JPS57193037A - Forming and treating method for pattern by lifting-off method - Google Patents

Forming and treating method for pattern by lifting-off method

Info

Publication number
JPS57193037A
JPS57193037A JP7769481A JP7769481A JPS57193037A JP S57193037 A JPS57193037 A JP S57193037A JP 7769481 A JP7769481 A JP 7769481A JP 7769481 A JP7769481 A JP 7769481A JP S57193037 A JPS57193037 A JP S57193037A
Authority
JP
Japan
Prior art keywords
resist
substrate
film
lifting
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7769481A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0159736B2 (enrdf_load_stackoverflow
Inventor
Yoshiaki Mimura
Mineo Ueki
Fumihiko Yanagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP7769481A priority Critical patent/JPS57193037A/ja
Publication of JPS57193037A publication Critical patent/JPS57193037A/ja
Publication of JPH0159736B2 publication Critical patent/JPH0159736B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
JP7769481A 1981-05-22 1981-05-22 Forming and treating method for pattern by lifting-off method Granted JPS57193037A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7769481A JPS57193037A (en) 1981-05-22 1981-05-22 Forming and treating method for pattern by lifting-off method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7769481A JPS57193037A (en) 1981-05-22 1981-05-22 Forming and treating method for pattern by lifting-off method

Publications (2)

Publication Number Publication Date
JPS57193037A true JPS57193037A (en) 1982-11-27
JPH0159736B2 JPH0159736B2 (enrdf_load_stackoverflow) 1989-12-19

Family

ID=13640994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7769481A Granted JPS57193037A (en) 1981-05-22 1981-05-22 Forming and treating method for pattern by lifting-off method

Country Status (1)

Country Link
JP (1) JPS57193037A (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5346281A (en) * 1976-10-08 1978-04-25 Matsushita Electric Ind Co Ltd Mask for semiconductor device and production of semiconductor device using the same
JPS5394184A (en) * 1977-01-28 1978-08-17 Fujitsu Ltd Pattern forming method by lift-off

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5346281A (en) * 1976-10-08 1978-04-25 Matsushita Electric Ind Co Ltd Mask for semiconductor device and production of semiconductor device using the same
JPS5394184A (en) * 1977-01-28 1978-08-17 Fujitsu Ltd Pattern forming method by lift-off

Also Published As

Publication number Publication date
JPH0159736B2 (enrdf_load_stackoverflow) 1989-12-19

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