JPS6473742A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS6473742A JPS6473742A JP22985887A JP22985887A JPS6473742A JP S6473742 A JPS6473742 A JP S6473742A JP 22985887 A JP22985887 A JP 22985887A JP 22985887 A JP22985887 A JP 22985887A JP S6473742 A JPS6473742 A JP S6473742A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- edge parts
- plasma etching
- taper
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To form a taper on the upper end edge parts of a wiring metal with good stability and with good reproducibility by a method wherein, after the side end parts of a photoresist are removed by oxygen plasma etching, the taper is formed on the upper end edge parts of the wiring metal by performing an additional etching with plasma. CONSTITUTION:An insulating film 2 is formed on a semiconductor substrate 1, a layer for a wiring metal 3 is formed on the film 2 and a photoresist 5 of a wiring pattern is formed thereon. Then, when the film of a metal 3 is subjected to plasma etching, the metal 3 provided with rectangularly formed upper end edge parts 3a is formed. Then, after the side end parts of the resist 5 remaining on the metal 3 are removed by oxygen plasma etching, the edge parts 3a of the metal 3 are further subjected to plasma etching using this resist 5 as a mask. Whereupon, a taper is formed on the edge parts 3a. Thereby, a protective film or the interlayer insulating film of a multilayer interconnection is prevented from overhanging in the latter process.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22985887A JPS6473742A (en) | 1987-09-16 | 1987-09-16 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22985887A JPS6473742A (en) | 1987-09-16 | 1987-09-16 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6473742A true JPS6473742A (en) | 1989-03-20 |
Family
ID=16898795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22985887A Pending JPS6473742A (en) | 1987-09-16 | 1987-09-16 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6473742A (en) |
-
1987
- 1987-09-16 JP JP22985887A patent/JPS6473742A/en active Pending
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