JPH0145217B2 - - Google Patents

Info

Publication number
JPH0145217B2
JPH0145217B2 JP55109275A JP10927580A JPH0145217B2 JP H0145217 B2 JPH0145217 B2 JP H0145217B2 JP 55109275 A JP55109275 A JP 55109275A JP 10927580 A JP10927580 A JP 10927580A JP H0145217 B2 JPH0145217 B2 JP H0145217B2
Authority
JP
Japan
Prior art keywords
wafer
chuck plate
chuck
deforming
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55109275A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5734336A (en
Inventor
Yukio Kenbo
Yasuo Nakagawa
Nobuyuki Akyama
Susumu Aiuchi
Mineo Nomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10927580A priority Critical patent/JPS5734336A/ja
Priority to DE3110341A priority patent/DE3110341C2/de
Priority to US06/245,193 priority patent/US4391511A/en
Publication of JPS5734336A publication Critical patent/JPS5734336A/ja
Publication of JPH0145217B2 publication Critical patent/JPH0145217B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Holders For Sensitive Materials And Originals (AREA)
  • Projection-Type Copiers In General (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP10927580A 1980-03-19 1980-08-11 Exposure device Granted JPS5734336A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP10927580A JPS5734336A (en) 1980-08-11 1980-08-11 Exposure device
DE3110341A DE3110341C2 (de) 1980-03-19 1981-03-17 Verfahren und Vorrichtung zum Ausrichten eines dünnen Substrats in der Bildebene eines Kopiergerätes
US06/245,193 US4391511A (en) 1980-03-19 1981-03-18 Light exposure device and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10927580A JPS5734336A (en) 1980-08-11 1980-08-11 Exposure device

Publications (2)

Publication Number Publication Date
JPS5734336A JPS5734336A (en) 1982-02-24
JPH0145217B2 true JPH0145217B2 (enrdf_load_stackoverflow) 1989-10-03

Family

ID=14506032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10927580A Granted JPS5734336A (en) 1980-03-19 1980-08-11 Exposure device

Country Status (1)

Country Link
JP (1) JPS5734336A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230082384A1 (en) * 2021-09-13 2023-03-16 Samsung Electronics Co., Ltd. Substrate processing apparatus and method of manufacturing semiconductor chip using the same

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5950537A (ja) * 1982-09-17 1984-03-23 Hitachi Ltd ウエハチヤツク
JPH07105323B2 (ja) * 1985-11-22 1995-11-13 株式会社日立製作所 露光方法
JP2007258303A (ja) * 2006-03-22 2007-10-04 Tokyo Electron Ltd 基板熱処理装置
TW200947149A (en) * 2008-04-11 2009-11-16 Nikon Corp Stage device, exposure device and device production method
NL2006565A (en) 2010-06-30 2012-01-02 Asml Holding Nv Reticle clamping system.

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3729966A (en) * 1972-02-02 1973-05-01 Ibm Apparatus for contouring the surface of thin elements
JPS51137264U (enrdf_load_stackoverflow) * 1975-04-28 1976-11-05
JPS6014972B2 (ja) * 1976-07-27 1985-04-17 シャープ株式会社 液体燃料燃焼装置
JPS5318967A (en) * 1976-08-05 1978-02-21 Nec Corp Wafer sucking jig
JPS54146580A (en) * 1978-05-09 1979-11-15 Nippon Telegr & Teleph Corp <Ntt> Thin plate flattening correction mechanism

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230082384A1 (en) * 2021-09-13 2023-03-16 Samsung Electronics Co., Ltd. Substrate processing apparatus and method of manufacturing semiconductor chip using the same

Also Published As

Publication number Publication date
JPS5734336A (en) 1982-02-24

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