JPS5734336A - Exposure device - Google Patents

Exposure device

Info

Publication number
JPS5734336A
JPS5734336A JP10927580A JP10927580A JPS5734336A JP S5734336 A JPS5734336 A JP S5734336A JP 10927580 A JP10927580 A JP 10927580A JP 10927580 A JP10927580 A JP 10927580A JP S5734336 A JPS5734336 A JP S5734336A
Authority
JP
Japan
Prior art keywords
wafer
flatness
expose
print
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10927580A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0145217B2 (enrdf_load_stackoverflow
Inventor
Yukio Kenbo
Yasuo Nakagawa
Nobuyuki Akiyama
Susumu Aiuchi
Mineo Nomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10927580A priority Critical patent/JPS5734336A/ja
Priority to DE3110341A priority patent/DE3110341C2/de
Priority to US06/245,193 priority patent/US4391511A/en
Publication of JPS5734336A publication Critical patent/JPS5734336A/ja
Publication of JPH0145217B2 publication Critical patent/JPH0145217B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Projection-Type Copiers In General (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Holders For Sensitive Materials And Originals (AREA)
JP10927580A 1980-03-19 1980-08-11 Exposure device Granted JPS5734336A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP10927580A JPS5734336A (en) 1980-08-11 1980-08-11 Exposure device
DE3110341A DE3110341C2 (de) 1980-03-19 1981-03-17 Verfahren und Vorrichtung zum Ausrichten eines dünnen Substrats in der Bildebene eines Kopiergerätes
US06/245,193 US4391511A (en) 1980-03-19 1981-03-18 Light exposure device and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10927580A JPS5734336A (en) 1980-08-11 1980-08-11 Exposure device

Publications (2)

Publication Number Publication Date
JPS5734336A true JPS5734336A (en) 1982-02-24
JPH0145217B2 JPH0145217B2 (enrdf_load_stackoverflow) 1989-10-03

Family

ID=14506032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10927580A Granted JPS5734336A (en) 1980-03-19 1980-08-11 Exposure device

Country Status (1)

Country Link
JP (1) JPS5734336A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5950537A (ja) * 1982-09-17 1984-03-23 Hitachi Ltd ウエハチヤツク
JPS62122215A (ja) * 1985-11-22 1987-06-03 Hitachi Ltd 投影露光装置
JP2007258303A (ja) * 2006-03-22 2007-10-04 Tokyo Electron Ltd 基板熱処理装置
WO2009125867A1 (ja) * 2008-04-11 2009-10-15 株式会社ニコン ステージ装置、露光装置、及びデバイス製造方法
JP2012015508A (ja) * 2010-06-30 2012-01-19 Asml Holding Nv レチクルクランプシステム

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230039138A (ko) * 2021-09-13 2023-03-21 삼성전자주식회사 기판 처리 장치 및 이를 이용한 반도체 칩의 제조 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4888871A (enrdf_load_stackoverflow) * 1972-02-02 1973-11-21
JPS51137264U (enrdf_load_stackoverflow) * 1975-04-28 1976-11-05
JPS5314425A (en) * 1976-07-27 1978-02-09 Sharp Corp Liquid fuel combustion device
JPS5318967A (en) * 1976-08-05 1978-02-21 Nec Corp Wafer sucking jig
JPS54146580A (en) * 1978-05-09 1979-11-15 Nippon Telegr & Teleph Corp <Ntt> Thin plate flattening correction mechanism

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4888871A (enrdf_load_stackoverflow) * 1972-02-02 1973-11-21
JPS51137264U (enrdf_load_stackoverflow) * 1975-04-28 1976-11-05
JPS5314425A (en) * 1976-07-27 1978-02-09 Sharp Corp Liquid fuel combustion device
JPS5318967A (en) * 1976-08-05 1978-02-21 Nec Corp Wafer sucking jig
JPS54146580A (en) * 1978-05-09 1979-11-15 Nippon Telegr & Teleph Corp <Ntt> Thin plate flattening correction mechanism

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5950537A (ja) * 1982-09-17 1984-03-23 Hitachi Ltd ウエハチヤツク
JPS62122215A (ja) * 1985-11-22 1987-06-03 Hitachi Ltd 投影露光装置
JP2007258303A (ja) * 2006-03-22 2007-10-04 Tokyo Electron Ltd 基板熱処理装置
WO2009125867A1 (ja) * 2008-04-11 2009-10-15 株式会社ニコン ステージ装置、露光装置、及びデバイス製造方法
US8358401B2 (en) 2008-04-11 2013-01-22 Nikon Corporation Stage apparatus, exposure apparatus and device manufacturing method
JP2012015508A (ja) * 2010-06-30 2012-01-19 Asml Holding Nv レチクルクランプシステム
US9274439B2 (en) 2010-06-30 2016-03-01 Asml Holding N.V. Reticle clamping system

Also Published As

Publication number Publication date
JPH0145217B2 (enrdf_load_stackoverflow) 1989-10-03

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