JPS5753927A - Compound semiconductor device - Google Patents

Compound semiconductor device

Info

Publication number
JPS5753927A
JPS5753927A JP12854280A JP12854280A JPS5753927A JP S5753927 A JPS5753927 A JP S5753927A JP 12854280 A JP12854280 A JP 12854280A JP 12854280 A JP12854280 A JP 12854280A JP S5753927 A JPS5753927 A JP S5753927A
Authority
JP
Japan
Prior art keywords
layer
substrate
ratio
coincided
lattice constant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12854280A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6232608B2 (cs
Inventor
Yasuhiro Ishii
Noriyuki Shimano
Yoshimoto Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP12854280A priority Critical patent/JPS5753927A/ja
Publication of JPS5753927A publication Critical patent/JPS5753927A/ja
Publication of JPS6232608B2 publication Critical patent/JPS6232608B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02538—Group 13/15 materials
    • H01L21/02543—Phosphides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02381—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02439—Materials
    • H01L21/02441—Group 14 semiconducting materials
    • H01L21/0245—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02494—Structure
    • H01L21/02496—Layer structure
    • H01L21/0251—Graded layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/0257—Doping during depositing
    • H01L21/02573—Conductivity type
    • H01L21/02581—Transition metal or rare earth elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Recrystallisation Techniques (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
JP12854280A 1980-09-18 1980-09-18 Compound semiconductor device Granted JPS5753927A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12854280A JPS5753927A (en) 1980-09-18 1980-09-18 Compound semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12854280A JPS5753927A (en) 1980-09-18 1980-09-18 Compound semiconductor device

Publications (2)

Publication Number Publication Date
JPS5753927A true JPS5753927A (en) 1982-03-31
JPS6232608B2 JPS6232608B2 (cs) 1987-07-15

Family

ID=14987327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12854280A Granted JPS5753927A (en) 1980-09-18 1980-09-18 Compound semiconductor device

Country Status (1)

Country Link
JP (1) JPS5753927A (cs)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60111412A (ja) * 1983-10-28 1985-06-17 アメリカン　テレフオン　アンド　テレグラフ　カムパニー Ｇｅ／Ｓｉ半導体異種構造の成長法
JPS60231333A (ja) * 1984-04-27 1985-11-16 Sanyo Electric Co Ltd 半導体構造
JPS61500466A (ja) * 1983-11-21 1986-03-13 アメリカン テレフオン アンド テレグラフ カムパニ− 光検出器
JPS61107719A (ja) * 1984-10-31 1986-05-26 Matsushita Electric Ind Co Ltd ３−５化合物単結晶薄膜をそなえたＳｉ基板およびその製造方法
JPS61107721A (ja) * 1984-10-31 1986-05-26 Matsushita Electric Ind Co Ltd ３−５化合物単結晶薄膜をそなえたＳｉ基板およびその製造方法
JPS62249495A (ja) * 1986-04-23 1987-10-30 Hitachi Ltd 半導体レ−ザ装置
JPS63310111A (ja) * 1987-06-12 1988-12-19 Hitachi Cable Ltd 化合物半導体ウェハ及びその製造方法
US5011550A (en) * 1987-05-13 1991-04-30 Sharp Kabushiki Kaisha Laminated structure of compound semiconductors
JPH0567769A (ja) * 1991-09-05 1993-03-19 Sony Corp ３次元光電子集積回路装置
EP0514018A3 (en) * 1991-04-24 1994-06-29 At & T Corp Method for making low defect density semiconductor heterostructure and devices made thereby

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102576594B1 (ko) * 2021-02-03 2023-09-08 충북대학교 산학협력단 하향 가압형 고관절 탈구방지 예방의복
KR102576593B1 (ko) * 2021-02-03 2023-09-08 충북대학교 산학협력단 상향 가압형 고관절 탈구방지 예방의복

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60111412A (ja) * 1983-10-28 1985-06-17 アメリカン　テレフオン　アンド　テレグラフ　カムパニー Ｇｅ／Ｓｉ半導体異種構造の成長法
JPS61500466A (ja) * 1983-11-21 1986-03-13 アメリカン テレフオン アンド テレグラフ カムパニ− 光検出器
JPS60231333A (ja) * 1984-04-27 1985-11-16 Sanyo Electric Co Ltd 半導体構造
JPS61107719A (ja) * 1984-10-31 1986-05-26 Matsushita Electric Ind Co Ltd ３−５化合物単結晶薄膜をそなえたＳｉ基板およびその製造方法
JPS61107721A (ja) * 1984-10-31 1986-05-26 Matsushita Electric Ind Co Ltd ３−５化合物単結晶薄膜をそなえたＳｉ基板およびその製造方法
JPS62249495A (ja) * 1986-04-23 1987-10-30 Hitachi Ltd 半導体レ−ザ装置
US5011550A (en) * 1987-05-13 1991-04-30 Sharp Kabushiki Kaisha Laminated structure of compound semiconductors
JPS63310111A (ja) * 1987-06-12 1988-12-19 Hitachi Cable Ltd 化合物半導体ウェハ及びその製造方法
EP0514018A3 (en) * 1991-04-24 1994-06-29 At & T Corp Method for making low defect density semiconductor heterostructure and devices made thereby
JPH0567769A (ja) * 1991-09-05 1993-03-19 Sony Corp ３次元光電子集積回路装置

Also Published As

Publication number Publication date
JPS6232608B2 (cs) 1987-07-15

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