JPS642390A - Formation of metallic thin-film pattern - Google Patents
Formation of metallic thin-film patternInfo
- Publication number
- JPS642390A JPS642390A JP15693587A JP15693587A JPS642390A JP S642390 A JPS642390 A JP S642390A JP 15693587 A JP15693587 A JP 15693587A JP 15693587 A JP15693587 A JP 15693587A JP S642390 A JPS642390 A JP S642390A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- film
- substrate
- shaped
- etched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
PURPOSE:To simplify selective etching by etching laminated films through a dipping method first and further spin-etching a second metallic film as an upper layer when a first metallic film such as Mo and the second metallic film such as Al are laminated and formed onto a substrate and these metallic films are shaped to a specified pattern. CONSTITUTION:A band-shaped pattern 2 consisting of Mo, etc., is formed onto a substrate 1 through a normal method, and a film 4 composed of Al, etc., is evaporated onto the whole surface of the substrate 1 including the pattern 2 in order to repair a defect 3 shaped to the pattern 2. A band-shaped resist 5 having the same shape as the pattern 2 is formed onto the film 4, and etched through a dipping method by using an etchant containing nitric acid, sulfuric acid, phosphoric acid, hydrofluoric acid and hydrochloric acid. An etchant having the same composition is dropped while the substrate 1 is turned at high speed, and only the film 4 is spin-etched and the defect 3 is repaired. Even when there is a defect 6 in the resist 5 at that time, the Mo pattern of an exposed lower layer is not etched.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-156935A JPH012390A (en) | 1987-06-24 | Method for forming metal thin film patterns |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-156935A JPH012390A (en) | 1987-06-24 | Method for forming metal thin film patterns |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS642390A true JPS642390A (en) | 1989-01-06 |
| JPH012390A JPH012390A (en) | 1989-01-06 |
Family
ID=
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111031683A (en) * | 2019-12-23 | 2020-04-17 | 沪士电子股份有限公司 | Design and use method of pattern electroplating accompanying plate in PCB production process |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111031683A (en) * | 2019-12-23 | 2020-04-17 | 沪士电子股份有限公司 | Design and use method of pattern electroplating accompanying plate in PCB production process |
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