JP2658657B2 - Thermal head and its driving IC - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a thermal head.

[0002]

2. Description of the Related Art FIG. 21 is, for example, from Mitsubishi Electric Corporation in 1990.
FIG. 22 is a partial perspective view of an F-series thermal head published in April, FIG. 22 is a sectional view thereof, and FIG. 23 is an equivalent circuit diagram thereof. 21, 22 and 23, 1 is an alumina ceramic substrate, 2 is a heat storage layer, 3 is a conductor pattern,
Is a heating resistor, 5 is a protective film, 6 is a heating substrate, 7 is an adhesive, 8 is an IC chip, 9 is a gold wire, 10 is a printed circuit board, 11 is a backside solder resist, 12 is a backside pattern, 13
Is a surface pattern, 14 is a surface solder resist layer, 15 is a bonding terminal, 16 is a connector, 17 is a solder, 18 is a support base, 19 is a double-sided tape, 20 is a recording paper, 21 is a platen roller, 22 is a protective resin, 23 Is a cover, 57 is a pattern in which common electrodes are routed (hereinafter, referred to as PCOM), 63 is a pattern in which ground terminals are routed (hereinafter, referred to as PGND), and 80 is a pattern.
Reference numeral 90 denotes a circuit of the IC chip 8 (hereinafter referred to as an IC circuit) 90 is a common reinforcing portion formed to lower the wiring pattern resistance of the common electrode pattern PCOM57.

FIG. 24 shows a conventional thermal head IC.
It is a chip mounting diagram, 34 is a probe terminal, 37, 38, 41,
42, 43, 44, 45, 46, 47a, 47b and 47c are IC chips 8
DATA IN, DATA OUT
, CLOCK, VDD, ENH, ENL, GND-
L, LATCH, and GND-H.
0,51,52,53,54 are bonding terminals of the printed circuit board 10.
The BC connected to each signal of the IC chip 8 at 15
LOCK, BVDD, BENH, BENL, BGND-
L, BLATCH, BGND-H, and 100 is DAT
BDATA IN, 101 connected to A IN38
BDATA OUT is connected to TA OUT 37, and 100 and 101 are sequentially pattern-connected on the printed circuit board 10 side. The BDATA IN100 extends to the end of the printed circuit board 10 because it serves as a plating lead when the printed circuit board 10 is manufactured. Further, in the conventional thermal head, the adhesive 7 that has protruded from the adhesive of the IC chip diffuses along the edge of the protective film 5, and the conductive pattern 3 and the Au wire 9 cannot be connected due to the capillary phenomenon, or Even when connected, poor connection such as low strength occurred.

[0004]

Since the conventional thermal head is configured as described above, there is a defect in wire bonding to the wire bonding terminal 15 of the printed circuit board 10, and a common strengthening process is required. Or the probe terminal 34 is on the side of the recording paper
Blurring was observed, resulting in poor printing and reduced reliability of the pattern. In addition, there is a problem that a loss difference in the IC chip 8 is large and print quality is deteriorated. Also E
When the NH and ENL signals are not required,
There were problems, such as complicated wiring, because the 10 patterns had to be changed considerably. The present invention has been made to solve the above problems, and has been made to simplify the process of manufacturing a thermal head, improve yield, improve reliability, improve printing quality, and simplify conductor pattern routing. Aim.

[0005]

The thermistor according to the first invention is provided.
Head along the edge of the substrate and one end of the substrate
The provided heating resistor and the base are more than the heating resistor.
The heat generating resistor is provided along the edge on the one end side of the plate.
Both ends having a plurality of electrodes extending to intersect the antibody
Through electrode and the plurality of electrodes of the end common electrode alternately.
An individual electrode that intersects with the heating resistor and the other end of the substrate
The heating resistor is provided and connected to the individual electrode.
A plurality of IC chips for driving the body based on the print information;
Commonly provided on the IC chip side of the heating resistor
Connected to the end common electrode via an electrode connection pattern
A common electrode on the IC chip side.
A chip connected to the end common electrode with the IC chip.
A lobe terminal is provided. The server according to the second invention
The multiple head according to the first aspect, wherein at least the
It has a high conductive film connected to a lobe terminal.
A thermal head according to a third aspect of the present invention includes a substrate, and the substrate
A heating resistor provided along one edge at one end of the
Than the heating resistor along an edge on the one end side of the substrate
That extend in such a way as to intersect with the heating resistor.
An end common electrode having a number of electrodes, and an end common electrode
Individual electrodes crossing the heating resistor alternately with multiple electrodes
And the individual electrode provided on the other end side of the substrate.
And driving the heating resistor based on the printing information.
And a plurality of IC chips provided on the IC chip side.
Connect to the end common electrode via common electrode connection pattern
The common electrode on the IC chip side and the substrate are installed separately.
Printed circuit board with electrodes formed by the plating process
A data input terminal and a data output of the IC chip.
The conductor pattern connecting the terminal with the IC chip
It is arranged on the substrate on the side of the heating resistor. 4th
A thermal head according to the present invention comprises a substrate,
A heating resistor provided along an edge at an end;
Along the edge on the one end side of the substrate than the resistor
And a plurality of
An end common electrode having an electrode, and a plurality of the end common electrodes
Individual electrodes that alternately intersect the heating resistor with the electrodes of
It is provided on the other end of the substrate and contacts the individual electrodes.
Connected to drive the heating resistor based on print information.
IC chips and the IC chip provided on the IC chip side.
It has a common electrode pad protruding to the thermal resistor side, and a common electrode
I connected to the end common electrode via a connection pattern
A common electrode on the C chip side, and a common electrode on the IC chip side.
The IC chip is bonded with an adhesive on the protective film
The protective film is further bonded to the IC chip side.
This is where the common electrode pad protrudes from the common electrode.
Near the both ends in the longitudinal direction of the substrate.
It is formed to project in a mountain shape in the direction. In the fifth invention
Such a thermal head comprises a substrate and one end of the substrate.
A heating resistor provided along the edge;
Also provided along the edge on the one end side of the substrate,
A plurality of electrodes extending so as to intersect the heating resistor.
An end common electrode, and a plurality of electrodes of the end common electrode
An individual electrode alternately intersecting with the heating resistor, and
Before being provided on the other end side and connected to the individual electrode
A plurality of ICs for driving the heating resistor based on print information
Chip and the heating resistor provided on the IC chip side
The common electrode connection pattern
IC chip connected to the end common electrode via a line
And a common electrode on the IC chip side.
The IC chip is adhered with an adhesive on the attached protective film.
And the protection film is provided on the IC chip side common electrode.
A portion where the common electrode pad protrudes,
A trough in the lateral direction of the substrate near both ends in the longitudinal direction of the substrate
It is formed in a concave shape in the mold. In the sixth invention
Such a thermal head comprises a substrate and one end of the substrate.
A heating resistor provided along the edge;
Also provided along the edge on the one end side of the substrate,
A plurality of electrodes extending so as to intersect the heating resistor.
An end common electrode, and a plurality of electrodes of the end common electrode
An individual electrode alternately intersecting with the heating resistor, and
Before being provided on the other end side and connected to the individual electrode
A plurality of ICs for driving the heating resistor based on print information
Chip and the heating resistor provided on the IC chip side
The common electrode connection pattern
IC chip connected to the end common electrode via a line
And a common electrode on the IC chip side.
The IC chip is adhered with an adhesive on the attached protective film.
And the protection film is provided on the IC chip side common electrode.
In a portion where the common electrode pad protrudes,
It is formed to protrude in the lateral direction. According to the seventh invention
The thermal head according to the first to sixth aspects,
Heating resistor drive terminals on the IC chip are at the same pitch
And the common electrode contact
Connection patterns are those that are located between the groups.
You. The thermal head according to the eighth invention is characterized in that the first to seventh thermal heads
In the invention, an end of the substrate on which the IC chip is arranged
A printed circuit board provided separately from the substrate on the side of the unit,
The IC chip side of the substrate provided on the printed circuit board
Wire rod connected to the through electrode and wire bonding
And a wire bonding terminal of the printed circuit board.
Is provided on the surface opposite to the surface on which the terminal is provided.
Through the wire bonding terminal and through hole
Connected with a wide conductor pattern in the short direction of the board
It is provided. The thermal head according to the ninth invention
The driving IC has a heating resistor driving element at one long side end.
Arrange the print data input terminal and the print data output terminal,
An IC chip driving signal terminal is arranged at the other long side end,
Switching near the center between the one and the other long sides
This is where the ground terminal of the element is arranged. In the tenth invention
Such a thermal head driving IC is the ninth aspect of the present invention.
And three ground terminals, and one
Located approximately in the center of the moving terminal and the other two
The number of the plurality of heating resistor drive terminals on both sides from the ground terminal
It is located at a distance equivalent to 1/4 to 2/5
You. IC for driving a thermal head according to an eleventh invention
Is an IC chip drive internally connected to a pull-down resistor
IC chip drive power supply terminal adjacent to the signal terminal
Drive IC chip internally connected to pull-up resistor
Connection of the IC chip drive power supply terminal adjacent to the
Ground terminals are arranged.

[0006]

In the thermal head according to the first invention, the thermal paper
It does not lead to poor image quality due to irresistible blemishes. Second
In the thermal head according to the invention, static electricity is prevented. No.
In the thermal head according to the third aspect of the present invention, the thermal head
Is a plating lead that causes wire bonding failure
No terminals that become
Can be improved. The thermal head according to the fourth invention.
Prevents the adhesive from sticking out and improves the yield
And increase productivity. The fifth aspect of the present invention
-With the multiple head, the adhesive is prevented from running out and the yield
And productivity can be improved. Sixth invention
Prevents adhesive from protruding
In addition, yield can be improved and productivity can be increased.
In the thermal head according to the seventh invention, the wire bonder
The wire does not touch the connection pattern when
Reliability is improved. The thermal head according to the eighth invention is
The lower part of the wire stitch of the printed wiring board becomes flat,
Adhesion with the double-sided tape becomes uniform. According to the ninth invention,
In the IC for driving the multiple head, the pattern of the IC chip
Placement is facilitated, Turkey wider ground pattern at the center
The loss of the IC ground pattern is reduced,
There is an effect that the ground can be taken at a desired place. First
0, the driving IC for the thermal head
Since the variation between the bits of the descent is reduced,
It can reduce sticking and improve printing quality.
You. An IC for driving a thermal head according to an eleventh aspect of the present invention.
Can be used as a common conductor pattern.
Line wiring becomes easy.

[0007]

[Embodiment 1] An embodiment of the present invention will be described below with reference to the drawings. FIG.
1 is a partial perspective view of a thermal head showing this embodiment, and FIG. 2 is a sectional view thereof. 1 and 2, 1
Is an alumina ceramic substrate with 96% alumina purity,
Numeral 2 denotes, for example, a glass layer which covers the alumina ceramic substrate 1, and improves the base of the alumina ceramic substrate 1,
It determines the thermal response characteristics of the thermal head (hereinafter referred to as a heat storage layer). 3 is a conductor pattern patterned on the heat storage layer 2, 4 is a continuous strip-shaped heating resistor made of, for example, ruthenium oxide or the like formed on the conductor pattern 3,
Reference numeral 5 denotes a glass layer (hereinafter, referred to as a protective film) serving as a wear-resistant and protective layer that covers the heating resistor 4 and also serves as an insulating layer that covers a part of the conductor pattern 3. Reference numeral 6 denotes a substrate on which the heating resistors 4 are formed (hereinafter, referred to as a heating substrate). Reference numeral 7 denotes an adhesive made of, for example, an epoxy resin applied on the heat generating substrate 6, and 8 denotes an IC chip having a function of selectively driving the heat generating resistor 4 based on print information.
Fixed on top. Reference numeral 9 denotes, for example, a gold wire for connecting the conductor pattern 3 individually connected to the heating resistor 4 and an operation signal of the IC chip 8, and reference numeral 10 denotes another substrate (hereinafter, referred to as a printed circuit board) for routing the operation signal of the IC chip 8. The back side is a back side solder resist layer 11 and back side pattern 12 to be an insulating layer on the back side, and the front side is a front side pattern 13
And a surface solder resist layer serving as an insulating layer covering the surface pattern 14, and the surface pattern and the back surface pattern 12 are connected by through holes (not shown). A part of the surface pattern 13 is plated with gold to form a bonding terminal 15 connected to the IC chip 8 and the gold wire 9. Reference numeral 16 denotes a connector fixed to the printed circuit board 10 with solder 17 and serves as a connection point of a thermal head drive signal cable. Reference numeral 18 denotes an adhesive supporting the heat generating substrate 6 and the printed circuit board 10 with a double-sided tape 19, for example, aluminum,
A support table made of iron, polycarbonate, or the like, 20 is a recording paper such as a thermal paper or a transfer paper, and 21 is a platen roller for transporting the recording paper, which is located on the protective film 5 on the heating resistor 4 and rotates. . Reference numeral 22 denotes a protective resin made of, for example, silicone resin that protects the IC chip 8 and the gold wire 9. Reference numeral 23 denotes a cover made of, for example, a resin such as polycarbonate, which also serves as an external pressure-prevention recording paper 20. 18 is fixed on.

FIGS. 3 to 7 show a process in which an IC chip 8 is mounted on a heat-generating substrate 6 and connected to a conductor pattern 3 and a gold wire 9. FIG. It is shown by using the drawing, and shows that it is manufactured in the direction of the arrow. Here, a glass paste containing a small amount of strontium, for example, is printed on an alumina ceramic having a purity of 96% to a thickness of about 70 μm, dried, and then put into a firing furnace at 1200 ° C. to 1300 ° C., and cooled to cool the alumina ceramic substrate. The heat storage layer 2 is formed on the heat storage layer 1, and the surface roughness of the heat storage layer is made more uniform by mixing a small amount of strontium. Next, after printing, drying and baking an organic gold paste on the entire surface of the heat storage layer 2, a gold conductor layer 300 of about 0.5 μm is formed, a photosensitive resist is applied on the conductor layer 300, and photolithography is performed. The required conductor pattern 3 is formed by an etching technique. The thickness of the gold pattern of the conductor layer 300 is preferably as large as possible in view of the wire bond strength of the gold wire 9. However, it is necessary to minimize the use of expensive noble metal such as gold. According to experiments and results, the wire bond strength began to drop extremely below 0.5 μm. Further, the surface roughness of the heat storage layer 2 is 0.
When it is about 1 μmp-p or more, the capillary does not uniformly contact the conductor pattern at the time of wire bonding, which starts to deteriorate the yield of wire bonding.

FIG. 4 shows an arrangement of the conductor patterns 3 on the heat generating substrate 6. As shown in FIG. In FIG. 4, reference numeral 24a denotes an end common electrode located on the paper discharge side of the recording paper 21;
Connected to. The shorter the distance from the heating resistor 4 is, the smaller the thermal head can be. The recording by the selective driving of the heating resistor 4 on the recording paper 20 can be immediately viewed. 24b is an IC lower common electrode arranged below the mounting position of the IC chip 8, 25 is an individual electrode connected to the heating resistor 4, 26a and 26b are individual electrode groups a which group several individual electrodes, In the electrode group b shown in FIG. 4, the individual electrode group a26a corresponds to four individual electrodes 254, and the individual electrode group b26b corresponds to 258 individual electrodes. The individual electrode group a26a and the individual electrode group b26b are the end common electrode 24a,
It is separated by a common electrode connection pattern 27 connecting the IC lower common electrode 24b. 28 is a DIN terminal for connecting a print data input signal to the IC chip 8; 29 is a terminal for connecting a print data output signal from the IC chip 9; The pattern is connected to the DOUT terminal 29 on the heating substrate. 30 is I
A recognition pattern for automatic recognition of wire bonding of the C chip 8, 31 is a position recognition pattern indicating the position of the IC chip 8, 32 is a common electrode block terminal, 33 is a pattern in which individual electrodes 25 and a common electrode 24 pattern are alternately arranged. A resist paste containing, for example, ruthenium oxide, a glass component, zirconia, etc., is drawn directly in a band shape on a comb-shaped portion 33 using a dispenser, dried and fired to form a plurality of heating resistors 4. The formation is made. Comb-shaped part shown in FIG.
33 shows a state in which a heating resistor is formed on 33. Here, the direct drawing of the resistive paste is performed by automatically calculating the position by automatically recognizing the recognition patterns 30 and 31, etc., and implementing the device so that it is accurately positioned on the comb-shaped portion 33. Individual electrode 25 of comb 33
In a thermal head having a pattern width of the common electrode 24a and a pattern interval of 8 dots per mm, for example, the pattern width is 30 μm, the pattern interval is 32.5 μm, the length of the alternating comb portion is 0.6 mm, and the heating resistor 4 Is formed to have a width of 0.22 mm. When the resistor paste is applied by the printing method, the mesh shape of the printing screen causes the width of the heating resistor 4 to vary, and the width of the strip-shaped resistor is from 0.18 to 0.26 mm with respect to the center value of 0.22 mm. Variations occur due to the mesh shape, and the heating temperature of the heating resistor 4 differs between a narrow portion and a wide portion of the resistor, thereby resulting in uneven recording on a recording sheet and a reduction in print quality. In the direct drawing method, the width of the resistor and the thickness of the resistor are made uniform by changing the drawing speed and the resist paste dispensing pressure in the pattern recognition of the coating position and the recognition of the coating shape. . After the formation of the heating resistor 4, on the heating resistor 4,
A glass paste is screen-printed on the lower part of the IC chip 8, dried and fired to form the insulating protective film 5. FIG. 6 shows the arrangement of the protective film 5, and the portions not covered by the protective film 5 are the common electrode connection pattern 27 and the DIN terminal.
28, a DOUT terminal 29, a recognition pattern 30, a part of a common electrode block terminal 32, a probe terminal 34, an individual electrode terminal 35,
This is the common connection terminal 36. Here, the heating resistor 4
Is 1500Ω, the loss resistance of the common electrode lead is approximately 5Ω, M = 2048, N = 512 (where M is the number of heating resistors, and N is the number of common electrode connection patterns).
In this case, the loss per common electrode lead is about 0.3 V. However, since the common electrode is arranged, the loss is alleviated. There is conduction and there is no effect on image quality.

The test items for manufacturing the heating substrate 6 are as follows.
This is a check of the pattern shapes of the conductor pattern 3 and the protective film 5 and a measurement of the resistance value of the heating resistor which affects the performance of the thermal head. In a thermal head using a ruthenium oxide-based resistor, pulse trimming of the resistance value is also performed. Here, the measurement of the resistance value and the pulse trimming are performed by applying a probe having a needle-like tip to the probe terminal 34 and the individual electrode terminal 35 serving as the terminals of the common electrode, and applying a pulse voltage. In an A4 size thermal head having a resolution of 8 dots per mm, the number of individual electrode terminals 35 is 1728, and the total length is 1728 × 1 = 21.
6 mm. Here, it is quite difficult to fabricate 1728 needle-shaped probes with a pitch of 0.125 mm at 216 mm, and probing 1728 terminals at the same time is quite difficult considering the flatness of the heating substrate. is there. Due to the above difficulties, the current operation is carried out 27 times using a device that moves 64 individual electrode terminals 35 and a common electrode terminal every 27 mm, using a device that moves. Since the position of the probe terminal 34 of the common electrode of the conventional thermal head is on the discharge side of the recording paper 20, the heat-sensitive paper on the recording paper 20 may accumulate and cause printing defects or adversely affect the conductor pattern. Since the recording paper 34 is positioned in the feeding direction of the recording paper 20 so as not to touch the recording paper 20, the above problem does not occur. Also,
Because it is located at both ends of the IC as shown in the figure,
It can also be used as a mark for pattern recognition.

FIG. 7 shows a state where the IC chip 8 is mounted on the heat generating substrate 6. The adjacent positions of the individual electrode terminals 35 are staggered, and the connection positions of the gold wires 9 on the IC chip 8 side are arranged in a line. Here, the circuit diagram of the IC chip 8 is shown in FIG. 8, and has a driver configuration with a 64-bit shift register latch. The print information of one line is synchronized with the CLOCK signal from the DATA terminal,
Put into a 64-bit shift register circuit. Next, the print information is transferred to the 64-bit latch circuit serving as the memory circuit at the timing of inputting the LATCH signal. The bit corresponding to HIGH of the print information of the latch circuit is DO1 for the time when the ENL signal is LOW and the ENH signal is HIGH.
.. DO64 are selectively switched. This DO1
By connecting the heating resistor 4 to the DO 64, the heating resistor 4
Can be selectively driven based on the print information. 8, VDD is a drive power supply terminal of the IC chip 8, GND-L is a circuit power supply ground terminal, GND-H is a ground terminal of a switching element, DATA OUT is a data output terminal from the shift register, and is a next-stage IC chip. 8 DATA IN terminal. In a thermal head of A4 size and resolution of 8 dots per mm, there are 1728 heating resistors 4 and 27 64-bit IC chips 8 are mounted on the heating board 6 and connected. In this embodiment, the length of the IC chip 8 is 7.25 mm, and DO1 to DO4, DO4
5 to DO12, DO13 to DO20, DO21 to DO28,
DO29 to DO36, DO37 to DO44, DO45 to DO
52, DO53 to DO60 and DO61 to DO64 have a pitch of 0.
105 mm, DO4 and DO5, DO12 and DO13, DO20 and DO21, DO28 and DO29, DO36 and DO37, DO44 and D
The intervals between O45, DO52 and DO53, DO60 and DO61 (hereinafter referred to as
COM interval 40) is set to 0.12 mm. The common electrode connection pattern 27 is located at the COM interval 40. DO1 to DO4 and DO60 to DO64 correspond to the individual electrode group a26a, and the other DO bits correspond to the individual electrode group b26b. Here, when the diameter of the gold wire 9 is 25 μm, the size of the individual electrode terminal 35 is reduced to 90 μm or more when bonded to the individual electrode terminal 35 by a capillary at the time of wire bonding, and the gold wire 8 and the individual electrode terminal
35 will be connected. Therefore, the individual electrode terminals 35 are arranged in a staggered arrangement so that even if the collapse protrudes, the individual electrode terminals 35 do not contact the adjacent individual electrode terminals 36. Also, since the COM interval 40 is increased and the common electrode connection pattern 27 is aligned,
It prevents contact with the common electrode connection pattern 27 due to the drop of the gold wire 9. Also, the protective film 5 may cover the common electrode connection pattern 27, but it is difficult because the interval is only 0.12 mm. That is, screen printing accuracy is ± 0.2 in position accuracy.
It is difficult at present because there are problems such as about mm, screen pattern accuracy of ± 0.05 mm, width variation due to screen mesh, and bleeding of glass paste.

The DATA IN 38 of the IC chip 8 is DIN
The DATA OUT 37 is connected to the terminal 29 by the gold wire 9 and the DOUT terminal 28, and the IC chip 8 is sequentially data-connected. Of course, the wire bonding of these gold wires 9 is performed with high accuracy by performing the pattern recognition of the recognition pattern 30 and the position recognition pattern 31, while the printed board 10 and the IC chip 8 are shown in FIGS. 2 shows an arrangement and a pattern for connecting the heat generating substrate 6 with gold wires 9. In FIG. 9, the IC chip 8
In the above, 41 is CLOCK, 42 is VDD, 43 is ENH, 44 is ENL, 45 is GND-L, 46 is LATCH, and 47 is GND.
There are three places of -H at 47a, 47b and 47c. Reference numeral 15 denotes a wire bonding terminal of the printed circuit board 10, and a surface pattern 13 is provided.
For example, 5 to 10 nickel on copper with a thickness of about 15 to 30 μm
This is a place where gold plating is about 0.5 μm thick on nickel and electrolytic plating is about 0.5 μm thick. Although gold plating can be performed directly on copper, wire bonding is performed by heating, so that copper and gold are diffused, leading to poor wire bonding and oxidizing copper. Therefore,
The nickel layer is interposed about 10 μm thick. Reference numeral 14 denotes a surface solder resist layer that covers the copper pattern of the surface pattern 13 and the substrate. Reference numerals 48 to 55 denote signal terminals of the bonding terminal 15, reference numeral 48 denotes a BCLOCK connected to the CLOCK 41 of the IC chip 8 by the gold wire 9, and reference numeral 49 denotes a VDD42.
BVDD, 50 connected to BE, BE connected to ENH43
NH, 51 is BENL connected to ENL44, 52 is GND
BGND-L connected to L45, 53 is BLATCH connected to LATCH 46, 54a, 54b, 54c are GND-
BGND-H, 55 connected to H47a, 47b, 47c, is a BCOM connected to the common connection terminal 36. The patterns drawn from the respective bonding terminals are connected to the respective patterns 57 to 62 of the back surface pattern 13 through the through holes 56.

FIG. 10 is a diagram showing only the back surface pattern. Reference numeral 57 denotes a pattern to which the BCOM 55 of each IC block is connected (hereinafter referred to as PCOM), and reference numeral 58 denotes a pattern to which the BCLOCK 48 of each IC block is connected. (Hereafter, PC
LOCK), similarly, 59 is a pattern (hereinafter referred to as PVDD) to which BVDD 49 is connected, and 60 is BENH
Pattern to which 50 is connected (hereinafter referred to as PBENH), 61
Is a pattern to which BENL51 is connected (hereinafter referred to as PBENL), 62 is a pattern to which BLATCH53 is connected (hereinafter referred to as PLATCH), and 63 is BG on the surface pattern 13.
A pattern in which ND-L52 and BGND-H54a, 54b, 54c are connected (hereinafter referred to as PGND).

FIG. 11 is a diagram showing a wire connection pattern, arrangement, and the like of the first IC chip 8 to which data is input.
Reference numeral 64 denotes a terminal (referred to as TDATA) which is pattern-connected to the DATA IN 37 and the DIN terminal 28 of the IC chip 8, and a terminal 65 (hereinafter, referred to as TDATA) of the wire bonding terminal 15 of the printed circuit board 10.
BDATA) and gold wire 9
The TA terminal 65 is connected to a pattern 66 (hereinafter referred to as PDATA). Here, these PCOM57, PCLOC
K58, PVDD59, PENH60, PENL61, PLAT
CH62, PGND63, and PDATA66 are routed so as to be connected to pins of the connector 16. FIG. 20 shows an equivalent circuit of the first embodiment, and reference numeral 80 denotes a circuit (IC circuit) of the IC chip 8.

Next, the operation will be described. DATAIN37 and DATA of IC chip 8 of conventional thermal head
The OUT38 position was located on the printed circuit board 10 side, so D
In order to provide the ATA IN 37 and the DATA OUT 38 wire bonding terminals 15 on the printed circuit board 10 side, it is difficult to provide nickel and gold plated lead terminals on the connector pin side, so the wires are routed from the wire bonding terminals. FIG. 12 shows a state in which the printed board 10 of the conventional thermal head is being manufactured, and a large number of printed boards 10 are taken from one large-sized board 70. Here, reference numeral 71 denotes a plating lead, and a screw connected to an electrode is tightened at a round hole position, and nickel plating and gold plating are performed by dipping in a plating solution. 72 is BDATA IN
100, plating lead of BDATA OUT101 (hereinafter, referred to as
73 is a plating lead (hereinafter, referred to as a wire bonding side plating lead) drawn out from the connector pin direction.
B1 to B27 are 8).
27 blocks of mm pitch are shown, indicating that there are 27 blocks of the IC chip 8. Here, the inventor has noticed that the defects of the wire bonding terminals 15 of the printed circuit board 10 in the conventional thermal head are considerably concentrated on the portions located on the wire bonding side plating leads 72, and the plating thickness of the wire bonding terminals 15 is reduced. investigated. The nickel bonding and the gold plating are performed from the terminal without the wire bonding side plating lead 72, that is, the connector side plating lead 73 in the wire bonding terminal 15, there is almost no variation in the thickness, and the nickel thickness is 10 μm.
Although the metal plating of m ± 2μm was made at about 0.5μm ± 0.1μm, the nickel thickness of the terminal connected to the plating lead 72 on the wire bonding side and becoming the wire bonding terminal 15 varied from 30μm to about 15μm. The closer to the position, the thicker it was. This is shown in FIG. It was also found that the shape of these terminals was raised at the ends and was not flat, and it was found that these were the causes of wire bonding failure.
In the first embodiment of the present invention, DATA I on the IC chip 8
N37 and DATA OUT38 not on the printed circuit board 10 side,
Since the wire bonding terminals 15 are provided on the row of the individual electrode terminals 35 on the side of the heat generating substrate 6, there is no terminal in which the wire bonding terminals 15 are directly plated leads. Further, since the back surface pattern 12 below the wire bonding terminal 15 is a wide and stable pattern of the PCOM 57, the conditions in the thickness direction of the wire bonding become uniform.
If there is no PCOM57 pattern under the wire bonding terminal 15, the copper pattern thickness difference of about 30 μm, the double-sided tape 19 and the backside solder resist layer will not be adhered and float, which is not preferable for wire bonding. It is desirable that a wide back surface pattern be provided below the wire bonding terminal 15.

Embodiment 2 FIG. Next, the inventor has found that the GND-H47a, 47b,
The position of 47c was examined. Originally, as the number of GND-H connection positions increases, the loss voltage due to the resistance of the pattern wiring inside the IC chip 8 decreases. However, in order to reduce the number of wire bond connection points, the number of connection points is reduced. In the first embodiment, GND
-H is connected at three places. Here, the GND-H portion and the heating resistor drive terminal DO39 64 inside the IC chip 8 are connected.
The loss voltage when 9 mA was applied to each bit was examined. Figure
FIG. 14 shows the measurement results. 14 is DO1
And conventional I-type with GND-H arranged near DO32 and DO64
Arrangement of C-chip, upper figure shows the results of GND-H arrangement near DO12, DO32, DO54. Conventional up to 50
The variation between bits of mV was improved by about 40% to a maximum of about 30 mV, and as a printing result, the variation was further reduced. The position of the GND-H47 is set to two places at a position 25 bits away from the center and 16 bits from the center and one place at the center, so that it is within approximately 40 mV.
About 20% was in a position where it could be improved.

Embodiment 3 FIG. As a signal arrangement of the IC chip 8, ENH is placed next to VDD42.
If the ENH43 signal is not required by arranging the 43, the PVDD59 and the PENH60 may be connected as shown in FIG.
And BENH50 may be connected, resulting in a simple pattern arrangement.

Embodiment 4 FIG. As a signal arrangement of the IC chip 8, E is next to GND-L45.
By arranging the NL44, if the ENL44 signal is not required, as shown in FIG. 16, the BENL51, BGND-L
52, BGND-H47b, 47c may be connected, or a pattern may be connected, resulting in a simple pattern arrangement.

Embodiment 5 FIG. Further, by providing a rectangular pattern for wire bonding recognition as shown by 74 in FIG. 16, the efficiency of recognition by an automatic wire bonding apparatus can be increased.
The recognition pattern may be a square dent pattern.
The round recognition pattern is unlikely to be formed into a uniform round shape by etching of a copper pattern, nickel plating, and gold plating, and a square pattern is desired for uniformity of the pattern.

Embodiment 6 FIG. Further, as shown in FIG. 17, by hitting the signal of the IC chip 8 with the gold wire 9 two by two, it is possible to prevent wire bonding failure on the printed circuit board 10 side. Printed board
The temperature at the time of wire bonding of No. 10 is a low temperature due to the permissible temperature of the material of the printed circuit board and the difficulty of heat conduction, leading to poor wire bonding. By the way, when the wire bond is defective, the IC chip 8 is removed and replaced. However, the wire connection terminal on the side of the heat generating substrate 6 can be cleaned by removing the gold wire 9, but the printed circuit board can be cleaned.
The wire bonding terminal 15 on the 10 side is difficult to reproduce because the gold wire 9 is removed or the IC chip 8 is peeled off from the printed circuit board when the IC chip 8 is replaced. Therefore, making the wire bond on the printed circuit board 10 more reliable leads to a further improvement in production yield.

Embodiment 7 FIG. FIG. 18 shows a case where the printed circuit board 10 is formed in a single-sided pattern.
Can be used.

Embodiment 8 FIG. Further, the heat generating substrate 6 may be enlarged without using the printed circuit board 10, and may have a configuration similar to the pattern arrangement shown in FIG. In this case, to enhance the wiring pattern of the PCOM 57 PGND 58, for example, a glass frit-based gold paste or a silver paste is overprinted on the conductor pattern 3 made of an organic gold paste, and then the necessary portions are exposed with the glass paste to form the gold wires 9. What is necessary is just to perform wire bonding. The connector 15 is press-bonded to a pattern of 57, 58, 59, 60, 61, 63 using a flexible printed circuit board by thermocompression bonding using an anisotropic conductive film, indium solder, or the like. May be connected by soldering. Further, the connector may be directly connected to the pattern using indium solder or the like, or may have a pressure contact structure.

Embodiment 9 FIG. In the first embodiment, GND-L45 and GND-H47 are connected and P
Although the GND 63 is used, the structure may be such that the pins of the connector of the thermal head are separated and connected in the vicinity of the terminal of the power supply of the apparatus using the thermal head, and it goes without saying that the signal pattern wiring is not particularly limited.

Embodiment 10 FIG. In the first embodiment, the width of the common electrode pattern of the comb-shaped portion and the width of the individual electrode pattern are the same. However, when the resistance value of the heating resistor is low and the current is large, the width of the common electrode pattern is increased by increasing the width of the common electrode pattern. The loss of the connection pattern can be reduced.

Embodiment 11 As shown in FIGS. 25 and 26, a high conductive film 400 may be further formed. Specifically, after the protective film 5 is formed, a conductive glass paste is screen-printed on the heating resistor 4, dried and fired. This high conductive film 40
0 is the common electrode block terminal 3 which is not covered with the protective film 5
By being connected to the probe terminal 34 of a part of 2,
The static electricity generated during printing can be released to the outside via the common electrode block, and a defect of the heating resistor 4 due to the static electricity can be prevented.

Embodiment 12 FIGS. 27, 28 and 29 are plan views of a thermal head according to another embodiment of the present invention. In the conventional thermal head as shown in FIGS. 30 and 31, the protruding adhesive diffuses along the edge of the protective film 5 onto the common electrode pad 24b, and the common electrode pad 24b and the Au wire 9 However, connection failures such as failure of connection or weak connection strength have occurred. However, FIG.
Such a problem can be solved by forming the protective film 5 into a mountain shape so as to sandwich the common electrode pad 24b as shown in FIG. Further, as shown in FIGS. 28 and 29, the same effect can be obtained by changing the shape of the protective film 5 to a valley or trapezoid.

Embodiment 13 Regarding a method of connecting an IC chip, not a wire bond but a flip chip I using a solder pump or a gold pump.
Connection using a face-down method using C, a tab method using a film, or the like may be used, and there is no particular limitation.

Embodiment 14 Although the case where the conductive pattern is formed of an organic gold paste with a thickness of 0.5 μm is shown, other conductive materials may be used. In particular, if the resistance value of the heating resistor is high, a pattern using a resin paste mixed with a metal such as Al or a conductor having a high specific resistance may be used, and there is no particular limitation.

Embodiment 15 Further, the operation circuit of the IC chip is not particularly limited, and a latch circuit may be omitted or the number of signal terminals may be reduced.

[0030]

Since the present invention is configured as described above, it has the following effects. No.
The thermal head according to the first aspect of the present invention includes a substrate,
A heating resistor provided along one edge at one end;
Along the edge closer to the one end of the substrate than the thermal resistor
And a plurality of the plurality of heating elements are provided and extend so as to intersect with the heating resistor.
An end common electrode having a plurality of electrodes;
Individual electrodes intersecting with the heating resistor alternately with the number of electrodes,
The individual electrodes provided on the other end side of the substrate and
Connected to drive the heating resistor based on print information.
Several IC chips and the IC chip rather than the heating resistor
Through the common electrode connection pattern provided on the
IC chip side common electrode connected to the common electrode
The end portion between the heating resistor and the IC chip;
It has a probe terminal connected to the common electrode
The image quality is poor because the heat paper does not collect the residue.
Absent. A thermal head according to a second aspect of the present invention is a thermal head according to the first aspect.
, At least the height connected to the probe terminal
Since it has a conductive film, it is antistatic. Third departure
A thermal head according to the present invention comprises a substrate, and one end of the substrate.
A heating resistor provided along an edge of the heating resistor;
Provided along the edge closer to the one end of the substrate than the body.
A plurality of electrodes extending so as to intersect the heating resistor
And a plurality of electrodes of the end common electrode.
An individual electrode that intersects the heating resistor alternately with the pole;
Provided at the other end of the plate and connected to the individual electrodes.
A plurality of driving the heating resistors based on print information.
An IC chip and a common electrode contact provided on the IC chip side.
IC connected to the end common electrode through a connection pattern
The chip-side common electrode and the substrate are provided separately from the substrate.
A printed circuit board on which electrodes are formed by the
Connect the data input terminal and the data output terminal of the IC chip.
Connecting the conductive pattern to the heating chip
Since it is arranged on the substrate on the antibody side, on the printed circuit board
Has a plating lead that causes wire bonding failure.
Wire bonding failure
Can be improved. The thermal head according to the fourth invention
A pad is provided along an edge at one end of the substrate and the substrate.
The heating resistor, and the substrate more than the heating resistor
The heating resistor is provided along an edge on the one end side.
End common electrode having a plurality of electrodes extending to intersect
The electrodes and the plurality of electrodes of the end common electrode alternately generate the heat.
An individual electrode intersecting with a resistor, and provided on the other end side of the substrate
And the heating resistor connected to the individual electrode.
A plurality of IC chips driven based on print information;
The IC is provided on the IC chip side and projects to the heating resistor side.
Through-electrode pad, and through the common electrode connection pattern
The common electrode on the IC chip side connected to the common electrode on the
On the protective film attached on the IC chip side common electrode
The IC chip is adhered with an adhesive,
The protective film is provided between the common electrode on the IC chip side and the common electrode.
A portion where the electrode pad protrudes, in the longitudinal direction of the substrate.
Protruding in the shape of a mountain in the short direction of the substrate near both ends of
Adhesive, preventing the adhesive from sticking out and improving the yield.
And productivity can be improved. In the fifth invention
Such a thermal head comprises a substrate and one end of the substrate.
A heating resistor provided along the edge;
Also provided along the edge on the one end side of the substrate,
A plurality of electrodes extending so as to intersect the heating resistor.
An end common electrode, and a plurality of electrodes of the end common electrode
An individual electrode alternately intersecting with the heating resistor, and
Before being provided on the other end side and connected to the individual electrode
A plurality of ICs for driving the heating resistor based on print information
Chip and the heating resistor provided on the IC chip side
The common electrode connection pattern
IC chip connected to the end common electrode via a line
And a common electrode on the IC chip side.
The IC chip is adhered with an adhesive on the attached protective film.
And the protection film is provided on the IC chip side common electrode.
A portion where the common electrode pad protrudes,
A trough in the lateral direction of the substrate near both ends in the longitudinal direction of the substrate
Since it is formed in a concave shape in the mold, the glue
Prevention, increase yield, and increase productivity
Can be. A thermal head according to a sixth aspect of the present invention includes a substrate
And a heating resistor provided along one edge at one end of the substrate.
An antibody and the one end side of the substrate relative to the heating resistor
Is provided along the edge so as to intersect with the heating resistor.
And the end common electrode that having a plurality of electrodes extending in the end
Intersects with the heating resistor alternately with the multiple electrodes of the common electrode
And an individual electrode provided on the other end side of the substrate.
The heating resistor connected to the individual electrode is determined based on print information.
And a plurality of IC chips to be driven
A common electrode pad provided on the heating resistor and protruding toward the heating resistor side
And the end common electrode through a common electrode connection pattern.
And an IC chip-side common electrode connected to the electrodes.
The IC chip is placed on the protective film deposited on the common electrode on the C chip side.
The cap is adhered with an adhesive, and further, the protective film is
The common electrode pad protrudes from the IC chip side common electrode.
At the protruding part, a protrusion is formed in the lateral direction of the substrate.
Prevents adhesive from overflowing and improves yield
And increase productivity. According to a seventh aspect of the present invention,
The head according to the first to sixth inventions, wherein the IC
Heating resistor drive terminals on the chip should be at the same pitch
The common electrode connection pattern is composed of several groups
Since the turns are located between the groups,
When performing ear bonding, the wire
No contact, reliability is improved. Therma according to the eighth invention
In the first to seventh inventions, the head is provided in front of the substrate.
The IC chip is placed separately from the substrate on the side where the IC chip is placed.
Printed circuit board, and provided on the printed circuit board.
Wire bonding with the common electrode on the IC chip side of the substrate
Wire bonding terminal connected by
Surface of the printed circuit board on which the wire bonding terminals are provided
And the wire bondin
Board short side direction connected to through terminals and through holes
Printed with a wide conductor pattern
The lower part of the wire stitch on the wiring board is flat,
The contact with the pump becomes uniform. The thermal head according to the ninth invention
The driving IC of the pad has a heating resistor drive at one long side end.
Element, print data input terminal and print data output terminal
And a signal terminal for driving the IC chip at the other long side end.
Switch near the center between the long sides of the one and the other.
Since the grounding terminal of the switching element is located,
Turn arrangement is easy and the ground pattern is wide at the center
And the loss of the ground pattern of the IC is reduced.
The effect is that grounding can be taken at any location.
You. IC for driving a thermal head according to a tenth invention
In the ninth invention, three ground terminals are provided, and one
Is located at the approximate center of the heating resistor drive terminals,
The two are connected to the plurality of heat sources on both sides from the one ground terminal.
Separation equivalent to 1/4 to 2/5 of the number of resistor drive terminals
The voltage drop between bits
Less unevenness in printing, reducing printing variations
It can lead to quality improvement. According to the eleventh invention
The drive IC for the thermal head has an internal pull-down resistor
IC adjacent to the IC chip driving signal terminal connected to the IC
A chip drive power supply pin is arranged, and a pull-up resistor is used internally.
Adjacent to the connected IC chip driving signal terminal.
The ground terminal of the C chip drive power supply terminal is arranged.
Since the pattern can be shared, the conductor pattern to be connected
Line wiring becomes easy.

[Brief description of the drawings]

FIG. 1 is a perspective view of a thermal head according to an embodiment of the present invention.

FIG. 2 is a sectional view of a thermal head according to an embodiment of the present invention.

FIG. 3 is a diagram showing a manufacturing process of the thermal head according to one embodiment of the present invention.

FIG. 4 is a view showing a conductor pattern of a heat generating substrate of the thermal head according to one embodiment of the present invention.

FIG. 5 is a view showing a conductor pattern and a heating resistor of a heating substrate of a thermal head according to an embodiment of the present invention.

FIG. 6 is a diagram showing a protective film pattern of a heat generating substrate of a thermal head according to an embodiment of the present invention.

FIG. 7 is an IC chip mounting diagram on a heat generating substrate of the thermal head according to one embodiment of the present invention.

FIG. 8 is a circuit diagram of an IC chip for driving a thermal head according to an embodiment of the present invention.

FIG. 9 is a mounting diagram of another substrate and an IC chip of the thermal head according to the embodiment of the present invention.

FIG. 10 is a back surface pattern diagram of another substrate of the thermal head according to one embodiment of the present invention.

FIG. 11 is a mounting diagram of another substrate and a leading IC chip of the thermal head according to one embodiment of the present invention.

FIG. 12 is a diagram illustrating a plating step in a process of manufacturing another substrate of a conventional thermal head.

FIG. 13 is a diagram showing variations in terminal thickness due to plating leads.

FIG. 14 is a diagram showing a position and a loss of a ground terminal in an IC chip.

FIG. 15 is a pattern diagram of another substrate of a thermal head according to another embodiment of the present invention.

FIG. 16 is a pattern diagram of another substrate of a thermal head according to another embodiment of the present invention.

FIG. 17 illustrates a thermal head according to another embodiment of the present invention;
It is a C-chip mounting diagram.

FIG. 18 is a view showing a thermal head according to another embodiment of the present invention.

FIG. 19 is a view showing a thermal head according to another embodiment of the present invention.

FIG. 20 is an equivalent circuit diagram of a thermal head according to one embodiment of the present invention.

FIG. 21 is a perspective view showing a conventional thermal head.

FIG. 22 is a sectional view showing a conventional thermal head.

FIG. 23 is an equivalent circuit diagram showing a conventional thermal head.

FIG. 24 is a view showing an IC chip of a conventional thermal head.

FIG. 25 is a diagram showing a manufacturing process of a thermal head according to another embodiment of the present invention.

FIG. 26 is a view showing a protection pattern and a high conductive film pattern of a heat generating substrate of a thermal head according to another embodiment of the present invention.

FIG. 27 is a plan view of a thermal head according to another embodiment of the present invention.

FIG. 28 is a plan view of a thermal head according to another embodiment of the present invention.

FIG. 29 is a plan view of a thermal head according to another embodiment of the present invention.

FIG. 30 is a plan view of a conventional thermal head.

FIG. 31 is a plan view of a conventional thermal head.

[Explanation of symbols]

1 alumina ceramic substrate, 2 heat storage layer, 3 conductor pattern, 4 heating resistor, 5 protective film, 6 heating substrate,
7 adhesive, 8 IC chip, 9 gold wire, 10 printed circuit board, 11 back solder resist layer, 12 back pattern, 13 front pattern, 14 front solder resist layer, 15 bonding terminal, 16 connector, 17 solder,
18 support base, 19 double-sided tape, 20 recording paper, 21 platen roller, 22 protective resin, 23 cover, 24a end common electrode, 24b IC lower common electrode, 25 individual electrodes, 26a individual electrode group a, 26b individual electrode group b , 27 common electrode connection pattern, 28 DIN terminal, 29 DOUT terminal, 30 recognition pattern, 31 position recognition pattern, 32 common electrode block terminal, 33 comb-shaped part, 34 probe terminal, 35 individual electrode terminal, 36 common connection terminal, 37 DATA OUT,
38 DATA IN, 39 DO, 40 COM interval, 41
CLOCK, 42 VDD, 43 ENH, 44 ENL, 45
GND-L, 46 LATCH, 47a GND-H, 47b
GND-H, 47c GND-H, 48 BCLOCK,
49 BVDD, 50 BENH, 51 BENL, 52 BGN
DL, 53 BLATCH, 54a, 54b, 54c BGN
DH, 55 BCOM, 56 through hole, 57 PCO
M, 58 PCLOCK, 59 PVDD, 60 PENH,
61 PENL, 62 PLATCH, 63 PGND, 64
TDATA, 65 BDATA, 66 PDATA, 70 Large board, 71 plating lead, 72 wire bonding side plating lead, 73 connector side plating lead, 74 square pattern, 75 one side pattern, 80 IC circuit, 90 common reinforced part, 100 BDATA IN , 101 BDAT
A OUT, 300 conductor layers, 400 highly conductive films.

Claims (11)

(57) [Claims] 1. A substrate and one end of said substrate along an edge
A heating resistor provided, and the heating resistor is more than the heating resistor.
The one end of the substrate is provided along the edge,
End having a plurality of electrodes extending to intersect the resistor
The common electrode and the plurality of electrodes of the end common electrode are alternately contacted.
An individual electrode that intersects the heating resistor, and the other end of the substrate
And the heating resistor connected to the individual electrode.
Multiple IC chips that drive antibodies based on print information
Provided on the IC chip side of the heating resistor
Connect to the end common electrode via common electrode connection pattern
A common electrode on the IC chip side, and the heat generating resistor
And the IC chip is connected to the end common electrode.
Thermal head with probe terminals. 2. A device connected to at least the probe terminal.
The thermal head according to claim 1, further comprising a high conductive film. 3. A substrate and one end of said substrate along an edge.
A heating resistor provided, and the heating resistor is more than the heating resistor.
The one end of the substrate is provided along the edge,
End having a plurality of electrodes extending to intersect the resistor
The common electrode and the plurality of electrodes of the end common electrode are alternately contacted.
An individual electrode that intersects the heating resistor, and the other end of the substrate
And the heating resistor connected to the individual electrode.
Multiple IC chips that drive antibodies based on print information
And a common electrode connection pattern provided on the IC chip side
The IC chip side connected to the end common electrode via
The conductive electrode and the substrate are provided separately from each other, and are formed by a plating process.
A printed circuit board on which the electrodes are formed.
Conductor connecting the data input terminal and the data output terminal of the
The pattern is placed on a substrate closer to the heating resistor than the IC chip.
A thermal head characterized by being arranged on a plate. 4. A substrate and one edge of said substrate along an edge.
A heating resistor provided, and the heating resistor is more than the heating resistor.
The one end of the substrate is provided along the edge,
End having a plurality of electrodes extending to intersect the resistor
The common electrode and the plurality of electrodes of the end common electrode are alternately contacted.
Individual electrodes intersecting the heat generating resistor, the other end portion side of the front Stories substrate
And the heating resistor connected to the individual electrode.
Multiple IC chips that drive antibodies based on print information
Projecting toward the heating resistor provided on the IC chip side.
The common electrode pad
IC chip side connected to the end common electrode via
And an electrode attached to the IC chip-side common electrode.
The IC chip is adhered on the protective film with an adhesive.
Further, the protective film is provided in front of the IC chip side common electrode.
Where the common electrode pad protrudes, and
Near the both ends in the longitudinal direction, project in a mountain shape in the short direction of the board.
Thermal head formed. 5. A substrate and one edge of said substrate along an edge.
A heating resistor provided, and the heating resistor is more than the heating resistor.
The one end of the substrate is provided along the edge,
End having a plurality of electrodes extending to intersect the resistor
The common electrode and the plurality of electrodes of the end common electrode are alternately contacted.
An individual electrode that intersects the heating resistor, and the other end of the substrate
And the heating resistor connected to the individual electrode.
Multiple IC chips that drive antibodies based on print information
Projecting toward the heating resistor provided on the IC chip side.
The common electrode pad
IC chip side connected to the end common electrode via
And an electrode attached to the IC chip-side common electrode.
The IC chip is adhered on the protective film with an adhesive.
Further, the protective film is provided in front of the IC chip side common electrode.
Where the common electrode pad protrudes, and
In the vicinity of both ends in the longitudinal direction, valley-shaped
Thermal head formed in a concave shape. 6. A substrate and one end of said substrate along an edge.
A heating resistor provided, and the heating resistor is more than the heating resistor.
The one end of the substrate is provided along the edge,
End having a plurality of electrodes extending to intersect the resistor
The common electrode and the plurality of electrodes of the end common electrode are alternately contacted.
An individual electrode that intersects the heating resistor, and the other end of the substrate
And the heating resistor connected to the individual electrode.
Multiple IC chips that drive antibodies based on print information
Projecting toward the heating resistor provided on the IC chip side.
The common electrode pad
IC chip side connected to the end common electrode via
And an electrode attached to the IC chip-side common electrode.
The IC chip is adhesively bonded onto the protective film, and
Further, the protective film is provided in front of the IC chip side common electrode.
In the area where the common electrode pad protrudes,
Thermal head formed to protrude in the direction. 7. Driving a heating resistor in the IC chip
Terminals consist of several groups arranged at the same pitch.
The common electrode connection pattern is disposed between the groups.
Claims 1, 2, 3, 4, 5 or
Is a thermal head according to 6. 8. An end of said substrate on which said IC chip is arranged.
A printed circuit board provided separately from the substrate on the side of the unit,
The IC chip side of the substrate provided on the printed circuit board
Wire rod connected to the through electrode and wire bonding
And a wire bonding terminal of the printed circuit board.
Is provided on the surface opposite to the surface on which the terminal is provided.
Through the wire bonding terminal and through hole
Connected with a wide conductor pattern in the short direction of the board
7. The electronic device according to claim 1, wherein:
Or the thermal head according to 7. 9. A heating resistor driving element at one end of a long side.
Arrange the print data input terminal and the print data output terminal,
An IC chip driving signal terminal is arranged at the other long side end,
Switching near the center between the one and the other long sides
I for driving the thermal head with the ground terminal of the element
C. 10. A semiconductor device having three ground terminals, one being a plurality of ground terminals.
It is located almost at the center of the heating resistor drive terminal, and the other two are
The plurality of heating resistor drivers are provided on both sides from the one ground terminal.
Separated positions corresponding to 1/4 to 2/5 of the number of moving terminals
The thermal head according to claim 9, wherein
Driving IC. 11. An IC internally connected to a pull-down resistor.
IC chip drive power supply adjacent to C chip drive signal terminal
IC with terminals arranged and internally connected to a pull-up resistor
The IC chip driving power is adjacent to the chip driving signal terminal.
I for driving the thermal head with the ground terminal of the source terminal
C.