JP2527361Y2 - Conductor connection structure of thermal head array - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connecting structure of a thermal head array used for a thermal recording apparatus.

[0002]

2. Description of the Related Art FIG. 4 is a diagram for explaining the operation of a thermal head array. In FIG. 4, 1 is a thermal head array, 2 is a shift register, 3 is a latch, 4 is a driver, 5 is a power supply, In many cases, the shift register 2, the latch 3, and the driver 4 are collectively configured as an IC, and these are collectively referred to as a control circuit IC6. 7 is a switch,
70, 71, 72 are switch contacts, 8-1, 8-2,
... are diodes for blocking backflow, 9-1, 9-
2,... Are respectively power supply side wiring patterns, 10-1,
Each of 10-2,... Indicates a ground-side wiring pattern. Incidentally, there is also a structure in which the power supply side wiring patterns 9-1 and 9-2 are all connected to the positive terminal of the power supply 5 via one power supply conductor without providing the switch 7, and this structure has The backflow prevention diode can be omitted.

A data input line and a clock signal line are connected to the shift register 2, a load signal line is connected to the latch 3, and a strobe line is connected to the driver 4. These signal lines are omitted in FIG. I have. The control circuit IC6
Is divided into a plurality of ICs, and there is a conductor connecting the ground point of each IC to the negative terminal of the power supply 5, but this conductor is also omitted in FIG.

FIG. 5 is a view showing an example of a ground wire connection structure of a conventional thermal head array.
Denotes a control circuit IC, 11 denotes a base, 12 denotes a ceramic substrate, 13 denotes a bonding wire, 14 denotes a flexible substrate, 15 denotes a backing substrate, 16 denotes a connector, 17 denotes a holding member, and 18 denotes a screw. Straight line on ceramic substrate 12
Heating heads that are formed in
Antibody 1 is provided. And, as shown in FIG.
Power supply side wiring patterns 9-1, 9-2, ... and ground side arrangement
The line patterns 10-1, 10-2,...
It is provided to contact and cross the body 1. C
The control circuit IC6 mounted on the lamic substrate 12
Ground-side wiring pattern 10-
1, 10-2,... Connected to the heating resistor 1
And is located close to the opposite end. And figure
As shown in FIG. 5, these ground-side wiring patterns 10-
.. Are placed on the upper surface of the control circuit IC6.
Bonding to the corresponding wiring pattern connection terminal group
It is configured to be connected by a wiring 13. Ma
The ceramic substrate on the opposite side of the control circuit IC6
A control signal is transmitted to the control circuit IC6 on the surface of the plate 12.
Connection between the control circuit IC6 and the signal line pattern for
A ground line pattern serving as a ground wire is provided. And
The signal line pattern and the ground line pattern correspond to the control circuit IC.
External connection terminals provided respectively on the upper surfaces of
Are connected to each other by bonding wires.
You. The ceramic bases connected as described above
The plate 12 is connected to the flexible substrate 14 by the holding metal 17.
It is configured as a thermal head by being pressed. In addition, this
The conductor pattern of the flexible substrate 14
And the above-described signal line pattern formed on the ceramic substrate 12.
And the ground line pattern are electrically connected to each other.
It is pressed. With this configuration, the conventional
What is an external circuit, connector 16, flexible board 1
4. Signal line pattern (ground line pattern), bonding
Wire, control circuit IC6, bonding wire 13, connection
It had a structure to connect in the order of the ground side wiring pattern.

[0005]

The problem to be solved is that the conventional wire connection structure of the thermal head array has a large number of parts and a large number of manufacturing steps. The present invention has been made to solve such a problem, and a signal line of a control circuit IC6 connected to an external circuit is grounded.
Unlike the case of the side wiring pattern, it is irrelevant to the resolution, so that some space can be taken between the pads, so that the connection structure is simplified and the area occupied by the connection structure
It is an object of the present invention to reduce the size and to form a portion related to the connection structure and simplify the connection process.

[0006]

SUMMARY OF THE INVENTION The present invention provides a signal line and a ground line from outside a control circuit IC mounted on a ceramic substrate.
External connection terminal for connecting to
The control circuit IC and the external circuit are connected by superposing a PCB or a flexible substrate having a conductor pattern for a signal line and a ground line on the connection bumps by using the connection bumps. The most important feature is its structure.

[0007]

FIG. 1A is a sectional view showing an embodiment of the present invention, in which the same reference numerals as those in FIG. 5 denote the same or corresponding elements, and 19 denotes a signal line and a ground line of a control circuit IC6. PCB (printed circuit boa)
rd) and 20 indicate an adhesive. FIG. 1B is a view similar to FIG.
FIG. 6A is a plan view showing the control circuit IC6 as viewed from above, where the same reference numerals as those in FIGS. 4 and 5 denote the same or corresponding elements, and 21 denotes a solder bump.

The ground-side wiring patterns 10-1, 10-2,... Provided on the surface of the ceramic substrate 12 are connected to the control circuit IC 6 mounted on the ceramic substrate 12 by bonding wires 13. The connection structure is the same as that of the conventional one), and the conductor pattern of the PCB 19 is soldered to the solder bump 21 of the corresponding control circuit IC 6, and the PCB 19 is fixed to the base 11 by bonding with an adhesive 20.

With the above structure, signal lines for the control circuit IC 6 are provided on the surface of the ceramic substrate 12.
There is no need to provide a pattern or a ground line pattern , so that labor and time can be reduced and the area can be reduced. Further, with the simplification of the connection structure, the simplification of the connection process is achieved, and the number of components can be reduced.

FIG. 2 is a side view showing another embodiment of the present invention, and the same reference numerals as those in FIGS. 1 and 5 indicate the same or corresponding parts. In this embodiment, the flexible board 14 is used in place of the PCB 19, thereby giving a great degree of freedom in mounting the board.

FIG. 3 is a diagram showing the overall configuration of the present invention, and the same reference numerals as those in FIGS. 1 and 4 denote the same or corresponding components. Since the signal line of the control circuit IC6 is determined independently of the resolution, a certain space can be provided between the pads as compared with the pads connected to the ground-side wiring pattern, and the conductor connection structure of the present invention can be adopted.

[0012]

As described above, the lead wire connecting structure of the thermal head array according to the present invention has the advantages that the number of parts used can be reduced, the man-hour required for forming and connecting the parts can be reduced, and the manufacturing can be performed at low cost. is there.

[Brief description of the drawings]

FIG. 1 is a diagram showing an embodiment of the present invention.

FIG. 2 is a view showing another embodiment of the present invention.

FIG. 3 is a diagram showing the overall configuration of the present invention.

FIG. 4 is a diagram for explaining the operation of the thermal head array.

FIG. 5 is a view showing a conventional wire connection structure of a thermal head array.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Thermal head array 6 Control circuit IC 10-1 Wiring pattern 10-2 Wiring pattern 11 Base 12 Ceramic board 13 Bonding wire 14 Flexible board 15 Backing board 16 Connector 19 PCB 20 Adhesive 21 Solder bump

Claims (1)

(57) [Scope of request for utility model registration] 1. A dot-shaped heating record as a thermal head
The recording elements are arranged in rows, and
Wiring patterns (10-1, 10-2,...)
..) a thermal head substrate (12) having:thisSa
Thermal head substrate (12)ArrangementLine pattern (10-1,
10-2, ...)Of a predetermined number of continuous wiring patterns
(10-1, 10-2,...)
A predetermined number of wiring pattern connection terminal groups and external connection terminal groups
The thermal head substrate (12) provided on the top surface and
All of the wiring patterns (10-1, 10-2, ...)
The required number is arranged in order so that it can be wiredSystem
Control circuit IC (6) and control signal from external circuitThe above system
For your circuit IC (6)Wiring pattern for transmission
Flexible substrate (14) or printed wiring board
Plate (19), and the flexible substrate (14)
Or the wiring pattern of the printed wiring board (19) and the above
External connection terminal group of control circuit IC (6) and the control circuit
IC (6) wiring pattern connection terminal group and the thermal head
Wiring patterns (10-1 and 10-1) on the printed circuit board (12).
-2,...)
An external connection terminal provided on an upper surface of the control circuit IC (6)
Bump for connecting child groupgroupFormed asAnd the above
Flexible board (14) or printed wiring board (1
9) Connection of each of the plurality of control circuit ICs (6)
Use a size that can be connected simultaneously with the bump group for Of the plurality of control circuit ICs (6) Connection bumpgroupAnd above
Flexible board (14) or printed wiring board
Electrical connection with the wiring pattern of (19) superimposed
Connection of thermal head array wires
Connection structure.