JPS57188853A - Plastic molded type semiconductor device - Google Patents

Plastic molded type semiconductor device

Info

Publication number
JPS57188853A
JPS57188853A JP56075291A JP7529181A JPS57188853A JP S57188853 A JPS57188853 A JP S57188853A JP 56075291 A JP56075291 A JP 56075291A JP 7529181 A JP7529181 A JP 7529181A JP S57188853 A JPS57188853 A JP S57188853A
Authority
JP
Japan
Prior art keywords
semiconductor element
film
semiconductor device
semiconductor
type semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56075291A
Other languages
English (en)
Japanese (ja)
Other versions
JPS628035B2 (enExample
Inventor
Koji Fujisaki
Shunichi Numata
Akio Nishikawa
Hiroshi Suzuki
Takeshi Komaru
Daisuke Makino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP56075291A priority Critical patent/JPS57188853A/ja
Priority to DE3126361A priority patent/DE3126361C2/de
Priority to GB8120607A priority patent/GB2098800B/en
Publication of JPS57188853A publication Critical patent/JPS57188853A/ja
Publication of JPS628035B2 publication Critical patent/JPS628035B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/121—
    • H10W42/25—
    • H10W74/137—
    • H10W74/47—
    • H10W72/01515—
    • H10W72/075—
    • H10W72/5522—
    • H10W72/5524—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Paints Or Removers (AREA)
JP56075291A 1981-05-18 1981-05-18 Plastic molded type semiconductor device Granted JPS57188853A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP56075291A JPS57188853A (en) 1981-05-18 1981-05-18 Plastic molded type semiconductor device
DE3126361A DE3126361C2 (de) 1981-05-18 1981-07-03 Schutzschicht für Halbleiterelemente
GB8120607A GB2098800B (en) 1981-05-18 1981-07-03 Resin encapsulated semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56075291A JPS57188853A (en) 1981-05-18 1981-05-18 Plastic molded type semiconductor device

Publications (2)

Publication Number Publication Date
JPS57188853A true JPS57188853A (en) 1982-11-19
JPS628035B2 JPS628035B2 (enExample) 1987-02-20

Family

ID=13571981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56075291A Granted JPS57188853A (en) 1981-05-18 1981-05-18 Plastic molded type semiconductor device

Country Status (3)

Country Link
JP (1) JPS57188853A (enExample)
DE (1) DE3126361C2 (enExample)
GB (1) GB2098800B (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60208358A (ja) * 1984-04-02 1985-10-19 Hitachi Ltd 複合体
JPS60221426A (ja) * 1984-04-17 1985-11-06 Hitachi Chem Co Ltd ポリイミド複合体の製造法
JPS60243120A (ja) * 1984-05-18 1985-12-03 Hitachi Ltd フレキシブルプリント基板の製造方法
JPS60245150A (ja) * 1984-05-21 1985-12-04 Hitachi Ltd 半導体装置
JPH01181430A (ja) * 1988-01-08 1989-07-19 Nissan Chem Ind Ltd 電気・電子デバイス用絶縁膜
US5272247A (en) * 1990-10-19 1993-12-21 Hitachi, Ltd. Polyimide precursor, cured product thereof, and processes for producing them
US5536584A (en) * 1992-01-31 1996-07-16 Hitachi, Ltd. Polyimide precursor, polyimide and metalization structure using said polyimide
JP2012164937A (ja) * 2011-02-09 2012-08-30 Fujitsu Ltd 半導体装置及びその製造方法、電源装置
CN105254886A (zh) * 2015-11-02 2016-01-20 株洲时代新材料科技股份有限公司 聚酰胺酸树脂组合物、热塑性聚酰亚胺薄膜及其制备方法
JP2018080315A (ja) * 2016-11-18 2018-05-24 宇部興産株式会社 ポリイミド、ポリイミド前駆体、及びポリイミドフィルム

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6012744A (ja) * 1983-07-01 1985-01-23 Hitachi Ltd 半導体装置
JPS60238817A (ja) * 1984-05-12 1985-11-27 Citizen Watch Co Ltd 液晶表示装置
JPH01110559A (ja) * 1987-10-23 1989-04-27 Hitachi Chem Co Ltd 半導体素子保護膜用組成物
US5276414A (en) * 1991-12-10 1994-01-04 Mitsubishi Denki Kabushiki Kaisha Moistureproof structure for module circuits
JPH05198786A (ja) * 1992-01-22 1993-08-06 Sharp Corp クリアモールドｃｃｄ固体撮像素子
DE19741437A1 (de) * 1997-09-19 1999-04-01 Siemens Ag Elektronisches Bauteil mit verbesserter Gehäusepreßmasse
DE60139463D1 (de) * 2000-04-18 2009-09-17 E Ink Corp Prozess zur herstellung von dünnfilmtransistoren
US7893435B2 (en) 2000-04-18 2011-02-22 E Ink Corporation Flexible electronic circuits and displays including a backplane comprising a patterned metal foil having a plurality of apertures extending therethrough
CN116478400B (zh) * 2023-02-06 2024-10-18 中山大学 含四联苯衍生结构的聚酰亚胺、二胺单体及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS506279A (enExample) * 1973-05-18 1975-01-22

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5176078A (en) * 1974-12-23 1976-07-01 Hitachi Ltd Handaboshokumakuo hodokoshita handotaisochi
JPS5568659A (en) * 1978-11-20 1980-05-23 Hitachi Ltd Semiconductor device and manufacturing method thereof
JPS55156343A (en) * 1979-05-25 1980-12-05 Hitachi Ltd Manufacture of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS506279A (enExample) * 1973-05-18 1975-01-22

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60208358A (ja) * 1984-04-02 1985-10-19 Hitachi Ltd 複合体
JPS60221426A (ja) * 1984-04-17 1985-11-06 Hitachi Chem Co Ltd ポリイミド複合体の製造法
JPS60243120A (ja) * 1984-05-18 1985-12-03 Hitachi Ltd フレキシブルプリント基板の製造方法
JPS60245150A (ja) * 1984-05-21 1985-12-04 Hitachi Ltd 半導体装置
JPH01181430A (ja) * 1988-01-08 1989-07-19 Nissan Chem Ind Ltd 電気・電子デバイス用絶縁膜
US5272247A (en) * 1990-10-19 1993-12-21 Hitachi, Ltd. Polyimide precursor, cured product thereof, and processes for producing them
US5536584A (en) * 1992-01-31 1996-07-16 Hitachi, Ltd. Polyimide precursor, polyimide and metalization structure using said polyimide
JP2012164937A (ja) * 2011-02-09 2012-08-30 Fujitsu Ltd 半導体装置及びその製造方法、電源装置
CN105254886A (zh) * 2015-11-02 2016-01-20 株洲时代新材料科技股份有限公司 聚酰胺酸树脂组合物、热塑性聚酰亚胺薄膜及其制备方法
JP2018080315A (ja) * 2016-11-18 2018-05-24 宇部興産株式会社 ポリイミド、ポリイミド前駆体、及びポリイミドフィルム

Also Published As

Publication number Publication date
GB2098800A (en) 1982-11-24
DE3126361C2 (de) 1986-12-04
JPS628035B2 (enExample) 1987-02-20
GB2098800B (en) 1986-03-26
DE3126361A1 (de) 1982-11-25

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