JPS58160165A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS58160165A JPS58160165A JP4402682A JP4402682A JPS58160165A JP S58160165 A JPS58160165 A JP S58160165A JP 4402682 A JP4402682 A JP 4402682A JP 4402682 A JP4402682 A JP 4402682A JP S58160165 A JPS58160165 A JP S58160165A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- external circuit
- heat generating
- drive
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
- Facsimile Heads (AREA)
Abstract
Description
【発明の詳細な説明】
この発明はファクシミリ等に使用されるサーマルヘッド
に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thermal head used in facsimiles and the like.
従来、この種の装置として第１図に示すものがあった。Conventionally, there has been a device of this type as shown in FIG.
５０＃こおいて、（２）はアルミナセラミックの発熱基
板、（２ｂ）はその表面に形成された（し状）金ノリー
ド、（２リ は発熱基板（２）上にリード（２ｂ）と接
触するように形成された発熱素子、ａｌｌはシフトレジ
スタからなり、印字すべき一走査線分の記録信号りがへ
カされ、これを記憶するメモリ、＠はメモ１７ ＱＢか
らの゛記録信号りから発熱素子（２ａ）の駆動信号を作
成する駆動回路、０は上記駆動回路■の駆動信号を受け
、上記発熱素子（２１）の隣接するリード（２ｂ）間の
駆動すべき区間（２Ｓ）を選択するダイオードマトリッ
クスである。In the case of 50#, (2) is an alumina ceramic heating board, (2b) is a gold lead formed on the surface (2b), and (2ri is a contact with lead (2b) on the heating board (2)). All is a shift register, and the recording signal for one scanning line to be printed is transferred to the memory that stores it. @ is from the recording signal from QB. A drive circuit that generates a drive signal for the heat generating element (2a), 0 receives the drive signal from the drive circuit (2) and selects a section (2S) between adjacent leads (2b) of the heat generating element (21) to be driven. It is a diode matrix.
次暴こ動作について説明する。Next, the violent action will be explained.
メモリα旧こ入力された記録信号りは駆動回路圓番こよ
り発熱素子（′２ｍ）を駆動する信号に変換され、この
信号に応じてダイオードマトリックスロは発熱素子（２
龜）を選択駆動し、該発熱素子（２１）が発熱して感熱
紙上に感熱印字が行われる。The recording signal inputted to the memory α is converted into a signal that drives the heating element (2m) by the drive circuit, and according to this signal, the diode matrix
The heating element (21) generates heat and thermal printing is performed on the thermal paper.
従来のサーマルヘッドは以上のように構成されているが
、上記メモリ曲および駆動回路＠はプリント基板に多数
の汎用ＤＩＰ （ｐｕａｌ ＩｎｌｉｎｅＰｌｃｋｉ
ｇｅ ）形ＩＣを搭載して構成されるものであり、また
ダイオードマトリックスａ３もプリント基板に多数のガ
ラス封止形ダイオードを搭載して構成されるものであり
、これらは発熱基板に対し外部回路に設けられているの
で、本サーマルヘッドにおいては、発熱基板（２）を除
く周辺回路は多数の素子が搭載された複数の基板を備え
、さら番こ数多くのコネクタ、ケーブル等を備えたかな
り大きく、かつかなり重いものとなるという欠点があっ
た。The conventional thermal head is configured as described above, but the memory track and drive circuit @ are mounted on a printed circuit board with a large number of general-purpose DIPs (Pual Inline Plcki).
ge ) type IC, and the diode matrix a3 is also composed of a large number of glass-sealed diodes mounted on a printed circuit board, and these are connected to the external circuit on the heat generating board. Therefore, in this thermal head, the peripheral circuitry except for the heat generating board (2) is quite large, with multiple boards on which many elements are mounted, and a large number of connectors, cables, etc. It also had the disadvantage of being quite heavy.
この発明は上記のような従来のものの欠点を除去するた
めになされたもので、選択駆動素子であるメモリ、駆動
回路、ダイオードマトリックスを集積回路化したものを
、発熱基板上に実装し、更に発熱基板と装置外部とを接
続するコネクタ、ケーブル等の外部回路１つにまとめて
外部回路基板を構成し、この外部回路基板と上記発熱基
板とを共にベース上番こ搭載することにより、構造が簡
単かつ組立が容易になり、大幅な小型化、軽量化が達成
でき、しかも部品点数も大幅に削減できるサーマルヘッ
ドを提供することを目的としている。This invention was made in order to eliminate the drawbacks of the conventional ones as described above.The present invention was made in order to eliminate the drawbacks of the conventional ones as described above. The structure is simplified by combining external circuits such as connectors and cables that connect the board and the outside of the device into one external circuit board, and by mounting this external circuit board and the heat generating board together on the top of the base. The object of the present invention is to provide a thermal head that is easy to assemble, can be significantly reduced in size and weight, and can also significantly reduce the number of parts.
以下、この発明の一実施例を図について説明する。An embodiment of the present invention will be described below with reference to the drawings.
第２図ないし第５図はこの発明の一実施例によるサーマ
ルヘッドを示し、図において、第１図と同一符号は同−
又は相当部分を示す。α匂は従来のメモリαυおよび駆
動回路υの機能を達成するメモリ／駆動回路、（２Ｃ）
（２ｄ） は発熱基板（２）にダイボンドにより搭載
された選択駆動素子であり、このうら選択駆動素子（２
Ｃ）はダイオードマトリックスａ３を構成するもの、選
択駆動素子（２ｄ）はメモリ／駆動回路ａ０を構成する
ものである。また（３）はり−ド引廻基板、（４１，は
このリード４廻基板（３）を固定支持する支持基板、（
社）は内基板１３１ （４１からなる外部回路基板であ
り、この外部回路基板面はコネクタ（８）から与えられ
る記録信号りあるいは駆動電源Ｖを上記ダイオードマト
リックス■あるいはメモリ／駆動回路ａ４を構成する選
択駆動素子（２Ｃ）あるいは（２ｄ）に供給するものと
なっている。また（１）はその上面に発熱基板（２）お
よび外部回路基板面を搭載しているベース、（５）は上
記リード４廻基板（３）をゴム（７）を介して支持する
押え金具、（６）は選択駆動素子（２Ｃ） （２ｄ）を
保護するカバー、圓はボルト、（９）は絶縁ブロックで
ある。2 to 5 show a thermal head according to an embodiment of the present invention, and in the figures, the same reference numerals as in FIG.
or a corresponding portion. α is a memory/drive circuit that achieves the functions of conventional memory αυ and drive circuit υ, (2C)
(2d) is a selection drive element mounted on the heat generating substrate (2) by die bonding, and among these is the selection drive element (2).
C) constitutes the diode matrix a3, and the selection drive element (2d) constitutes the memory/drive circuit a0. Also, (3) a beam lead circuit board, (41, a support board for fixedly supporting this lead four circuit board (3), (41,
The inner board 131 (41) is an external circuit board, and this external circuit board surface connects the recording signal or drive power V supplied from the connector (8) to the diode matrix 1 or the memory/drive circuit a4. It supplies the selective drive element (2C) or (2d). Also, (1) is the base on which the heat generating board (2) and the external circuit board are mounted, and (5) is the above-mentioned lead. 4. A presser metal fitting that supports the substrate (3) via a rubber (7), (6) a cover that protects the selection drive element (2C) (2d), a circle (round) of a bolt, and (9) an insulating block.
次に動作について説明する。Next, the operation will be explained.
全体としての動作は従来と同様であるが、本サーマルヘ
ッドにおいては選択駆動素子（２Ｃ）（２ｄ）が記録信
号りに応じて発熱素子（２１）を選択駆動する。つまり
、本サーマルヘッドは発熱素子（２１）の駆動制御に必
要な機能をすべて発熱基板（２）上に搭載している。こ
のため従来のものの様にメモリ圓、駆動回路＠およびダ
イオードマトリックス０からなる外部回路が重量増や大
型化を招くといったこともなく、大幅に小型、軽量化で
きるとともに部品点数の大幅な削減を達成でき、しかも
組立に要する時間を減少することができる。The overall operation is the same as the conventional one, but in this thermal head, the selective drive elements (2C) (2d) selectively drive the heating elements (21) in accordance with the recording signal. In other words, this thermal head has all the functions necessary for drive control of the heat generating element (21) mounted on the heat generating substrate (2). Therefore, the external circuit consisting of the memory circle, drive circuit @, and diode matrix 0 does not increase in weight or size as in conventional products, and it is possible to achieve a significant reduction in size and weight, as well as a significant reduction in the number of parts. Moreover, the time required for assembly can be reduced.
以上のよう番ここの発明によれば、集積回路化した選択
駆動素子を発熱基板上に実装し、発熱基板と装置外部と
を接続するコネクタ、ケーブル類を外部回路基板１つ暴
こまとめ、この外部回路基板と発熱基板とを共にベース
上に搭載するようにしたので、構造が簡単かつ組立てが
容易になり、大幅な小型、軽量化が可能となり、部品点
数も大輪に削減できるサーマルヘッドを提供できる効果
がある。As described above, according to the present invention, the selection drive element integrated into a circuit is mounted on a heat generating board, and the connectors and cables for connecting the heat generating board and the outside of the device are bundled together on one external circuit board. Since both the external circuit board and the heat generating board are mounted on the base, the structure is simple and easy to assemble, making it possible to significantly reduce size and weight, and provide a thermal head that can reduce the number of parts to a large number. There is an effect that can be done.
第１図は従来のサーマルヘッドを示す図、第２図は本発
明の一実゛施例によるサーマルヘッドを示す図、第゛３
図は第２図の平面図、第４図は第３図のサポータを外し
た状態での平面図、第５図は第３図のＶ−Ｖ線断面図で
ある。
（２）・・・発熱基板、（２１）・・・発熱素子、（２
ｂ）・・・リード、（２Ｃ） （２ｄ）・・・１選択駆
動素子、（社）・・・外部回路基板、（１）・・・ベー
ス。
な右図中間−符号は同−又は相当部分を示す。
代理人 葛 野 信 −
第１図
第３図
第４図
第５図Fig. 1 shows a conventional thermal head, Fig. 2 shows a thermal head according to an embodiment of the present invention, and Fig. 3 shows a thermal head according to an embodiment of the present invention.
2 is a plan view of FIG. 2, FIG. 4 is a plan view of FIG. 3 with the supporter removed, and FIG. 5 is a sectional view taken along the line V--V of FIG. 3. (2)... Heat generating board, (21)... Heat generating element, (2
b)...Lead, (2C) (2d)...1 selection drive element, (Corporation)...External circuit board, (1)...Base. The middle numerals in the right figure indicate the same or equivalent parts. Agent Shin Kuzuno - Figure 1 Figure 3 Figure 4 Figure 5
Claims (1)
供給する複数のリードとが形成された発熱基板と、この
発熱基板の表面に搭載され印字すべき記録信号に応じて
上記発′熱素子を選択駆動する選択駆動素子と、この選
択駆動素子に上記記録信号を供給するための外部回路基
板と、この外部回路′基板と上記発熱基板とをその上面
に搭載しているベースとを備えたことを特徴とするサー
マルヘッド。(1) A heat generating board on which a heat generating element and a plurality of leads for supplying voltage to the heat generating element are formed; A selection drive element for selectively driving the selection drive element, an external circuit board for supplying the recording signal to the selection drive element, and a base on which the external circuit board and the heating board are mounted. A thermal head characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4402682A JPS58160165A (en) | 1982-03-18 | 1982-03-18 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4402682A JPS58160165A (en) | 1982-03-18 | 1982-03-18 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58160165A true JPS58160165A (en) | 1983-09-22 |
Family
ID=12680134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4402682A Pending JPS58160165A (en) | 1982-03-18 | 1982-03-18 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58160165A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS578177A (en) * | 1980-06-17 | 1982-01-16 | Matsushita Electric Ind Co Ltd | Thermal head |
| JPS5743883A (en) * | 1980-08-29 | 1982-03-12 | Toshiba Corp | Thermal head |
-
1982
- 1982-03-18 JP JP4402682A patent/JPS58160165A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS578177A (en) * | 1980-06-17 | 1982-01-16 | Matsushita Electric Ind Co Ltd | Thermal head |
| JPS5743883A (en) * | 1980-08-29 | 1982-03-12 | Toshiba Corp | Thermal head |
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