JPS57205736A - Solid state device produced by plasm development of resist - Google Patents
Solid state device produced by plasm development of resistInfo
- Publication number
- JPS57205736A JPS57205736A JP57066401A JP6640182A JPS57205736A JP S57205736 A JPS57205736 A JP S57205736A JP 57066401 A JP57066401 A JP 57066401A JP 6640182 A JP6640182 A JP 6640182A JP S57205736 A JPS57205736 A JP S57205736A
- Authority
- JP
- Japan
- Prior art keywords
- plasm
- resist
- development
- solid state
- state device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/36—Imagewise removal not covered by groups G03F7/30 - G03F7/34, e.g. using gas streams, using plasma
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic System
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0803—Compounds with Si-C or Si-Si linkages
- C07F7/081—Compounds with Si-C or Si-Si linkages comprising at least one atom selected from the elements N, O, halogen, S, Se or Te
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic System
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/167—X-ray
- Y10S430/168—X-ray exposure process
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/256,604 US4396704A (en) | 1981-04-22 | 1981-04-22 | Solid state devices produced by organometallic plasma developed resists |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57205736A true JPS57205736A (en) | 1982-12-16 |
Family
ID=22972869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57066401A Pending JPS57205736A (en) | 1981-04-22 | 1982-04-22 | Solid state device produced by plasm development of resist |
Country Status (6)
Country | Link |
---|---|
US (1) | US4396704A (ja) |
JP (1) | JPS57205736A (ja) |
CA (1) | CA1175279A (ja) |
DE (1) | DE3215082A1 (ja) |
GB (1) | GB2097143B (ja) |
IT (1) | IT1150865B (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57211143A (en) * | 1981-06-23 | 1982-12-24 | Oki Electric Ind Co Ltd | Formation of micropattern |
JPS5891632A (ja) * | 1981-11-27 | 1983-05-31 | Oki Electric Ind Co Ltd | 微細パタ−ン形成方法 |
JPS60229026A (ja) * | 1984-03-02 | 1985-11-14 | アメリカン テレフオン アンド テレグラフ カムパニ− | 電子デバイスの製造方法 |
JPS60241225A (ja) * | 1984-05-14 | 1985-11-30 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 陰画レジスト像を生成する方法 |
JPS61107346A (ja) * | 1984-10-26 | 1986-05-26 | ユセベ エレクトロニックス,ソシエテ アノニム | フォトレジスト層中にネガ図形を形成する方法 |
JPS61219034A (ja) * | 1985-03-19 | 1986-09-29 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 耐プラズマ性重合体物質の製法 |
JP2020002121A (ja) * | 2018-05-07 | 2020-01-09 | 達興材料股▲ふん▼有限公司 | シリコン含有化合物、これを用いる液晶組成物および液晶ディスプレイ |
US11921427B2 (en) | 2018-11-14 | 2024-03-05 | Lam Research Corporation | Methods for making hard masks useful in next-generation lithography |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4500628A (en) * | 1981-04-22 | 1985-02-19 | At&T Bell Laboratories | Process of making solid state devices using silicon containing organometallic plasma developed resists |
JPS57202534A (en) * | 1981-06-09 | 1982-12-11 | Fujitsu Ltd | Negative type resist composition |
EP0090615B1 (en) * | 1982-03-26 | 1989-01-11 | Hitachi, Ltd. | Method for forming fine resist patterns |
DE3231457A1 (de) * | 1982-08-24 | 1984-03-01 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum erzeugen von strukturen fuer integrierte halbleiterschaltungen durch reaktives ionenaetzen |
US4517276A (en) * | 1982-11-29 | 1985-05-14 | Varian Associates, Inc. | Metal-containing organic photoresists |
US5215867A (en) * | 1983-09-16 | 1993-06-01 | At&T Bell Laboratories | Method with gas functionalized plasma developed layer |
US4596761A (en) * | 1983-11-02 | 1986-06-24 | Hughes Aircraft Company | Graft polymerized SiO2 lithographic masks |
US4507331A (en) * | 1983-12-12 | 1985-03-26 | International Business Machines Corporation | Dry process for forming positive tone micro patterns |
JPS60224136A (ja) * | 1984-04-23 | 1985-11-08 | Matsushita Electric Ind Co Ltd | 光学記録材料および記録方法 |
US4908298A (en) * | 1985-03-19 | 1990-03-13 | International Business Machines Corporation | Method of creating patterned multilayer films for use in production of semiconductor circuits and systems |
CA1282273C (en) * | 1985-03-19 | 1991-04-02 | International Business Machines Corporation | Method of creating patterned multilayer films for use in production of semiconductor circuits and systems |
US4613398A (en) * | 1985-06-06 | 1986-09-23 | International Business Machines Corporation | Formation of etch-resistant resists through preferential permeation |
US4702792A (en) * | 1985-10-28 | 1987-10-27 | International Business Machines Corporation | Method of forming fine conductive lines, patterns and connectors |
US4657845A (en) * | 1986-01-14 | 1987-04-14 | International Business Machines Corporation | Positive tone oxygen plasma developable photoresist |
US4737425A (en) * | 1986-06-10 | 1988-04-12 | International Business Machines Corporation | Patterned resist and process |
US4761298A (en) * | 1987-05-06 | 1988-08-02 | The United States Of America As Represented By The Secretary Of The Army | Method of precisely adjusting the frequency of a piezoelectric resonator |
US4921778A (en) * | 1988-07-29 | 1990-05-01 | Shipley Company Inc. | Photoresist pattern fabrication employing chemically amplified metalized material |
US5108875A (en) * | 1988-07-29 | 1992-04-28 | Shipley Company Inc. | Photoresist pattern fabrication employing chemically amplified metalized material |
US5079131A (en) * | 1988-08-29 | 1992-01-07 | Shipley Company Inc. | Method of forming positive images through organometallic treatment of negative acid hardening cross-linked photoresist formulations |
US5094936A (en) * | 1988-09-16 | 1992-03-10 | Texas Instruments Incorporated | High pressure photoresist silylation process and apparatus |
US5213917A (en) * | 1989-05-18 | 1993-05-25 | Shipley Company Inc. | Plasma processing with metal mask integration |
US5053318A (en) * | 1989-05-18 | 1991-10-01 | Shipley Company Inc. | Plasma processing with metal mask integration |
US5275913A (en) * | 1990-05-08 | 1994-01-04 | Industrial Technology Research Institute | Method for preparing resist patterns utilizing solvent development with subsequent resist pattern transfer, via a photo-hardening liquid adhesive, to a receiver substrate and oxygen reactive ion etching |
US5304453A (en) * | 1991-07-11 | 1994-04-19 | Industrial Technology Research Institute | Method for preparing resist patterns through image layer transfer to a receiver substrate, via a photo-hardening organic liquid adhesive, with subsequent oxygen reactive ion etching |
US5262392A (en) * | 1991-07-15 | 1993-11-16 | Eastman Kodak Company | Method for patterning metallo-organic percursor film and method for producing a patterned ceramic film and film products |
US5366852A (en) * | 1992-09-21 | 1994-11-22 | Shipley Company, Inc. | Methods for treating photoresists |
EP0624827A1 (de) * | 1993-05-12 | 1994-11-17 | Ciba-Geigy Ag | Verfahren zur Herstellung von Mikrostrukturen |
JP2001234356A (ja) * | 2000-02-24 | 2001-08-31 | Seiko Epson Corp | 膜の製造方法及びこれにより得られる膜 |
JP3697426B2 (ja) * | 2002-04-24 | 2005-09-21 | 株式会社東芝 | パターン形成方法および半導体装置の製造方法 |
US6737283B2 (en) | 2002-08-29 | 2004-05-18 | Micron Technology, Inc. | Method to isolate device layer edges through mechanical spacing |
US7704670B2 (en) | 2006-06-22 | 2010-04-27 | Az Electronic Materials Usa Corp. | High silicon-content thin film thermosets |
US8524441B2 (en) | 2007-02-27 | 2013-09-03 | Az Electronic Materials Usa Corp. | Silicon-based antireflective coating compositions |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3809686A (en) * | 1970-03-19 | 1974-05-07 | Bell Telephone Labor Inc | Transparent media capable of photoinduced refractive index changes and their application to light guides and the like |
JPS5146001B2 (ja) * | 1971-09-20 | 1976-12-07 | ||
US3899338A (en) * | 1972-02-09 | 1975-08-12 | Horizons Inc | Photosensitive material suitable for use as a photoresist |
US4061829A (en) * | 1976-04-26 | 1977-12-06 | Bell Telephone Laboratories, Incorporated | Negative resist for X-ray and electron beam lithography and method of using same |
FR2375623A1 (fr) * | 1976-06-23 | 1978-07-21 | Commissariat Energie Atomique | Nouveaux films photosensibles utilisables en microgravure |
US4332879A (en) * | 1978-12-01 | 1982-06-01 | Hughes Aircraft Company | Process for depositing a film of controlled composition using a metallo-organic photoresist |
US4232110A (en) * | 1979-03-12 | 1980-11-04 | Bell Telephone Laboratories, Incorporated | Solid state devices formed by differential plasma etching of resists |
US4278753A (en) * | 1980-02-25 | 1981-07-14 | Horizons Research Incorporated | Plasma developable photoresist composition with polyvinyl formal binder |
US4307178A (en) * | 1980-04-30 | 1981-12-22 | International Business Machines Corporation | Plasma develoment of resists |
DE3169660D1 (en) * | 1980-06-25 | 1985-05-09 | Hitachi Ltd | Process for forming metallic images |
US4329418A (en) * | 1980-11-14 | 1982-05-11 | Lord Corporation | Organometallic semiconductor devices |
-
1981
- 1981-04-22 US US06/256,604 patent/US4396704A/en not_active Expired - Fee Related
-
1982
- 1982-04-06 CA CA000400517A patent/CA1175279A/en not_active Expired
- 1982-04-20 GB GB8211400A patent/GB2097143B/en not_active Expired
- 1982-04-21 IT IT20867/82A patent/IT1150865B/it active
- 1982-04-22 JP JP57066401A patent/JPS57205736A/ja active Pending
- 1982-04-22 DE DE19823215082 patent/DE3215082A1/de not_active Withdrawn
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57211143A (en) * | 1981-06-23 | 1982-12-24 | Oki Electric Ind Co Ltd | Formation of micropattern |
JPH0243172B2 (ja) * | 1981-06-23 | 1990-09-27 | ||
JPS5891632A (ja) * | 1981-11-27 | 1983-05-31 | Oki Electric Ind Co Ltd | 微細パタ−ン形成方法 |
JPS60229026A (ja) * | 1984-03-02 | 1985-11-14 | アメリカン テレフオン アンド テレグラフ カムパニ− | 電子デバイスの製造方法 |
JPS60241225A (ja) * | 1984-05-14 | 1985-11-30 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 陰画レジスト像を生成する方法 |
JPH0456978B2 (ja) * | 1984-05-14 | 1992-09-10 | Intaanashonaru Bijinesu Mashiinzu Corp | |
JPS61107346A (ja) * | 1984-10-26 | 1986-05-26 | ユセベ エレクトロニックス,ソシエテ アノニム | フォトレジスト層中にネガ図形を形成する方法 |
JPH0220869A (ja) * | 1984-10-26 | 1990-01-24 | Ucb Sa | 乾式現像用レジスト |
JPH0456979B2 (ja) * | 1984-10-26 | 1992-09-10 | Yu Se Be Erekutoronitsukusu Sa | |
JPS61219034A (ja) * | 1985-03-19 | 1986-09-29 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 耐プラズマ性重合体物質の製法 |
JP2020002121A (ja) * | 2018-05-07 | 2020-01-09 | 達興材料股▲ふん▼有限公司 | シリコン含有化合物、これを用いる液晶組成物および液晶ディスプレイ |
US11921427B2 (en) | 2018-11-14 | 2024-03-05 | Lam Research Corporation | Methods for making hard masks useful in next-generation lithography |
Also Published As
Publication number | Publication date |
---|---|
US4396704A (en) | 1983-08-02 |
IT1150865B (it) | 1986-12-17 |
DE3215082A1 (de) | 1982-11-25 |
CA1175279A (en) | 1984-10-02 |
IT8220867A0 (it) | 1982-04-21 |
GB2097143A (en) | 1982-10-27 |
GB2097143B (en) | 1985-07-31 |
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