole bonding. recording head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58220023A JPS60110471A (en) | 1983-11-21 | 1983-11-21 | Thermal recording head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58220023A JPS60110471A (en) | 1983-11-21 | 1983-11-21 | Thermal recording head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60110471A true JPS60110471A (en) | 1985-06-15 |
| JPH055670B2 JPH055670B2 (en) | 1993-01-22 |
Family
ID=16744719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58220023A Granted JPS60110471A (en) | 1983-11-21 | 1983-11-21 | Thermal recording head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60110471A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS578177A (en) * | 1980-06-17 | 1982-01-16 | Matsushita Electric Ind Co Ltd | Thermal head |
| JPS5764944A (en) * | 1980-10-08 | 1982-04-20 | Hitachi Ltd | Forming and bonding methods for ball of metallic wire |
| JPS57116665A (en) * | 1981-01-14 | 1982-07-20 | Nippon Telegr & Teleph Corp <Ntt> | Thermal head incorporated in driving circuit |
| JPS5819953A (en) * | 1981-07-29 | 1983-02-05 | Nec Corp | Microprogram controlling system |
| JPS5827329A (en) * | 1981-08-11 | 1983-02-18 | Toshiba Corp | Wire bonding method |
| JPS5832427A (en) * | 1981-08-03 | 1983-02-25 | テキサス・インスツルメンツ・インコ−ポレイテツド | Device and method for forming aluminum ball for ball bonding |
-
1983
- 1983-11-21 JP JP58220023A patent/JPS60110471A/en active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS578177A (en) * | 1980-06-17 | 1982-01-16 | Matsushita Electric Ind Co Ltd | Thermal head |
| JPS5764944A (en) * | 1980-10-08 | 1982-04-20 | Hitachi Ltd | Forming and bonding methods for ball of metallic wire |
| JPS57116665A (en) * | 1981-01-14 | 1982-07-20 | Nippon Telegr & Teleph Corp <Ntt> | Thermal head incorporated in driving circuit |
| JPS5819953A (en) * | 1981-07-29 | 1983-02-05 | Nec Corp | Microprogram controlling system |
| JPS5832427A (en) * | 1981-08-03 | 1983-02-25 | テキサス・インスツルメンツ・インコ−ポレイテツド | Device and method for forming aluminum ball for ball bonding |
| JPS5827329A (en) * | 1981-08-11 | 1983-02-18 | Toshiba Corp | Wire bonding method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH055670B2 (en) | 1993-01-22 |
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