JPS5493970A - Patttern forming method of multi-layer metallic thin film - Google Patents
Patttern forming method of multi-layer metallic thin filmInfo
- Publication number
- JPS5493970A JPS5493970A JP38578A JP38578A JPS5493970A JP S5493970 A JPS5493970 A JP S5493970A JP 38578 A JP38578 A JP 38578A JP 38578 A JP38578 A JP 38578A JP S5493970 A JPS5493970 A JP S5493970A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- thin film
- metallic
- metal
- patttern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To obtain a small-sputter damage and small-dimension conversion error multi-layer metallic thin film by subjecting a metallic layer for a mask and the second layer to plasma etching simultaneously after etching the top layer physically.
CONSTITUTION: Top layer 4 consisting of metal which has a high physical etching speed, the second layer 3 consisting of one of Mo, W, Ta, V and Nb which has a physical etching speed lower than the metal of top layer 4, and metallic layer 5 consisting of one selected from the metal group of the second layer 3 are formed on semiconductor substrate 1 selectively. Next, metallic layer 5 is used as a mask to remove the metal of top layer 4 by physical etching. Next, metallic layer 5 and exposed second layer 3 are removed by plasma etching simultaneously. However, Ti layer 2 may be formed to give three-layer structure as required.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP38578A JPS5493970A (en) | 1978-01-07 | 1978-01-07 | Patttern forming method of multi-layer metallic thin film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP38578A JPS5493970A (en) | 1978-01-07 | 1978-01-07 | Patttern forming method of multi-layer metallic thin film |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5493970A true JPS5493970A (en) | 1979-07-25 |
Family
ID=11472323
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP38578A Pending JPS5493970A (en) | 1978-01-07 | 1978-01-07 | Patttern forming method of multi-layer metallic thin film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5493970A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63170922A (en) * | 1987-01-09 | 1988-07-14 | Sony Corp | Wiring method |
JPH0350828A (en) * | 1989-07-19 | 1991-03-05 | Nec Corp | Method of forming gold wiring |
JPH0354864A (en) * | 1989-07-24 | 1991-03-08 | Nec Corp | Formation of schottky electrode |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5018456A (en) * | 1973-04-26 | 1975-02-26 | ||
JPS5279664A (en) * | 1975-12-25 | 1977-07-04 | Mitsubishi Electric Corp | Forming method for electrodes of semiconductor devices |
-
1978
- 1978-01-07 JP JP38578A patent/JPS5493970A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5018456A (en) * | 1973-04-26 | 1975-02-26 | ||
JPS5279664A (en) * | 1975-12-25 | 1977-07-04 | Mitsubishi Electric Corp | Forming method for electrodes of semiconductor devices |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63170922A (en) * | 1987-01-09 | 1988-07-14 | Sony Corp | Wiring method |
JPH0350828A (en) * | 1989-07-19 | 1991-03-05 | Nec Corp | Method of forming gold wiring |
JPH0354864A (en) * | 1989-07-24 | 1991-03-08 | Nec Corp | Formation of schottky electrode |
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