JPS5527639A - Photo-resist pattern forming method - Google Patents

Photo-resist pattern forming method

Info

Publication number
JPS5527639A
JPS5527639A JP10066678A JP10066678A JPS5527639A JP S5527639 A JPS5527639 A JP S5527639A JP 10066678 A JP10066678 A JP 10066678A JP 10066678 A JP10066678 A JP 10066678A JP S5527639 A JPS5527639 A JP S5527639A
Authority
JP
Japan
Prior art keywords
photo
resist
resist pattern
developing
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10066678A
Other languages
Japanese (ja)
Inventor
Shoichi Tsutsumi
Tomio Kume
Yoshio Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10066678A priority Critical patent/JPS5527639A/en
Publication of JPS5527639A publication Critical patent/JPS5527639A/en
Pending legal-status Critical Current

Links

Landscapes

  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To form a high-precision photo-resist pattern, by providing an opening larger than the initial photo-resist opening, coating a high-viscosity photo-resist, and thereby operating exposure and developing.
CONSTITUTION: The entire upper surface of insulator 1 is covered with permalloy magnetic thin film layer 2. On top of this are formed nine aluminum multi-layer coil conductor patterns via silicon insulating film 6. Low-viscosity photo-resist 7 of 30W 450pC.P is coated by means of a spinner. By using a photo-mask, exposure and developing are performed, and thereby, a photo-resist pattern is formed on contact part 5. Photo-resist 8, whose viscosity is equal to or higher than that of the photo- resist used in the preceding process, is coated by means of a spinner. By using a photo-mask of the same size as that used in the preceding process or larger, exposure and developing are performed, and thereby, a photo-resist pattern is formed on contact part 5.
COPYRIGHT: (C)1980,JPO&Japio
JP10066678A 1978-08-18 1978-08-18 Photo-resist pattern forming method Pending JPS5527639A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10066678A JPS5527639A (en) 1978-08-18 1978-08-18 Photo-resist pattern forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10066678A JPS5527639A (en) 1978-08-18 1978-08-18 Photo-resist pattern forming method

Publications (1)

Publication Number Publication Date
JPS5527639A true JPS5527639A (en) 1980-02-27

Family

ID=14280099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10066678A Pending JPS5527639A (en) 1978-08-18 1978-08-18 Photo-resist pattern forming method

Country Status (1)

Country Link
JP (1) JPS5527639A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59129880U (en) * 1983-02-19 1984-08-31 神鋼電機株式会社 Air pocket prevention device for plated parts
US4971896A (en) * 1987-12-08 1990-11-20 Hitachi, Ltd. Method for forming thin film pattern and method for fabricating thin film magnetic head using the same
JPH03249196A (en) * 1990-02-27 1991-11-07 Sumitomo Wiring Syst Ltd Plating treatment of connecting terminal and its device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59129880U (en) * 1983-02-19 1984-08-31 神鋼電機株式会社 Air pocket prevention device for plated parts
US4971896A (en) * 1987-12-08 1990-11-20 Hitachi, Ltd. Method for forming thin film pattern and method for fabricating thin film magnetic head using the same
JPH03249196A (en) * 1990-02-27 1991-11-07 Sumitomo Wiring Syst Ltd Plating treatment of connecting terminal and its device

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